• 전기의세계
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• v.30 no.1
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• pp.55-63
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• 1981

This paper deals with the drive contrl of common elevator systems which may be realized with .mu.p-controlled selective-collective elevator systems. Incorporation on non-contact point circuits instead of electromagnetic relays in such an elevator system results in miniaturization of complicated hardware controllers currently being used. The drive control method is implemented by software programming. The important features are not only technical advantages such as higher performance, high speed data processing and more improved reliability, but also lower cost as compared with the conventional elevator drive control units equipped with a number of sequential electromagnetic relays and even more recent static IC logic circuits.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.10 no.5
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• pp.680-687
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• 1999

An extensive study on miniaturized bandpass filter(BPF) appropriate for mobile communication systems is presented in this paper. The miniaturization has been accomplished by incorporating low-loss high-index materials inside a resonating cavity fabricated in silicon substrate using micromachining etching techniques. By use of materials with dielectric constant $\varepsilon_r$=500, filters with volume less than 0.11 $mm^3$ have been designed at the center frequency of 5.8 GHz with 3.3% bandwidth. The electrical performances and design tolerances of these filters for a variety of materials and shapes are discussed and design guidelines are presented herein.

• Journal of the Korean institute of surface engineering
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• v.36 no.2
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• pp.214-225
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• 2003

Trends in microelectronics packages such as low cost, miniaturization, high performance, and high reliability made area array interconnecting technologies including flip chip, CSP (Chip Scale Package) and BGA (Ball Grid Array) mainstream technologies. Underfill technology is used for the reliability of the area array technologies, thus electronics packaging industry regards it as very important technology In this paper, the underfill technology is reviewed and the recent advances in the underfill technology including new processes and materials are introduced. These includes reworkable underfills, no-flow underfills, molded underfills and wafer - level - applied underfills.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.324-328
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• 2005

스핀 밸스 트랜지스터를 소형화 할 수 있는 공정 기술을 소개한다. 스핀 밸브 트랜지스터는 두 개의 실리콘 에미터, 컬렉터 사이에 다층 자성 금속 박막이 존재하는 구조를 갖고 있는 스핀트로닉스 소자이다. SU8을 절연층으로 사용한 접촉 패드의 도입, 실리콘 온 인슐레이터의 사용, 그리고 이온빔/습식 복합에칭 공정의 적용으로 수 ${\mu}m$까지 소형화 할 수 있었다. 트랜지스터의 소형화에 따른 특성 변화는 관찰되지 않았으며, 기존의 트랜지스터와 동일한 $240\%$의 자기전류값을 나타내었다.

• Proceedings of the KSR Conference
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• 2003.10c
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• pp.568-573
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• 2003

This paper proposed to recognize and tracking the ID and location when a person and objects moved from indoor using RFID a type of passive tag. An antenna was installed in both sides of a door due to the limitation of a recognition distance. And frequency bandwidth was used to the 134.2kHz bandwidth to pass and bend several obstacles. Because a type of passive tag is a semi -permanent and miniaturization, it has applied to this paper.

• Journal of the Semiconductor & Display Technology
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• v.1 no.1
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• pp.41-45
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• 2002

In modem manufacturing, new applations and technologies demand smaller, and functional devices to replace large systems. As miniaturization becomes a necessity, many companies are interested in small pumps for use in creating ultra-high vacuum, but past efforts to develop such systems have failed due to problems with vibration, stress, heat and power consumption. This paper shows analysis-based design techniques for high vacuum turbomolecular pump by finite element analysis.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2004.03a
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• pp.617-621
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• 2004

Miniaturization of subsystems including propulsion systems is recent trends in spacecraft technology. Small space vehicle propulsion is not only a technological challenge of a scaling system down, but also a combination of fundamental flow/combustion constraints. In this paper, physical constraints of micronozzle for cold gas micro-thruster are reviewed and discussed. Method to measure small thrust are also described.

• Proceedings of the Korean Institute of Communication Sciences Conference
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• 2004.07a
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• pp.303-303
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• 2004

• Journal of the Optical Society of Korea
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• v.7 no.1
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• pp.1-6
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• 2003

Integration and miniaturization at the systems level are key requirements for photonics applications. Here, we describe the concept of planar integration of free-space optical systems and its use as an optical interconnection technology. Two specific applications will be considered, a parallel chip-to-chip interconnect and an optical clock distribution network.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.05a
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• pp.685-688
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• 2008

Planar antennas are very efficient for the use of the out-door data transmission applications due to their low-profile characteristics. But the size of the antenna in UHF band blocks the practical usage. In this paper, a miniaturized planar antenna is investigated for the application of AMR system in UHF band. The designed antenna is fabricated in the form of the microstrip patch on the FR-4 substrate. The miniaturization is achieved by slot-loading on the patch. First, effects of simple slots on the size reduction are analyzed, followed by the design using more complex slots resulting in the reduction ratio of 37.9% in 425.6 MHz and bandwidth of 3.8 MHz. The effect of epoxy coating for the protection is also investigated.