• Transactions of Materials Processing
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• v.18 no.2
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• pp.166-171
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• 2009

In this paper, a basic study on micro cutting process with SM20C at low temperature environment was performed. In macro cutting fields, the cryogenic cutting process has been applied to cut the refractory metal but, the serious problem may be generated in micro cutting fields by the cryogenic environment. However, if the proper low temperature is applied to micro cutting area, the cooling effect of cutting heat is expected. Such effect can make the reduction of tool wear and burr formation. For verifying this possibility, the micro cutting experiment at low temperature was performed and SEM images were analyzed.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.6 s.249
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• pp.531-537
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• 2006

A lever type $NO_2$ micro gas sensor was fabricated by MEMS technology. In order to heat up the gas sensing material to a target temperature, a micro heater was built on the gas sensor. The sensing material laid on the heater and electrodes and did not contact with the silicon base to minimize the heat loss to the silicon base. The electric power to heat up the gas sensor to a target temperature was measured. The temperature distribution of micro gas sensor was analyzed by a CFD program. The predicted electric power of micro heater to heat up the sensing material to the target temperature showed a good agreement with the measured data. The design of micro gas sensor could be modified to show more uniform temperature distribution and to consume less electric power by optimizing the layout of micro heater and electrodes.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.10
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• pp.128-139
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• 1998

In this paper, a finite element method for predicting the temperature and stress distributions in micro-machining is presented. The work material is oxygen-free-high-conductivity copper(OFHC copper) and its flow stress is taken as a function of strain, strain rate and temperature in order to reflect realistic behavior in machining process. From the simulation, a lot of information on the micro-machining process can be obtained; cutting force, cutting temperature, chip shape, distributions of temperature and stress, etc. The calculated cutting force was found to agree with the experiment result with the consideration of friction characteristics on chip-tool contact region. Because of considering the tool edge radius, this cutting model using the finite element method can analyze the micro-machining with the very small depth of cut, almost the same size of tool edge radius, and can observe the 'size effect' characteristic. Also the effects of temperature and friction on micro-machining were investigated.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1957-1962
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• 2008

As a field of MEMS, micro-heater fabricated by Au is being introduced and developed in recent years. Previous studies about thermal properties of various forms of micro-heater were not sufficient. In this work, numerical and experimental analysis of the heat generation and the temperature distribution of micro-heater packages for 8 different geometric cases were studied. We fabricated a micro-heater package with silicon wafer, on which Cr/Au layer was laminated before 8 geometric forms of micro-heater were patterned. In each cases, temperature distribution was measured with IR thermal camera. According to the experimental results, which show a good agreement with the results analyzed by CFD, it was found that at 0.5W, the temperature of micro-heater chip which contained $20000{\mu}m$-long, serpentine shaped micro-heater was elevated to a relatively high temperature of $78^{\circ}C$ Consequently, we proposed a geometry of micro-heater which has effective thermal characteristics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.113-113
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• 2009

This paper describes the characteristics of a poly 3C-SiC micro heater which was fabricated on $AlN(0.1{\mu}m)/3C-SiC(1.0{\mu}m)$ suspended membranes by surface micro- machining technology. The 3C-SiC and AlN thin films which have wide energy bandgap and very low lattice mismatch were used sensors for high temperature and voltage environments. The 3C-SiC thin film was used as micro heaters and temperature sensor materials simultaneously. The implemented 3C-SiC RTD (resistance of temperature detector) and the power consumption of micro heaters were measured and calculated. The TCR (thermal coefficient of the resistance) of 3C-SiC RTD is about -5200 $ppm/^{\circ}C$ within a temperature range from $25^{\circ}C$ to $50^{\circ}C$ and -1040 $ppm/^{\circ}C$ at $500^{\circ}C$. The micro heater generates the heat about $500^{\circ}C$ at 10.3 mW. Moreover, durability of 3C-SiC micro heaters in high voltages is better than pt micro heaters. A thermal distribution measured and simulated by IR thermovision and COMSOL is uniform on the membrane surface.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.5
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• pp.556-561
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• 2007

The rapid thermal response(RTR) molding is a novel process developed to raise the temperature of mold surface rapidly in the injection stage and then cool rapidly to the ejection temperature by air or water. The objectives of this paper are to investigate the effect of mold temperature, pressure and thickness of micro pattern molding and to provide a optimization of RTR injection molding for micro pattern from Moldflow simulation. Optimal minimum temperature and pressure was found without shortcut according to thickness. Filling percentage was influenced by glass transition temperature with the kinds of resin. Optimal temperature is slightly higher than glass transition temperature irrespectively of pressure, thickness, the kinds of resin in the micro pattern molding.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.9
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• pp.1504-1510
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• 2016

