• 한국재료학회지
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• 제9권6호
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• pp.569-576
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• 1999

In this study, the effect of the microstructural evolution on the electrical of Cu-Ag microcomposite was investigated. The nature of interfaces between silver filaments and Cu matrix may have pronounced effects on the physical properties of Cu-Ag filamentary microcomposites, little is known about these interfaces. In heavily drawn Cu-Ag filamentary microcomposities, the microstructure is too fine and the interfacial area is too large to maintsin a stable internal dislocation structure because of closely spaced filaments. Rather, most dislocations are thought to be gradually absorbed at the interfaces as the draw ratio increases. The mechanical and electrical properties of Cu-Ag filamentary microcomposites wires were also examined and correlated with the microstructural change caused by thermomechanical treatments. The study on the electrical conductivity combined to resistivity in Cu-Ag filamentary microcomposites and the rapid increase of the electrical conductivity at high annealing temperatures is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities at 295K($\rho$\ulcorner/$\rho$\ulcorner) in as-drawn Cu-Ag microcomposites can also be explained by the contribution of the interface scattering.

• 한국재료학회지
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• 제11권2호
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• pp.115-119
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• 2001

다발체형성 제조기술을 이용하여 심하게 인발가공된 Cu-Nb 미세복합재료 전선의 전기적 특성과 열처리에 따른 미세조직 변화와의 관계에 대하여 연구하였다. 다발체형성과 인발공정에 의해 제조된 전선에서 Nb필라멘트 단면방향의 형태는 직선이거나 약간 굽은 형태로 나타났다 Nb필라멘트 형태의 차이는 고온에서의 다발체형성 제조공정중의 Nb필라멘트의 파손과 실린더화에 의해 발생하였다. Cu-Nb 미세복합재료의 비저항은 Cu-Nb 계면에서의 전자 산란에 의해 주로 결정된다. $400^{\circ}C$의 어닐링온도 이하에서 전도도의 감소는 침상형태 석출물의 정합변형율과 관계된 산란의 기여가 증가하기 때문이다. 비저항의 비 ($\rho_{295K}$/$\rho_{75K}$)의 약간의 감소는 또한 Nb원자의 석출 때문이다. 50$0^{\circ}C$의 어닐링온도에서 Cu-Nb 미세복합재료의 전도도 중가는 Nb필라멘트의 조대화와 구형화때문이다

• Transactions on Electrical and Electronic Materials
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• 제11권2호
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• pp.89-91
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• 2010

Partial discharge (PD) resistances were investigated for three types of samples: original epoxy resins, epoxy micro composites with and without the silane processing, and mixture composites with micro and nano particles. The PD was applied to these materials using rod, gap, and plane electrodes. The partial discharge resistance found in the micro composites was better than that found in the original epoxy resin. Moreover, the mixture composites of $SiO_2$ nano and micro particles had much larger resistances than the original epoxy resin or microcomposites. It can be regarded that this excellent property was due to the fact that the nano particles have a dense structure between the micro particles.

• 전기학회논문지
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• 제62권5호
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• pp.649-656
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• 2013

A conventional epoxy-microsilica composite (EMC) and an epoxy-microsilica-nanosilicate composite (EMNC) were prepared in order to apply them to mold-type transformers, current transformers (CT) and potential transformers (PT). Nanosilicate was exfoliated in a epoxy resin using our electric field dispersion process and AC insulation breakdown strength at $30{\sim}150^{\circ}C$, glass transition temperature and viscoelasticity were studied. AC insulation breakdown strength of EMNC was higher than that of EMC and that value of EMNC was far higher at high temperature. Glass transition temperature and viscoelasticity property of EMNC was higher than those of EMC at high temperature. These results was due to the even dispersion of nanosilicates among the nanosilicas, which could be observed using transmission electron microscopy (TEM). That is, the nanosilicates interrupt the electron transfer and restrict the mobility of the epoxy chains.

