1 |
Kim, G. B., "Study on Analysis of Optical Deflection of Laser Scattering Based on Rayleigh Criterion for Crystalline Silicon Wafer in Solar Cell," J. of the Semiconductor & Display Technology, Vol. 9, No. 4, pp.31-37, 2010.
|
2 |
Kim, G.. B., "A Structured Mechanism Development and Experimental Parameter Selection of Laser Scattering for the Surface Inspection of Flat-Panel Glasses," International Journal of Production Research, Vol. 48, Issue 13, pp. 3911-3923, 2010.
|
3 |
John, C. S., "Optical Scattering Measurement and Analysis 2nd Edition," SPIE Press, 1995.
|
4 |
Roy, R. K., "Design of Experiments using the Taguchi Approach," John Wiley & Sons Inc., 2001.
|
5 |
Anton B., "Stress Diagnostics and Crack Detection in Full-Size Silicon Wafers Using Resonance Ultrasonic Vibrations," Ph. D. Dissertation, University of South Florida, 2005.
|
6 |
Tsai, D. M., Chang, C. C. and chao, S. M., "Micro-Crack Inspection in Heterogeneously Textured Solar Wafers using Anisotropic Diffusion," Image and Vision Computing, pp. 491-501, 2010.
|
7 |
Takami, K., "Defect inspection of wafers by laser scattering," Materials Science and Engineering B, Vol. 44, No. 1-3, pp. 181-187, 1997.
DOI
|