• 제목/요약/키워드: micromachining technology

검색결과 232건 처리시간 0.021초

Epi poly를 이용한 MEMS 소자용 웨이퍼 단위의 진공 패키징에 대한 연구 (A Study on Wafer Level Vacuum Packaging using Epi poly for MEMS Applications)

  • 석선호;이병렬;전국진
    • 반도체디스플레이기술학회지
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    • 제1권1호
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    • pp.15-19
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    • 2002
  • A new vacuum packaging process in wafer level is developed for the surface micromachining devices using glass silicon anodic bonding technology. The inside pressure of the packaged device was measured indirectly by the quality factor of the mechanical resonator. The measured Q factor was about 5$\times10^4$ and the estimated inner pressure was about 1 mTorr. And it is also possible to change the inside pressure of the packaged devices from 2 Torr to 1 mTorr by varying the amount of the Ti gettering material. The long-term stability test is still on the way, but in initial characterization, the yield is about 80% and the vacuum degradation with time was not observed.

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표면 미세가공에서 Al 전극 및 Al 미세 구조물 제작을 위한 습식 식각 공정 (Wet Etch Process for the Fabrication of Al Electrodes and Al Microstructures in Surface Micromachining)

  • 김성운;백승준;이승기;조동일
    • 센서학회지
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    • 제9권3호
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    • pp.224-232
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    • 2000
  • 표면 미세가공 공정에서 Al 공정을 이용하면 Al 전극의 제작에 의해 접촉 저항이나 선 저항 등을 줄여 전기적인 신호 손실을 줄일 수 있고, 산화막을 희생층으로 사용하는 간단한 공정에 의해 Al 구조물 제작이 가능한 장점을 지닌다. 그러나 실제 공정에서는 Al 전극이나 Al 구조물이 희생층 제거 시에 사용되는 HF 용액에 의해서 부식되는 문제점이 있다. 이러한 문제점을 해결하기 위해 사용되는 희생층 식각액인 BHF/glycerine 혼합 용액에 대한 PSG와 Al의 기본적인 식각 특성은 표면 미세가공에서 발생하는 구조적인 제한 조건에 따라 상당히 달라진다. 본 논문에서는 이러한 희생층의 구조적 특성과 Al 박막의 증착 표면 거칠기의 변화로 인한 식각 특성의 변화를 고려하여 실제로 표면 미세가공에 적용 가능한 혼합 용액의 조건을 조사하였다. 희생층 식각 조건변화에 따른 BHF/glycerine 혼합용액의 최적 혼합비는 $NH_4F$:HF:glycerine=2:1:2에서 가장 좋은 식각 선택비를 보이는 것으로 나타났으며 이 실험 결과를 실제 Al 전극 제작에 적용한 결과 Al 패턴이 희생층 식각액에 대해서 우수한 내식성을 보였다. 또한 Al의 식각액에 대한 내식성을 향상시키기 위하여 CMP 공정을 도입하여 증착 표면을 개선시켰으며 이를 Al 구조물의 제작에 적용하여 식각 특성을 분석하였다. 이러한 분석을 통해 본 논문에서 제시한 식각 조건을 이용하면 Al 전극과 Al 구조물을 표준적인 표면 미세가공 공정을 통하여 간단하게 제작할 수 있다.

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개방형 우물 구조를 이용한 마이크로머신형 pH 센서 (Micromachined pH Sensor Using Open Well Structures)

  • 김흥락;김영덕;정우철;김광일;김동수
    • 비파괴검사학회지
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    • 제22권4호
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    • pp.347-353
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    • 2002
  • 수용액에 포함된 수소이온$(H^+)$의 농도를 측정하는 유리 전극형 수소이용 농도(pH) 센서의 기본 구조를 bulk micromachining 기술로 구현하여 소형의 pH 센서를 제작하였다. 박막 증착이 가능한 경사 식각으로 개방된 2개의 기본 구조물을 형성하고, 일정 전위를 유지하기 위한 기준전극은 식각된 구조물 경사면에 박막형 Ag/AgCl으로 확보하였다. $H^+$과 교환 반응으로 전위를 발생시키는 감응부는 Na이 20%이상 포함된 glass로 $100{\mu}m$ 내외로 미세 연마하여 기본 구조물에 접합하여 완성하였다. 또한 외부 용액과 기준 용액의 혼합을 방지하면서 전류 도통 역할을 하는 액간 접촉부는 $50{\mu}m{\times}50{\mu}m$ 크기의 Si 이방성 식각 부분에 한천을 삽입하고 난 다음 기존의 구조물에 접합하여 형성하였다. 각 구조물을 완성한 다음 2M 농도의 KCI 기준 용액을 구조물에 채우고, 상용 에폭시로 센서 구조물을 밀봉하여 센서를 완성하였다. 제작된 pH 센서들은 표준 pH 용액에 대하여 약 90mV/pH의 전위값이 측정되었다.

