• Korean Journal of Materials Research
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• v.9 no.6
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• pp.569-576
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• 1999

In this study, the effect of the microstructural evolution on the electrical of Cu-Ag microcomposite was investigated. The nature of interfaces between silver filaments and Cu matrix may have pronounced effects on the physical properties of Cu-Ag filamentary microcomposites, little is known about these interfaces. In heavily drawn Cu-Ag filamentary microcomposities, the microstructure is too fine and the interfacial area is too large to maintsin a stable internal dislocation structure because of closely spaced filaments. Rather, most dislocations are thought to be gradually absorbed at the interfaces as the draw ratio increases. The mechanical and electrical properties of Cu-Ag filamentary microcomposites wires were also examined and correlated with the microstructural change caused by thermomechanical treatments. The study on the electrical conductivity combined to resistivity in Cu-Ag filamentary microcomposites and the rapid increase of the electrical conductivity at high annealing temperatures is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities at 295K($\rho$\ulcorner/$\rho$\ulcorner) in as-drawn Cu-Ag microcomposites can also be explained by the contribution of the interface scattering.

• Korean Journal of Materials Research
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• v.11 no.2
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• pp.115-119
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• 2001

The electrical properties of heavily drawn bundled Cu- Nb filamentary microcomposite wires were examined and correlated with the microstructural changes caused by thermomechanical treatments. The cross sectional shape of Nb filaments in wires fabricated by bundling and drawing appear straight or slightly curved. The different shape of Nb filaments is attributed to the break- up and cylinderization of Nb filaments during the bundling process at high temperatures. The resistivity of Cu-Nb microcomposites is predominantly controlled by electron scattering at Cu-Nb interfaces. The decrease of the conductivity below the annealing temperature of $400^{\circ}C$ is due to the increasing contribution of the scattering associated with coherency strains of needle- shaped precipitates. The slight decrease of the resistivity ratio (${\rho}_{295K}/{\rho}_{75K}$) is also due to the precipitation of Nb atoms. The increase in conductivity in Cu-Nb microcomposites at an annealing temperature of 50$0^{\circ}C$ is due to the coarsening and spheroidization of Nb filaments.

• Transactions on Electrical and Electronic Materials
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• v.11 no.2
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• pp.89-91
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• 2010

Partial discharge (PD) resistances were investigated for three types of samples: original epoxy resins, epoxy micro composites with and without the silane processing, and mixture composites with micro and nano particles. The PD was applied to these materials using rod, gap, and plane electrodes. The partial discharge resistance found in the micro composites was better than that found in the original epoxy resin. Moreover, the mixture composites of $SiO_2$ nano and micro particles had much larger resistances than the original epoxy resin or microcomposites. It can be regarded that this excellent property was due to the fact that the nano particles have a dense structure between the micro particles.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.5
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• pp.649-656
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• 2013

A conventional epoxy-microsilica composite (EMC) and an epoxy-microsilica-nanosilicate composite (EMNC) were prepared in order to apply them to mold-type transformers, current transformers (CT) and potential transformers (PT). Nanosilicate was exfoliated in a epoxy resin using our electric field dispersion process and AC insulation breakdown strength at $30{\sim}150^{\circ}C$, glass transition temperature and viscoelasticity were studied. AC insulation breakdown strength of EMNC was higher than that of EMC and that value of EMNC was far higher at high temperature. Glass transition temperature and viscoelasticity property of EMNC was higher than those of EMC at high temperature. These results was due to the even dispersion of nanosilicates among the nanosilicas, which could be observed using transmission electron microscopy (TEM). That is, the nanosilicates interrupt the electron transfer and restrict the mobility of the epoxy chains.

• Transactions on Electrical and Electronic Materials
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• v.12 no.3
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• pp.98-101
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• 2011

A 10 nm nano-silica was introduced to a conventional 3 ${\mu}M$ micro-silica composite to develop an eco-friendly new electric insulation material for heavy electric equipment. Thermal and mechanical properties, such as glass transition temperature (Tg), dynamic mechanical analysis, tensile and flexural strength, were studied. The mechanical results were estimated by comparing scale and shape parameters in Weibull statistical analysis. The thermal and mechanical properties of conventional epoxy/micro-silica composite were improved by the addition of nano-silica. This was due to the increment of the compaction via the even dispersion of the nano-silica among the micro-silica particles.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.6
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• pp.1026-1031
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• 2016

Neat Epoxy, nano alumina composites, micro alumina composites and multi-nano alumina composites were prepared and experiment were performed to measure their partial discharge resistant characteristics. The partial discharge resistance obtained for the microcomposites, nanocomposites and multi-nanocomposites are compared with those of unfilled epoxy and with GDE amount for surface modifier. It was observed that compare multi-nano alumina composites to micro alumina composites, the partial discharge resistance to degradation gets improved considerably. The improvement in the degradation resistance is attributed to the interface intension between the nano alumina composites and GDE, micro alumina and epoxy neat.

• Journal of Powder Materials
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• v.8 no.3
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• pp.174-178
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• 2001

The microstructure and mechanical properties of $Si_3N_4/BN $nanocomposites synthesized by chemical processing were investigated. The nanocomposites containing 15 vol% hexagonal BN (h-BN) were fabricated by hot-pressing $\alpha-Si_3N_4$powders covered with turbostratic BN (t-BN). The t-BN coating on $\alpha-Si_3N_4$particles was prepared by heating $\alpha-Si_3N_4$ particles covered with a mixture of boric acid and urea in hydrogen gas. TEM observations of this nanocomposite revealed that nano-sized h-BN particles were homogeneously dispersed within $Si_3N_4$grains as well as at grain boundaries. The strength and thermal shock resistance were significantly improved in comparison with the $Si_3N_4/BN$ microcomposites.

• Transactions on Electrical and Electronic Materials
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• v.11 no.2
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• pp.69-72
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• 2010

This study investigates the thermal and mechanical properties of insulation elements through the mixing of epoxy based micro and nano particles. Regarding their thermal properties, differential scanning calorimeter and dynamic mechanical analyser were used to calculate the cross-linking densities for various types of insulation elements. The mechanical properties of the bending strength, the shape and scale parameters, were obtained using the Weibull plot. This study obtained the best results in the scale parameters, at 0.5 phr, for the bending strength of the epoxy nano-and-micro mixture composites.

• Transactions on Electrical and Electronic Materials
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• v.16 no.2
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• pp.82-85
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• 2015

Mechanical and electrical properties of epoxy/silica microcomposites were investigated. The cycloaliphatic- type epoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and the curing agent was of an anhydride type. To measure the glass transition temperature (Tg), dynamic differential scanning calorimetry (DSC) analysis was carried out, and tensile and flexural tests were performed using a universal testing machine (UTM). Electrical breakdown strength, the most important property for electrical insulation materials, and insulation breakdown strength were also tested. The microcomposite with 60 wt% microsilica showed maximum values in mechanical and electrical properties.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.220-222
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• 2004

Feasibility of BaO-ZnO-$B_2O_3$ (BZB) based glass system in the light of dielectric and thermal expansion properties are reported in the literature. Effects of addition of various types of ceramic fillers to the BZB-based glass on the thermochemical stability and mechanical properties were investigated in the present work. The studied filler-glass system demonstrated a capability to host various types of ceramic fillers to form thermochemically stable microcomposites at the processing temperature suitable for PDP systems. At the same time, mechanical strength of the filler-glass composites was much improved as compared to the glass itself These observations brighten the feasibility of the Pb-free BZB-based glass system as a host to employ various types of crystalline ceramic fillers so that it can be applied to barrier rib material in plasma display panels.