• Title/Summary/Keyword: micro surface pattern

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Micro Mold Fabrication and the Micro Patterning by RTP Process (Micro Mold 제작 및 RTP 공정에 의한 미세 패턴의 성형)

  • Kim H. K.;Ko Y. B.;Kang J. J.;Rhim S. H.;Oh S. I.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2004.10a
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    • pp.294-297
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    • 2004
  • RTP(Rapid Thermal Pressing) is to fabricate desired pattern on polymer substrate by pressing patterned mold against the substrate heated around glass transition temperature. For a successful RTP process, the whole process including heating, molding, cooling and demolding should be conducted 'rapidly' as possible. As the RTP process is effective in replicating patterns on flat large surface without causing shape distortion after cooling, it is being widely used for fabricating various micro/bio application components, especially with channel-type microstructures on surface. This investigation finally aims to develop a RTP process machine for mass-producing micro/bio application components. As a first step for that purpose, we intended to examine the technological difficulties for realizing mass production by RTP process. Therefore, in the current paper, 4 kinds of RTP machines were examined and then the RTP process was conducted experimentally for PMMA film by using one of the machines, HEX 03. The micro-patterned molds used for RTP experiment was fabricated from silicon wafer by semi-conduct process. The replicated micro patterns on PMMA films were examined using SEM and the causes of defect observed in the replicated patterns were discussed.

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Cu Line Fabricated with Inkjet Printing Technology for Printed Circuit Board (잉크젯 인쇄 기술을 이용한 인쇄회로기판용 나노구리배선 개발)

  • Seo, Shang-Hoon;Lee, Ro-Woon;Yun, Kwan-Soo;Joung, Jae-Woo;Lee, Hee-Jo;Yook, Jong-Gwan
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1806-1809
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    • 2008
  • Study that form micro pattern by direct ink jet printing method is getting attention recently. Direct ink jet printing spout fine droplet including nano metal particle by force or air pressure. There is reason which ink jet printing method is profitable especially in a various micro-patterning technology. It can embody patterns directly without complex process such as mask manufacture or screen-printing for existent lithography. In this study, research of a technology that ejects fine droplet form of Pico liter and forms metal micro pattern was carried with inkjet head of piezoelectricity drive system. Droplet established pattern while ejecting consecutively and move on the surface at the fixed speed. Patterns formed in ink are mixed with organic solvent and polymer that act as binder. So added thermal hardening process after evaporate organic solvent at isothermal after printing. I executed high frequency special quality estimation of CPW transmission line to confirm electrical property of manufactured circuit board. We tried a large area printing to confirm application possibility of an ink jet technology.

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Micro Machining of Aluminium using Pulsed Laser Beam (레이저빔을 이용한 알루미늄의 미세가공)

  • Shin, Hong Shik
    • Journal of Institute of Convergence Technology
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    • v.4 no.2
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    • pp.41-45
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    • 2014
  • Micro fabrication technologies of aluminium have been required to satisfy many demands in technology fields. Pulsed laser beam machining can be an alternative method to accomplish the micro machining of aluminium. Pulsed laser beam can be applied to micro machining such as micro drilling and milling. Using pulsed laser beam, the machining characteristics of aluminium in micro drilling and milling were investigated according to average power, repetition rate, moving speed of spot. The laser beam machining with the optimal conditions can achieve precise micro figures. As a result, micro pattern, text and structures on aluminium surface was successfully fabricated by pulsed laser beam machining.

