• Electronics and Telecommunications Trends
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• v.37 no.2
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• pp.53-61
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• 2022

MicroLEDs have various advantages and application areas and are in the spotlight as next-generation displays. Nevertheless, the commercialization of microLEDs is slow because of high cost as well as difficulties in the transfer, bonding, and bad pixel repairing process. In this study, we review the development trends of transfer, bonding, and defective pixel repair technologies, which are critical for microLED commercialization, focusing on materials that determine these technologies. In addition, we focus on the simultaneous transfer bonding technology developed by the Electronics and Telecommunications Research Institute, which has been attracting enormous research attention recently.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.271-272
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• 2012

• Proceedings of the Korea Information Processing Society Conference
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• 2017.04a
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• pp.395-398
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• 2017

최근 국내외에서 창의인재 양성을 위한 컴퓨터과학 교육을 강화하고 있다. 현재 대부분의 프로그래밍 언어는 국내 초보자들이 배우기에 여러 가지 진입 장벽이 존재한다. 그 중 대표적인 이유는 쉽게 흥미를 갖지 못한다는 것이다. micro:bit는 소프트웨어 교육을 위해 영국에서 2015년 개발한 ARM 기반의 임베디드 시스템이다. 내장된 LED 출력 등 다양한 기능과 개발 방식을 지원하여 프로그래밍을 배우는 초보자들의 흥미를 유발시키기 충분하다. 하지만 영어와 숫자만 LED에 출력되며 개발도구에서 한글 메뉴를 지원하지 않아서 국내 학생들이 사용하기에 매우 불편하다. 본 논문에서는 이를 해소하기 위해 micro:bit의 한글 LED 출력과 한글 프로그래밍 환경을 구성하였다. 테스트 결과 정상적으로 한글 프로그래밍 환경이 동작하며 한글 LED 출력이 수행됨을 확인하였다.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.6
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• pp.8-13
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• 2015

Recently, Illumination industry of LED module has been focused to industry technology for energy conservation of nation. The LED device is excellent to power efficiency due to semiconductor light source element. And the application to the lighting circuit technology can be designed to the sensitive lighting system for human sensitivity control. In this paper, as a process for analyzing the operating temperature of standardized electronic device including LED device has analyzed about fusing character with in designed micro fuse for electronic device protection from the over current. Using the de-rating technique, which is performed to micro fuse fusing test in the range of $-30^{\circ}C{\sim}120^{\circ}C$ thermostatic chamber. To the output data in each temperature zone, it is performed to first-order linear fitting. Additionally, applying the resistance temperature coefficient and statistical data for the reliable analysis has derived to the metal element resistance of micro fuse with temperature change of the thermostatic chamber. As a research result, The changed temperature effect of thermostatic chamber was confirmed regarding fusing time change.

• Journal of Satellite, Information and Communications
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• v.7 no.2
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• pp.54-58
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• 2012

In this paper, we implemented total monitoring system in which LED light turned on only when user detected and LED light turned out only when user disappeared. This system is composed of two modules, one is HW board based on Micro Controller and the other is SW control system based on Web server. Micro controller board is based on ATMega2560 chip which is connected with Infra Red and Ultra sonic sensors. Web based monitoring system was designed can be used in smart device. The validity of this monitoring system was proved by integration test of two modules.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.321-321
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• 2014

GaN는 LED, 태양전지, 그리고 전자소자 등에 쓰이는 물질로, 관련 연구가 활발히 진행되고 있으며, 이와 더불어 top-down방식을 활용한 소자제작 방법 또한 발달되고 있다. 하지만, top-down공정 시 발생 되는 건식 식각에 의한 소자의 손상이 발생되고, 이로 인하여 누설전류가 발생하는 등 여러 가지 문제점이 발생하고 있다. 특히, top-down에서 널리 사용하는 건식식각을 통한 GaN 식각의 경우, nonpolar 면이 아닌, semipolar 면이 드러나게 되며, 이 면은 건식 식각시 발생하는 손상을 포함하고 있다. 본 연구에서는 이러한 문제를 해결하기 위해서, 약 $2{\mu}m$ 크기의 diameter를 갖는 micro-sized column LED를 제작하고, 건식 식각 이후, KOH surface treatment를 통해 손상된 면을 제거함과 동시에 nonpolar면을 드러내는 실험을 실시하였으며, 더불어 column의 diameter를 줄이는 방법을 논하고자 한다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.395-395
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• 2013

GaN는 LED, 태양전지, 그리고 전자소자 등에 쓰이는 물질로, 관련 연구가 활발히 진행되고 있으며, 이와 더불어 top-down방식을 활용한 소자제작 방법 또한 발달되고 있다. 하지만, 일반적으로 LED 제작에 사용되는 c-plane GaN의 경우, c축 방향으로 발생하는 분극의 영향을 받게되며, 분극은 LED내 양자우물의 밴드를 기울게 하여 전자와 홀의 재결합률을 감소시켜 낮은 내부양자효율을 야기한다. 이러한 문제를 해결하기 위해 여러 가지 방법들이 제시되었으며, 그 중에서도 a면, 혹은 m면과 같은 nonpolar면을 사용하는 GaN LED가 주목받고 있다. 본 연구에서는, top-down방식을 통해 약 $2{\mu}m$ 크기의 diameter를 갖는 micro-sized column LED를 구현하였으며, 식각 후 드러나는 semipolar면을 wet treatment를 통해 제거하여 nonpolar면을 드러나게 하였으며, 이 면에 Ni/Au를 contact하여, 전기적, 광학적 특성을 논하였다. Fig. 1은 I-V 특성 그래프이며, Fig. 2는 EL측정 결과(광학적 특성)이다.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.55-59
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• 2017

An optical method to inspect the 3-D shape of surface of Micro BGA is proposed, where spatially arranged LED light sources and specular reflection are considered. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED's in the image. Also, the statistics for all BGA's contained in a captured image are used together to find out the criteria for the detection of existing defects, and the usefulness of the proposed method is shown via experiments.

• Journal of the Semiconductor & Display Technology
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• v.20 no.3
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• pp.32-38
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• 2021

We developed an inductively coupled plasma (ICP) etcher for GaN etching using a parallel plasma electrode source with a multifunctional chuck matched to it in order for the low power consumption and low process cost in comparison with the conventional ICP system with a helical-type plasma electrode source. The optimization process condition using it for the micro light-emitting diode (µ-LED) chip fabrication was established, which is an ICP RF power of 300 W, a chuck power of 200 W, a BCl₃/Cl₂ gas ratio of 3:2. Under this condition, the mesa structure with the etch depth over 1 ㎛ and the etch angle over 75° and also with no etching residue was obtained for the µ-LED chip. The developed ICP showed the improved values on the process pressure, the etch selectivity, the etch depth uniformity, the etch angle profile and the substrate temperature uniformity in comparison with the commercial ICP. The µ-LED chip fabricated using the developed ICP showed the similar or improved characteristics in the L-I-V measurements compared with the one fabricated using the conventional ICP method

• Journal of Broadcast Engineering
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• v.21 no.5
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• pp.816-823
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• 2016

This paper studies a light emitting diode(LED) overlapping method of a head-up display that consists of a digital micro device(DMD) panel and a red, green, blue LED in order to increase the brightness of display system and optical output power. This optimization overlapping method removes a quantization noise which occur due to LED overlapping too excessive and stabilizes the junction temperature of LED. In order to reduce junction temperature of LED, the a correlation between a green duty and LED overlapping ratio is studied. Throughout this study, the brightness of head-up display exhibited high increasement ratio of luminance around 33.3 percent at 39 percent overlapping method.