AFM기반 기계적 TNL 패터닝을 통한 PDMS 몰드제작 (Fabrication of PDMS Mold by AFM Based Mechanical TNL Patterning)

  • 정윤준;박정우
    • 한국생산제조학회지
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    • 제22권5호
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    • pp.831-836
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    • 2013
  • This study demonstrates the process of fabricating patterns using tribonanolithography (TNL),with laboratory-made micro polycrystalline diamond (PCD) tools that are attached to an atomic force microscope (AFM). The various patterns are easily fabricated using mechanical scratching, under various normal loads, using the PCD tool on single crystal silicon, which is the master mold for replication in this study. Then, polydimethylsiloxane (PDMS) replica molds are fabricated using precise pattern transfer processes. The transferred patterns show high dimensional accuracy as compared with those of TNL-processed silicon micro molds. TNL can reduce the need for high cost and complicated apparatuses required for conventional lithography methods. TNL shows great potential in that it allows for the rapid fabrication of duplicated patterns through simple mechanical micromachining on brittle sample surfaces.

벌크 마이크로 머시닝을 이용한 고감도 미세 칼로리미터의 설계 및 제작 (Design and fabrication of a highly sensitive microcalorimetric biosensor by bulk micromachining)

  • 윤승일;김정훈;곽봉섭;김용준;정효일
    • 센서학회지
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    • 제15권3호
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    • pp.164-167
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    • 2006
  • Calorimeter is one of widely used biosensors. Conventional or existing calorimeters are realized directly on a silicon wafer which has very high thermal conductivity. It results in decreasing temperature difference between junctions and it makes a sensitivity of calorimeter to be decreased. In this study, the microcalorimeter was made by using MEMS(Micro Electro Mechanical Systems)-technology and hot junctions of the microcalorimeter are released from a silicon substrate to reduce loss of generated heat by reactions between biomolecules. Sensitivity of the released microcalorimeter was 18 mV/M which is 1.5 times higher than another calorimeters on silicon substrate by reactions between biotin and streptavidin.

마이크로 플랜트 모듈 (Microplant Module)

  • 서정현;손정민;조준연;권영운;최재훈
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.211-215
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    • 2005
  • Microsystems combine several microcomponents, optimized an entire system, to provide several specific technical functions by the shape of the microstructure. Microfabrication and micromachining techniques have played the key role in the fast development and commercialization of microsystems. Microreaction technology based on microsystems is a powerful tool for the evaluating new process and reaction pathways in chemical engineering. Because of the small characteristic dimensions of microreaction devices, mass and heat transfer processes are enhanced and, in addition, reaction conditions can be precisely controlled for optimizing yield and selectivity. The paper will report on the mixer design principle and explore several application fields of microreaction technology in the chemical synthesis

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유리-유리 정전접합을 이용한 FED스페이서 기술 개발 (Development of spacer technology using glass to glass anodic bonding for FED)

  • 김민수;박세광;문권진;김관수;우광제;정성재;이남양
    • 한국진공학회지
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    • 제8권4A호
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    • pp.465-469
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    • 1999
  • In this paper, spacer process for FED (Field Emission Display ) was developed with the glass to glass anodic bonding technology using Al film as an interlayer. Characteristics, current density-time curves and force of the anodic boding were measured on various thickness of Al film; 1000$\AA$, 2000$\AA$, 3000$\AA$, 4000$\AA$ and 500$\AA$. Holders for spacer were fabricated with photosensitive glass and (110) Si wafer by bulk micromachining. Spacers was formed on glass substrate by spacer glass to glass anodic bonding and an evacuated panel was fabricated to prove the potential of application for FED.

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Powder Blasting을 이용한 도광판의 Micro-Pattern 가공기술 (Machining Technology of Micro-Patterns in LGP by Powder Blasting)

  • 박동삼;성은제;한진용;유우식
    • 소성∙가공
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    • 제15권9호
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    • pp.686-691
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    • 2006
  • Powder blasting technique was introduced to micromachine the micro patterns of circular and rectangular shape in LGP mould. The machinability of these patterns and matt treatment by powder blasting were verified. Then a prototype of LGP was injected by the developed LGP mould with micro patterns. Shape analysis of micro patterns and performance test of the injected LGP were carried out. The results showed printless LGP with micro patterns could be produced by just single injection using the mould with micro patterns, and powder blasting technique could be successfully applied to micrornachining of micro patterns and matt treatment of LGP mould.

Vertical Integration of MM-wave MMIC's and MEMS Antennas

  • Kwon, Young-Woo;Kim, Yong-Kweon;Lee, Sang-Hyo;Kim, Jung-Mu
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제6권3호
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    • pp.169-174
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    • 2006
  • In this work, we demonstrate a novel compact mechanical beam steering transmitter based on a direct vertical integration of a 2-D MEMS-based mechanical beam steering antenna with a VCO on a single silicon platform. By eliminating the long feed lines and waveguide metal blocks, the radiation pattern has been improved vastly, resulting in an almost ideal pattern at every scan angle. The losses incurred by the feed lines and phase shifters are also eliminated, which allows the transmitter to be implemented using only a single VCO. The system complexity has been greatly reduced with a total module size of only 1.5 cm ${\times}$ 1.5 cm ${\times}$ 0.4 cm. This work demonstrates that RF MEMS can be a key enabling technology for high-level integration.