Fabrication of a stamper and injection molding for micro pattern product (미세 패턴 제품 마스터 제작 및 성형 공정 기술 개발)

  • Yoo Y.E;Seo Y.H;Je T.J.;Choi D.S
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.216-219
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    • 2005
  • In recent, LCD becomes one of the main display devices and expected to have quite good market share during the next couple of years. The demand for low cost and high performance, however, is becoming severe as the competition among other display devices like PDP, OLED increases. To satisfy this demand from market, we need to optimize the parts or modules of the LCD, reduce the number of the assemble and enhance the process for the high brightness and uniformity of the LCD. The LCD consists mainly of LCD panel and Backlight unit(BLU). BLU, which takes big portion of the cost for LCD, consists of light source, light guide panel and many kinds of functional film. Recently light guide panel or film for BLU has micro patterns on its surface and consequently to reduce the number of parts and enhace the brightness and its uniformity. In this study, some methodologies for the fabrication of the master/stamper and molding the light quide panel are introduced for 50um pitch of prizm patterned substrate. Mechanical machining process is adapted and optimized to fabricate micro patterned stamper using the micro cutting tool. Injection molding technology is also developed to obtain uniformly replicated micro patterned products.

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Nano-mold fabrication for imprinting lithography (나도 Imprinting 을 위한 몰드 제작에 관한 연구)

  • Lee, Jin-Hyung;Lim, Hyun-Uoo;Kim, Tae-Gon;Lee, Seung-Seoup;Park, Jin-Goo;Lee, Eun-Kyu;Kim, Yang-Sun;Han, Chang-Su
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.1073-1077
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    • 2003
  • This study aims to investigate the fabrication process of nano silicon mold using electron beam lithography (EBL) to generate the nanometer level patterns by nano-imprinting technology. the nano-patterned mold including 100mm pattern size has been fabricated by EBL with different doses ranged from 22 to 38 ${\mu}C/cm^2$ on silicon using the conventional polymethylmetharcylate(PMMA) resist. The silicon mold is fabricated with various patterns such as circles, rectangles, crosses, oblique lines and mixed forms, The effect of dosage on pattern density in EBL is discussed based on SEM (Scannning Electron Microscopy) analysis of fabricated molds. The mold surface is modified by hydrophobic fluorocarbon (FC) thin films to avoid the stiction during nano-imprinting process.

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Study on Experimental Selection of Parameters in Laser Scattering Mechanism and Analysis of Laser Scattering Patterns in Solar Cell Wafer (레이저 산란 메커니즘 매개변수의 실험적 선정 및 태양전지 웨이퍼의 레이저산란패턴 분석에 관한 연구)

  • Kim, Gyung-Bum
    • Journal of the Semiconductor & Display Technology
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    • v.10 no.2
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    • pp.7-12
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    • 2011
  • In this paper, a laser scattering mechanism are designed to detect micro defects such as dent, scratch, pinhole, etc. Its influential parameters are experimentally selected and scattering patterns of micro defects have been analyzed for silicon wafer in solar cell. As a result of experiments, scattered lights are rather increased in wafer surface with micro defects, in comparison to no micro ones. Scattering parameters are optimally selected for obtaining robust and high quality laser scattering images of micro defects. It is shown that scattered light components are linearly increased according to the increase of micro defect sizes, and the depth of micro-defects give a large influence on optical deflection.

Characteristics of Copper Plating Solutions for Electroforming of Microcircuit (미세 배선 성형을 위한 전주용 동도금액의 특성)

  • Park, Hae-Deok;Jang, Do-Yeon;Gang, Seong-Gun
    • Korean Journal of Materials Research
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    • v.11 no.10
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    • pp.820-832
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    • 2001
  • In order to obtain the basic data on the optimum conditions of electroforming process for fabricating the micro wiring pattern for plate type micro- motor core, characteristics of plating bath and properties of deposits were studied with various copper plating baths which contain sulfate, fluoborate, pyrophosphate and cyanide salt, respectively. Cathodic polarization, throwing power, internal stress, texture and surface morphology of deposits were observed. Throwing power of plating solution is deeply related to the polarization curves and the values are in the range of +20∼20%. The order of values ate as follows- pyrophosphate, cyanide, sulfate and fluoborate bath. Internal stresses of deposits are tensile in all of the copper plating bath. Thickness of the deposits plated at the center of holes has the highest value in the pyrophosphate bath and K factor, ratio of height and width of deposit, is 1.44. It was confirmed that the pyrophosphate bath was the best one for the electroforming of wire pattern.

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