• 기계저널
• /
• 제41권2호
• /
• pp.54-57
• /
• 2001

• 한국생물공학회:학술대회논문집
• /
• 한국생물공학회 2003년도 생물공학의 동향(XIII)
• /
• pp.99-99
• /
• 2003

• 제어로봇시스템학회지
• /
• 제8권4호
• /
• pp.25-33
• /
• 2002

• 정보처리학회지
• /
• 제12권5호
• /
• pp.6-10
• /
• 2005

• 한국방송∙미디어공학회:학술대회논문집
• /
• 한국방송공학회 2002년도 방송기술 국제워크샵
• /
• pp.95-125
• /
• 2002

• 한국자기학회:학술대회 개요집
• /
• 한국자기학회 2004년도 하계학술연구발표회 논문개요집
• /
• pp.8-8
• /
• 2004

• 한국IT서비스학회:학술대회논문집
• /
• 한국IT서비스학회 2003년도 추계학술대회
• /
• pp.589-605
• /
• 2003

• 정보기술과데이타베이스저널
• /
• 제7권2호
• /
• pp.33-45
• /
• 2000

Uniview system is a client-server system that runs on heterogeneous distributed systems and supports the debugging of various kinds of programs. Its client system provides a unified debugging concept and interface on various debuggers of heterogeneous hosts. Its server system provides debugging services and features openness and scalability by interoperating with one or more debugger processes existing on the same host. Based on FSF(Free Software Foundation)'s gdb and Sun Microsystems's dbx. Uniview system supports C/C++ programming language in various UNIX environments as well as Windows environments. The proposed system was designed and implemented to support the JAVA language, which is prevalently used in recent heterogeneous distributed systems and was partly extended to make a clear analysis of JAVA class file structure. Sun Microsystems's Jdb supplied as a JAVA debugger has very limited functions compared to other programming language debugger. In this paper, Uniview as a JAVA debugging system was implemented to provide debugging technologies which are necessary to debug Java applications but missing in current JAVA language as well as to provide its users with various information.

• 가정과삶의질연구
• /
• 제26권5호
• /
• pp.211-224
• /
• 2008

The Ecological variables studied in relation to children's school adjustment were organisms(grade, sex, perceived competence, aggression and withdrawal), microsystems(parental support, marital conflict and supervision, peer victimization and perceived teacher attitude), mesosystems(family-peer relationships, family-school relationships) and the exosystem(neighborhood environment). The sample consisted of 565 fifth and sixth grade children. Instruments were the School Adjustment Scale and Index of organisms, microsystems, mesosystems, and exosystem variables. Statistics and methods used for the data analysis were Cronbach's alpha, frequency, percentage, Pearson's correlation and multiple regression. Several major results were found from the analysis. First, children's school adjustment showed positive correlations with perceived competence, parental support and supervision, perceived teacher attitude, family/peer and family/school relationships and neighborhood environment but showed negative correlations with grade, aggression, withdrawal and parental marital conflict and peer victimization. Second, the most important variable predicting child's relationship with teacher, his/her academic adjustment and satisfaction in schoolwas perceived teacher attitude. And the most important variable predicting children's peer relationships in school was perceived social competence.

• Journal of Electrical Engineering and Technology
• /
• 제10권3호
• /
• pp.1138-1143
• /
• 2015

Effects of fabrication process variations on impedance of microelectrodes integrated on a neural probe were examined through equivalent circuit modeling and SPICE simulation. Process variation and the corresponding range were estimated based on experimental data. The modeling results illustrate that the process variation induced by metal etching process was the dominant factor in impedance variation. We also demonstrate that the effect of process variation is frequency dependent. Another process variation that was examined in this work was the thickness variation induced by deposition process. The modeling results indicate that the effect of thickness variation on impedance is negligible. This work provides a means to predict the variations in impedance values of microelectrodes on neural probe due to different process variations.