Trend in Camera Module Technology for Mobile Phone

• Yoon, Young-Kwon
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2006.10a
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  • pp.1-20
  • /
  • 2006
• PDF

Modeling and Simulation of Reconfigurable RF System-in-Package

• Lee, Seung-Jae
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2006.10a
  • /
  • pp.317-336
  • /
  • 2006
• PDF

플립칩(Flip Chip) 기술개요 및 시장전망

• Hwang, Kay S.
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2001.07a
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  • pp.1-20
  • /
  • 2001
• PDF

Optical Device Packaging (광통신용 소자의 패키징)

• 주관종
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2001.07a
  • /
  • pp.21-40
  • /
  • 2001
• PDF

ISO 9000 2000년판 발행과 최근동향

• 박대호
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2001.07a
  • /
  • pp.41-50
  • /
  • 2001
• PDF

Mobile LCD 멀티디스플레이 방식과 모듈 최적화 설계방식

• 장윤석
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2001.07a
  • /
  • pp.51-62
  • /
  • 2001
• PDF

세라믹 RF부품의 모듈화 동향

• 강남기
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2001.11a
  • /
  • pp.1-19
  • /
  • 2001
• PDF

Solder Bump Formation for Flip Chip Application Using Stencil Printing (스텐실 프린팅을 이용한 플립칩용 솔더범프 형성공정)

• 김경만;김영호
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2001.11a
  • /
  • pp.115-118
  • /
  • 2001
• PDF

Optimization of Chip Stack in 3D Packaging

• Hara Kazumi
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2005.09a
  • /
  • pp.51-65
  • /
  • 2005
• PDF

Packaging Technologies for Semiconductor Memories

• Kasai Junichi
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2005.09a
  • /
  • pp.131-144
  • /
  • 2005
• PDF

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