• Title/Summary/Keyword: micro-particle

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Design of Non-stick Micromanipulation for Handling of Micro particle (초소형 부품 조작을 위한 Non-stick 마이크로 매니퓰레이션 시스템의 설계)

  • Ihn, Y.S.;Kim, Y.C.;Choi, H.R.;Lee, S.M.;Koo, J.C.
    • The Journal of Korea Robotics Society
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    • v.4 no.3
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    • pp.225-232
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    • 2009
  • In the high precision robot systems, the most popular tasks may be handling of micro-scale objects on a surface such as a micromanipulation robot system. In handling of micro-scale objects, the stiction effect becomes a fundamental issue since the micro-contact mechanics dominates the micromanipulation robot system. In the paper, a theoretical non-stick condition derived from the micro-contact mechanics is carried out for the propose of micro-scale object manipulation. To verify the non-stick condition, a micro-manipulation robot system equipped with a high precision stage system and a microscope system is developed. Experimental results show that the proposed non-stick condition guarantees successful micro-scale object manipulation.

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Combustion Modeling of Nano/Micro Aluminum Particle Mixture (나노-마이크로 알루미늄 혼합 입자의 공기와의 연소 모델링)

  • Yoon, Shi-Kyung;Shin, Jun-Su;Sung, Hong-Gye
    • Journal of the Korean Society of Propulsion Engineers
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    • v.15 no.6
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    • pp.15-25
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    • 2011
  • One dimensional combustion modeling of aluminum combustion behavior is proposed. Combustion model is assumed that region consists as follows ; preheat, reaction, post reaction region. Flame speed as a function of particle size, equivalence ratio for unitary particles and fraction ratio of micro to nano particle size for binary particles were investigated for lean burn condition at 1 atm. Results were compared with experimental data. For unitary particles, flame speed increase as particle size decreases, but opposite trend with equivalence ratio. For binary particles, flame speed increases proportionally as nano particle fraction increases. For flame structure, separated or overlapping flames are observed, depending on the fraction of nano sized particles.

Measurement of 3-D Flow inside a Micro Curved-tube using Digital Micro Holographic Particle Tracking Velocimetry (디지털 Micro Holographic PTV기법을 이용한 미세 곡관 내부 3차원 유동 측정)

  • Kim, Seok;Lee, Sang-Joon
    • Proceedings of the KSME Conference
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    • 2007.05b
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    • pp.2579-2584
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    • 2007
  • A digital micro holographic particle tracking velocimetry (HPTV) system consisting of a high-speed camera and a single laser with acoustic optical modulator (AOM) chopper was established. The digital micro HPTV system was applied to water flow in a micro curved-tube for measuring instantaneous 3-D velocity field data consecutively. The micro curved-tube is using to reproduce the dorsal aorta or utilize in various lap-on-a-chip. The temporal evolution of a three-dimensional water flow in the micro curved-tube (the curvature, ${\kappa}$=1/${\phi}$, 2/${\phi}$, 4/${\phi}$, 8/${\phi}$) of 100 ${\mu}m$ and 300 ${\mu}m$ inner diameters was obtained and mean velocity field distribution was obtained by statistical-averaging the instantaneous velocity fields.

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Effect of Silica Particle Size on the Mechanical Properties in an Epoxy/Silica Composite for HV Insulation

  • Park, Jae-Jun
    • Transactions on Electrical and Electronic Materials
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    • v.13 no.5
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    • pp.248-251
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    • 2012
  • In order to develop a high voltage insulation material, epoxy/micro-silica composites (EMC) and epoxy/micro-silica/nano-silica composites (EMNC) with three different particle sizes in ${\mu}m$ and one particle size in nm were prepared and their tensile and flexural tests were carried out and the data was estimated by Weibull statistical analysis. The tensile strength of the neat epoxy was 82.8 MPa and those of the EMCs were larger than that of the neat epoxy, and they were much more advanced by the addition of 10 nm sized nano-silica to the EMCs. Flexural strength showed the same tendency of the tensile strength. As the micro-particle size decreased, tensile and flexural strength increased.

Measurements of a microchannel flow using micro-PIV

  • Lee Inwon;Choi Jayho;Lee In-Seop
    • 한국가시화정보학회:학술대회논문집
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    • 2001.12a
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    • pp.44-52
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    • 2001
  • A micro-PIV(particle image velocimetry) measurement has been conducted to investigate flow fields in such microfluidic devices as microchannels and micronozzle. The present study employs a state-of-art micro-PIV system which consists of epi-fluorescence microscope, 620nm diameter fluorescent seed particles and an 8-bit megapixel CCD camera. Velocity vector fields with a resolution of $6.8\;\times\;6.8{\mu}m$ has been obtained, and the attention has been paid on the effect of varying measurement conditions of particle diameter and particle concentration on the resulting PIV results. In this study, the microfluidic elements were fabricated on plastic chips by means of MEMS processes and a subsequent molding process. Flow fields in a variety of microchannels as well as micronozzle have been investigated.

