• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.604-607
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• 2005

In the electro-discharge machining the machining performance is closely related to the characteristics of discharge which can be identified from electrical behavior in gap between workpiece and electrode. Therefore, the accurate prediction of electrical behavior in electro-discharge machining (EDM) is useful to process control and optimization. However, any simulation model fur prediction of electrical behavior in EDM process has never been reported until now. In this study, a simulation model is developed to analyze the electrical behavior of electro-discharge plasma which significantly influences electrical behavior in EDM process. For the purpose of this the fundamentals of electro-discharge mechanism such as inception, propagation, formation of plasma channel and termination are investigated to accurately predict the cycle of discharge plasma in EDM. As a result, a mathematical model of electro-discharge plasma is constructed with considering the fundamentals of electro-discharge plasma. Consequently, it is demonstrated that the developed model can predict the electrical behavior of plasma such as electron density in various conditions.

• Laser Solutions
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• v.18 no.1
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• pp.18-22
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• 2015

In this paper, controlling shape of optical fiber tip for endoscope was investigated for eliminating blind spot. The blind spot of endoscope is generated by divergence angle of optical fiber, so it is easy to generate blind spot when tightly focusing. In order to eliminate this region, fiber tip is necessary to be controlled as convex or concave. Illumination simulation of convex and concave type of fiber tip in the endoscope was in progress, so the distance of non- blind region was investigated in each case. As well as the simulation, the tip was fabricated as concave shape by UV laser machining. Then the beam radiation was measured to observe the blind region. The result showed that controlling the fiber tip as convex or concave shape makes the narrow blind region of illumination in endoscope.

• Laser Solutions
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• v.11 no.2
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• pp.26-32
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• 2008

Micro lens array (MLA) is widely used in information technology (IT) industry fields, for examples such as a projection display, an optical power regulator, a micro mass spectrometer and for medical appliances. Recently, MLA have been fabricated and developed by using a reflow method, micro etching, electroplating, micromachining and laser local heating. Laser local thermal-expansion (LLTE) technology demonstrates the formation of microdots on the surface of polymer substrate, in this paper. We have also investigated the new direct fabrication method of placing the MLA on the surface of a SU-8 photoresist layer. We have obtained the 3D shape of the micro lens processed by UV laser irradiation and have experimentally verified the optimal process conditions.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.477-482
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• 2006

In this study, a micro vapor compressor has been designed, fabricated and tested. The micro vapor compressor was made of silicon substrates and fabricated by micromachining process. The compressor is driven by a piezoelectric actuator which is widely used in microfluidic systems because of its strong force and rapid response. The actuator is a bimorph structure which consists of a silicon membrane and a piezoelectric ceramic film. A simulation work was conducted on the performance characteristics of the compressor. The simulation investigated the flow rate variation under various back pressure conditions. Experimental works were carried out on the operation of a compressor and the test results were compared with the simulation results.

• Journal of Sensor Science and Technology
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• v.28 no.2
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• pp.127-132
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• 2019

In this study, the fabrication of through-silicon vias (TSVs) filled with SWNTs/Sn by utilizing surface/bulk micromachining and MEMS technologies is proposed. Tin (Sn) and single-walled nanotube (SWNT) powders are used as TSV interconnector materials in the development of a novel TSV at low temperature. The measured resistance of a TSV filled with SWNT/Sn powder is considerably reduced by increasing the fraction of Sn and is lower than that of a TSV filled with only Sn. This is because of a decrease in the surface scattering of electrons along with an increase in the grain size of sintered SWNTs/Sn. The proposed method is conducted at low temperatures (< $400^{\circ}C$) due to the low melting temperature of Sn; hence, the proposed TSVs filled with SWNTs/Sn can be utilized in CMOS based applications.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.2
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• pp.123-129
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• 2022

Quartz (SiO2) has high abrasion and heat resistances and excellent chemical and mechanical properties; therefore, it is used in various industries, such as machinery, chemistry, optics, and medicine. Quartz is a high-hardness and brittle material and is classified as the topmost difficult-to-cut material, which is because of the cracking or chipping at the edge during processing. Corner wear, such as cracks and chippings that occur during cutting, is a major cause for the deterioration in the machining quality. Therefore, many researchers are investigating various techniques to process quartz effectively. However, owing to the mechanical properties of quartz, most studies have been conducted on grinding, micromachining, and microdrilling. Few studies have been conducted on quartz processing. The purpose of this study was to analyze the machining characteristics according to the machining factors during the slot machining of quartz using a cubic boron nitride (CBN) tool and to select the optimal machining conditions using the Taguchi method. The machining experiment was performed considering three process variables: the spindle speed, feed rate, and depth of cut. The cutting force and surface roughness were analyzed according to the processing conditions.