• Transactions on Electrical and Electronic Materials
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• 제12권3호
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• pp.98-101
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• 2011

A 10 nm nano-silica was introduced to a conventional 3 ${\mu}M$ micro-silica composite to develop an eco-friendly new electric insulation material for heavy electric equipment. Thermal and mechanical properties, such as glass transition temperature (Tg), dynamic mechanical analysis, tensile and flexural strength, were studied. The mechanical results were estimated by comparing scale and shape parameters in Weibull statistical analysis. The thermal and mechanical properties of conventional epoxy/micro-silica composite were improved by the addition of nano-silica. This was due to the increment of the compaction via the even dispersion of the nano-silica among the micro-silica particles.

• 전기학회논문지
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• 제65권6호
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• pp.1026-1031
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• 2016

Neat Epoxy, nano alumina composites, micro alumina composites and multi-nano alumina composites were prepared and experiment were performed to measure their partial discharge resistant characteristics. The partial discharge resistance obtained for the microcomposites, nanocomposites and multi-nanocomposites are compared with those of unfilled epoxy and with GDE amount for surface modifier. It was observed that compare multi-nano alumina composites to micro alumina composites, the partial discharge resistance to degradation gets improved considerably. The improvement in the degradation resistance is attributed to the interface intension between the nano alumina composites and GDE, micro alumina and epoxy neat.

• 한국분말재료학회지
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• 제8권3호
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• pp.174-178
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• 2001

The microstructure and mechanical properties of $Si_3N_4/BN $nanocomposites synthesized by chemical processing were investigated. The nanocomposites containing 15 vol% hexagonal BN (h-BN) were fabricated by hot-pressing $\alpha-Si_3N_4$powders covered with turbostratic BN (t-BN). The t-BN coating on $\alpha-Si_3N_4$particles was prepared by heating $\alpha-Si_3N_4$ particles covered with a mixture of boric acid and urea in hydrogen gas. TEM observations of this nanocomposite revealed that nano-sized h-BN particles were homogeneously dispersed within $Si_3N_4$grains as well as at grain boundaries. The strength and thermal shock resistance were significantly improved in comparison with the $Si_3N_4/BN$ microcomposites.

• Transactions on Electrical and Electronic Materials
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• 제11권2호
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• pp.69-72
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• 2010

This study investigates the thermal and mechanical properties of insulation elements through the mixing of epoxy based micro and nano particles. Regarding their thermal properties, differential scanning calorimeter and dynamic mechanical analyser were used to calculate the cross-linking densities for various types of insulation elements. The mechanical properties of the bending strength, the shape and scale parameters, were obtained using the Weibull plot. This study obtained the best results in the scale parameters, at 0.5 phr, for the bending strength of the epoxy nano-and-micro mixture composites.

• Transactions on Electrical and Electronic Materials
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• 제16권2호
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• pp.82-85
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• 2015

Mechanical and electrical properties of epoxy/silica microcomposites were investigated. The cycloaliphatic- type epoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and the curing agent was of an anhydride type. To measure the glass transition temperature (Tg), dynamic differential scanning calorimetry (DSC) analysis was carried out, and tensile and flexural tests were performed using a universal testing machine (UTM). Electrical breakdown strength, the most important property for electrical insulation materials, and insulation breakdown strength were also tested. The microcomposite with 60 wt% microsilica showed maximum values in mechanical and electrical properties.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.220-222
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• 2004

Feasibility of BaO-ZnO-$B_2O_3$ (BZB) based glass system in the light of dielectric and thermal expansion properties are reported in the literature. Effects of addition of various types of ceramic fillers to the BZB-based glass on the thermochemical stability and mechanical properties were investigated in the present work. The studied filler-glass system demonstrated a capability to host various types of ceramic fillers to form thermochemically stable microcomposites at the processing temperature suitable for PDP systems. At the same time, mechanical strength of the filler-glass composites was much improved as compared to the glass itself These observations brighten the feasibility of the Pb-free BZB-based glass system as a host to employ various types of crystalline ceramic fillers so that it can be applied to barrier rib material in plasma display panels.