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Optimal Blasting Conditions for Surface Profile when Micro Particle Blasting by Statistical Analysis of Orthogonal Arrays (미세입자 분사가공시 직교배열표의 통계적 분석에 의한 표면형상의 최적 분사 조건)

  • Kwon, Dae-Gyu;Wang, Duck Hyun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.15 no.4
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    • pp.148-154
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    • 2016
  • A study on the micro particle blasting was conducted to find the optimum conditions of the blasted surface of aluminum 6061. The particle type such as $Al_2O_3$ and SiC, nozzle diameter, pressure, standoff distance and injection time were used as blasting conditions. Statistical method of orthogonal arrays(ANOVA) was used to find optimum conditions of maximum depth and maximum diameter of blasted surface. Particle type, nozzle diameter, and pressure were found to be the main factors of maximum blasted depth and diameter. Maximum blasted diameter was affected by increasing pressure and nozzle diameter but saturated maximum diameter. Maximum blasted depth was affected by pressure and nozzle diameter when aluminum 6061 was blasted with $Al_2O_3$ particle. The value of surface roughness was increased as pressure and nozzle diameter increased when aluminum 6061 was blasted with SiC.

The Method to Select the Optimal Particle Size of Earth by Optimum Micro-filler (최밀충전에 의한 흙의 적정입도 선정 방법)

  • Hwang, Hey Zoo;Kang, Nam Yi
    • KIEAE Journal
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    • v.13 no.6
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    • pp.137-143
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    • 2013
  • The purpose of this study is to suggest optimum micro-filler experiment method to select the optimal particle size of earth for using in earth construction works and test this suggestion through compressive strength measurement. According to the results of selecting the method to choose the optimum micro-filler mixing of earth and sand, three-stage filling(plate tamping) showed relatively high results and so was estimated to be the proper filling method. According to the results of optimum micro-filler experiment of earth and sand by the maximal sizes of sand, between 80% and 90% showed the highest result values. The larger the maximum size of sand was, the lower the addition ratio of sand was in optimum micro-filler mixing. According to the results of compressive strength experiment by the particle sizes of earth and sand, 90% in the addition ratio of sand showed the highest results, and so tended to be similar to the results of unit volume weight experiment.

A Study of Micro-defect on chemical Mechanical Polishing(CMP) Process in VLST Circuit (고집적화 반도체 소자의 CMP 공정에서 Micro-Defect 관한 연굴)

  • Kim, Sang-Yong;Lee, Kyeng-Tae;Seo, Yong-Jin;Lee, Woo-Sun;Chung, Hun-Sang;Kim, Chang-Il;Chang, Eui-Goo
    • Proceedings of the KIEE Conference
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    • 1999.07d
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    • pp.1891-1894
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    • 1999
  • We can classify the scratches after CMP process into micro-scratch and macro-scratches according to the scratch size, scratch intensity and defect map, etc. The micro-scratches on wafer after CMP process are discussed in this paper. From many causes, major factor that influences the formation of micro-scratch is known as particle size distribution of slurry.(1) It is indefinite what size or type of particle can cause micro-scratch on wafer surface, but there is possibility caused by large particle over 1um. The best way for controlling these large particle to inflow is to use the slurry filter on POU(Point of user). But the slurry filter(especially, depth-type filter) has sometimes the problem which makes more sever micro-scratches on wafer surface after CMP. We studied that depth-type slurry filter has what kind of week-points and the number of scratch could be reduced by lowering slurry flow rate and by using high spray bar which sprays DIW on polishing pad with high pressure.

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Micro-sized carbon with dimple patterns prepared using an electro-spray method

  • Park, Mi-Seon;Lee, Young-Seak
    • Carbon letters
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    • v.16 no.3
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    • pp.215-218
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    • 2015
  • Carbon micro particles with dimple patterns were produced by electro-spraying a solution of pitch in tetrahydrofuran. Particle formation depended on separation in an electrical field and volatilization of the solvent. More than 80% of the obtained carbon exhibited an average particle size of less than 50 μm. X-ray diffraction analysis suggests that the carbon with dimple patterns has increased crystallinity after heat treatment.