• Journal of Sensor Science and Technology
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• v.32 no.5
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• pp.295-299
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• 2023

Herein, we propose a simple fabrication method for MXene-coated V-groove sensors for applications. To enhance the sensitivity of this sensor, we applied MXene particles, instead of conventional metal layers, as a sensing material on the sensor's surface. This allows for an easier fabrication, as well as higher sensitivity of the sensor compared to those of our previously demonstrated metal-based V-groove sensor. Additionally, polyurethane-acrylate, a UV-curable liquid polymer, can be easily applied using micro-electromechanical systems-based surface-texture micromachining. The sensor sensitivity is approximately 0.08 /mm, and it can be improved by increasing the number of V-grooves. We believe that the proposed MXene-based wearable sensor offers a great potential in detecting various types of motions characteristic of human activities.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.4
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• pp.300-306
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• 2004

This paper reports a novel tunable bandpass filter using two-state switched inductor with direct-contact MEMS switches for wireless LAN applications. In our filter configuration, the switched inductor is implemented to obtain more stable and much larger frequency tuning ratio compared with variable capacitor-based tunable filter. The proposed tunable filter was fabricated using a micromachining technology and electrical performances of the fabricated filter were measured. The filter consists of spiral inductors, MIM capacitors and direct-contact type MEMS switches, and its frequency tunability is achieved by changing the inductance that is induced by ON/OFF actuations of the MEMS switches. The actuation voltage of the MEMS switches was measured of 58 V, and they showed the insertion loss of 0.1 dB and isolation of 26.3 dB at 2 GHz, respectively. The measured center frequencies of the fabricated filter were 2.55 GHz and 5.1 GHz, respectively. The passband insertion loss and 3-dB bandwidth were 4.2 dB and 22.5 % at 2.55 GHz, and 5.2 dB and 23.5 % at 5.1 GHz, respectively.

• Journal of Sensor Science and Technology
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• v.6 no.1
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• pp.72-80
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• 1997

One of the concerns in micro fluidic valve designs is that of reverse direction leakage. This paper designs and fabricates a new fluidic valve to achieve zero leakage. The design uses flapper and nozzle elements. In the forward direction the working fluid pushes the flapper upward to allow flow. In the reverse direction, the flapper pushes against the orifice seat, and thus, no flow can be generated, unless the flapper or nozzle element breaks. The nozzle element fabrication involves fabricating an orifice by wet etching of (100) wafer, The flapper element fabrication involves $20{\mu}m$ deep patterning of the negative image of the flapper, followed by wet etching from backside. Flow experiments were conducted with DI water as the working fluid, and the results are compared to analytical predictions. The results show that the developed flapper-nozzle valve achieves a true diodic flow characteristic.

• Journal of the Korean institute of surface engineering
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• v.46 no.3
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• pp.99-104
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• 2013

The simple and cost-effective microfabrication method of photosensitive glass (PSG) using metal patterning and blank exposure was proposed. Conventional photolithography for micromachining of PSG needs a costly quartz mask which has high transmittance as an optical property. However, in this study the process was improved through the combination of micro-patterned Ti thin film and blank UV exposure without quartz mask. The effect of UV exposure time as well as the DHF etching condition was investigated. UV exposure test was performed within the range from 3 min to 9 min. The color and etch result of PSG exposed for 5 min were the most clear and effective to etch more precisely, respectively. The etching results of PSG in diluted hydrofluoric acid (DHF) with a concentration of 5, 10, 15 vol% were compared. The effect on the side etch was insignificant while the etch rate was proportional as the concentration increased. 10 vol% DHF results not only high etch rate of 75 ${\mu}m/min$ also lower side etch value after PSG etching. This method facilitates the microfabrication of PSG with various patterns and high aspect ratio for applying to advanced applications.