The aim of this study is to improve properties both glass transition temperature($T_g$) and coefficient of thermal expansion(CTE) using epoxy/micro-nano alumina composites with adding glycerol diglycidyl ether (GDE:1,2,3,5g). This paper deals with the effects of GDE addition for epoxy/micro alumina contents (40, 50, 60wt%)+surface modified nano alumina(1_phr) composites. 20 kinds specimen were prepared with containing micro, nano alumina and GDE as a micro composites(10, 20, 30, 40, 50, 60, 70wt%) or a nano/micro alumina composites(1phr/40, 50, 60wt%). Average particle size of nano and micro alumina used were 30nm and $1{\sim}2{\mu}m$, respectively. The micro alumina used were alpha phase with Heterogeneous and nano alumina were gamma phase particles of spherical shape. The glass transition temperature and coefficients of thermal expansion was evaluated by DSC and TMA. The glass transition temperature decreased and coefficients of thermal expansion become smaller with filled contents of epoxy/micro alumina composites. On the other hand, $T_g$ and CTE as GDE addition variation(1,2,3,5g) of epoxy/micro-nano alumina composites decreased and increased respectively.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1231-1235
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• 2004

The needs of micro scale thermal detecting technique are increasing in biology and chemical industry. For example, Thermal finger print, Micro PCR(polymer chain reaction), ${\mu}TAS$ and so on. To satisfy these needs, we developed a DTSA(Diode Temperature Sensor Array) for detecting and controlling the temperature on small surface. The DTSA is fabricated by using VLSI technique. It consists of 32 ${\times}$ 32 array of diodes (1,024 diodes) for temperature detection and 8 heaters for temperature control on a 8mm ${\times}$ 8mm surface area. The working principle of temperature detection is that the forward voltage drop across a silicon diode is approximately proportional to the inverse of the absolute temperature of diode. And eight heaters ($1K{\Omega}$) made of poly-silicon are added onto a silicon wafer and controlled individually to maintain a uniform temperature distribution across the DTSA. Flip chip packaging used for easy connection of the DTSA. The circuitry for scanning and controlling DTSA are also developed

• Journal of Sasang Constitutional Medicine
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• v.7 no.2
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• pp.265-274
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• 1995

Skin temperatures were tested under the same conditions by using the thermography in order to extract the biological characteristics of the physical constitutional types in according to the Lee's 4 type physical constitutional theory. The subjects of this experiment were 14 ; 5 Macro-Negative subjects, 5 Micro-Negative subjects, 3 Micro-Positive subjects and 1 Macro-Positive subject. All subjects were stimulated with 2.5Hz 30Vpeak-peak pulses for 2 minutes. As the results, in normal prestimulation state the skin temperatures of the trunk in Micro-Positive and Macro-Positive subjects were higher than those of Macro-Negative and Micro-Negative subjects. In Macro-Negative subjects the reflected skin temperature of lever was the highest in the anterior trunk. In Micro-Negative subjects the reflected skin temperature of kidney was the highest in the trunk. In Micro-Positive subjects the reflected skin temperature of stomach was the highest in the trunk.In Macro-Positive subject the reflected skin temperature of lung was the highest in the trunk. In transient poststimulation state, heart rate was decreased in 7 cases among of 10 Macro-Negative ana Micro-Negative subjects, but it was increased in 3 cases among of 4 Micro-Positive and Macro-Positive subjects. And the hand temerature was increased in 8 cases among of 10 Macro-Negative and Micro-Negative subjects, but it was decreased in 3 cases among of 4 Micro-Positive and Macro-Positive subjects.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.5
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• pp.278-285
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• 2006

A micro hotplate for micro gas sensor was fabricated by MEMS technology. In order to heat up the gas sensing material to a target temperature, a micro hotplate was built on the gas sensor. The sensing material was deposited on the heater and electrodes, and did not contact with the silicon base to minimize the heat loss to the silicon base. The electric power to heat up the gas sensor was measured. The temperature distribution of micro gas sensor was analyzed by a CFD program. The predicted electric power to heat up th sensing material showed a good agreement with the measured data. The design of micro gas sensor could be modified to increase the temperature uniformity and to decrease the electric power consumption by optimizing the layout of micro hotplate and electrodes.