• Title/Summary/Keyword: micro hot plate

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The Characteristics of Thermal Hydraulic Performance for Micro Plate Heat Exchanger with Straight channel (직관채널의 마이크로 판형열교환기 열적 성능 특성)

  • Kim, Yoon-Ho;Lee, Kyu-Jung;Seo, Jang-Won;Jeon, Seung-Won
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.20 no.11
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    • pp.767-774
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    • 2008
  • This paper presented the heat transfer and pressure drop characteristics for micro plate heat exchanger with straight channel. The metal sheets for straight channel are manufactured by chemical etching and fabricated micro plate heat exchangers by using the vacuum brazing of bonding technology. The performance experiments are performed within the Reynolds numbers range of 15$\sim$250 under the same flow rate conditions for hot and cold sides. The inlet temperature of hot and cold water are conducted in the range of $30^{\circ}C{\sim}50^{\circ}C$ and $15^{\circ}C{\sim}25^{\circ}C$, respectively. Heat transfer rate and pressure drop are evaluated by the Reynolds numbers and mass flow rates as the inlet temperature variations of the hot and cold sides. Correlations of Nusselt number and friction factor are suggested for micro plate heat exchanger with straight channel using the results of performance experiment.

Development of Core Technologies for Integrating Combustible Hydrogen Gas Sensor (수소가스 감지용 가연성 가스센서 제작을 위한 요소기술 개발)

  • Yun, Eui-Jung;Park, Hyeong-Sik;Lee, Seok-Tae;Park, Nho-Kyung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.20 no.3
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    • pp.228-233
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    • 2007
  • Core technologies for integrating hydrogen gas sensor were investigated. In this study, the thermally isolated micro-hot-plate with areas of $100{\times}100-260{\times}260{\mu}m^2$ was fabricated by utilizing surface micromachining technique that provides better manufacturing yield than bulk micromachining counterpart. The optimum design of the sensor was peformed by analyzing the thermal profile of the structure obtained from a ANSYS simulator. The 400-nm-thick polysilicon films doped with phosphorus, the 300-nm-thick aluminum films, and the 200-nm-thick $SnO_2$(or ZnO)films were used as the micro-heater material, the temperature sensor material, and the gas sensitive material, respectively. The experimental results show that the developed gas sensors can detect $H_2$ concentration as low as 1 ppm.

Hot Imprinted Hierarchical Micro/Nano Structures on Aluminum Alloy Surfaces (고온 임프린팅을 통한 알루미늄합금 표면의 마이크로/나노 구조 성형 기술)

  • Moon, I.Y.;Lee, H.W.;Oh, Y.S.;Kim, S.J.;Kim, J.H.;Kang, S.H.
    • Transactions of Materials Processing
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    • v.28 no.5
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    • pp.239-246
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    • 2019
  • Various surface texturing techniques have been studied because of the effective applicability of micro or nano scale surface patterns. Particularly, the most promising types of patterns include the hierarchical patterns, which consists of micro/nano structures. Different processes such as MEMS, laser machining, micro cutting and micro grinding have been applied in the production of hierarchical patterns on various material surfaces. This study demonstrates the process of hot imprinting to induce the hierarchical patterns on the Al alloy surfaces. Wire electrical discharge machining (WEDM) process was used to imprint molds with micro scale sinusoidal pattern. In addition, the sinusoidal pattern with rough surface morphology was obtained as a result of the discharge craters. Consequently, the hierarchical patterns consisting of the sinusoidal pattern and the discharge craters were prepared on the imprinting mold surface. Hot imprinting process for the Al plates was conducted on the prepared mold, and the replication performance was analyzed. As a result, it was confirmed that the hierarchical patterns of the mold were effectively duplicated on the surface of Al plate.

A Study on Selective Transfer and Reflow Process of Micro-LED using Micro Stamp (마이크로 스탬프를 이용한 Micro-LED 개별 전사 및리플로우 공정에 관한 연구)

  • Han, Seung;Yoon, Min-Ah;Kim, Chan;Kim, Jae-Hyun;Kim, Kwang-Seop
    • Tribology and Lubricants
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    • v.38 no.3
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    • pp.93-100
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    • 2022
  • Micro-light emitting diode (micro-LED) displays offer numerous advantages such as high brightness, fast response, and low power consumption. Hence, they are spotlighted as the next-generation display. However, defective LEDs may be created due to non-uniform contact loads or LED alignment errors. Therefore, a repair process involving the replacement of defective LEDs with favorable ones is necessitated. The general repair process involves the removal of defective micro-LEDs, interconnection material transfer, as well as new micro-LED transfer and bonding. However, micro-LEDs are difficult to repair since their size decreases to a few tens of micron in width and less than 10 ㎛ in thickness. The conventional nozzle-type dispenser for fluxes and the conventional vacuum chuck for LEDs are not applicable to the micro-LED repair process. In this study, transfer conditions are determined using a micro stamp for repairing micro-LEDs. Results show that the aging time should be set to within 60 min, based on measuring the aging time of the flux. Additionally, the micro-LEDs are subjected to a compression test, and the result shows that they should be transferred under 18.4 MPa. Finally, the I-V curves of micro-LEDs processed by the laser and hot plate reflows are measured to compare the electrical properties of the micro-LEDs based on the reflow methods. It was confirmed that the micro-LEDs processed by the laser reflow show similar electrical performance with that processed by the hot plate reflow. The results can provide guidance for the repair of micro-LEDs using micro stamps.

A thermal properties of micro hot-plate fabricated by using the Pt/Cr bilayer (Pt/Cr 이중층을 이용한 미세 발열체의 제작과 발열특성)

  • Yi, Seung-Hwan;Suh, Im-Choon;Sung, Yong-Kwon
    • Proceedings of the KIEE Conference
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    • 1996.07c
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    • pp.1982-1984
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    • 1996
  • In this paper, we have evaluated the physical characteristicsof the Pt/Cr bilayer, fabricated the micro hot plate by using the Pt/Cr bilayer and E-beam evaporated oxide as a passivation layer, and simulated the thermal distribution by using the commercial software FIDAP. From the researches the sheet resistance of Pt/Cr bilayer didn't be affected by the Cr layer thickness. This results was considered due to the Cr-oxide resided at the interface between Pt and Cr layer. After manufacturing the hot plate, we measured its temperature by type k thermo-couple and I.R. thermo-vision system. In those experiments, the emission coefficient( ${\varepsilon}$ ) of the E-beam evaporated oxide was 0.5 and the temperature of centural region was reached about $305\;^{\circ}C$ at 1.3 watts. The temperature simulation obtained by FIDAP commercial package stewed that the temperature of centural region was about $311\;^{\circ}C$ after 5 sec.

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Study on Internal Void Closure in Slab ingot during Hot Plate Forging (열간 판재단조시 강괴 내부의 기공폐쇄에 관한 연구)

  • 조종래;김동권;김영득;이부윤
    • Transactions of Materials Processing
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    • v.5 no.1
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    • pp.18-26
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    • 1996
  • In order to investigate the effect of pre-cooling of ingot on void closure in hot plate forging the internal strain and stress distributions are examined quantitatively by using ABAQUS. Simula-tions are carried out on a large slab ingot having the same temperature and the temperature gradient induced by air-cooling. It is shown that pre-cooling produces little effect on the strain behavior but remarkable effect on the hydrostatic stress at the central zone of ingot. The main factors for crushing micro-voids are the effective strain and the time integral of hydrostatic stress in the region surrounding the voids. Based on regression analysis it was found that the distortion of void can be expressed as a polynomial function of the two factors.

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A study on Linear Pattern Fabrication of Plate-type PC (PC소재의 선형 패턴 제작에 관한 연구)

  • Joung, Y.N.;Lee, E.K.;Kang, C.G.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2008.05a
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    • pp.277-280
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    • 2008
  • Recently, a demand of nano/micro patterned polymer for display or biochip has been rising. Then many studies have been carried out. Nano/micro-embossing is a deformation process where the workpiece materials is heated to permit easier material flow and then forced over a planar patterned tool. In this work, the hot-emboss process is performed with different forming conditions; forming temperature, load, press hold time, to get the proper condition for linear pattern fabrication on plated-type polymers (PC). Replicated pattern depth increases in proportion to the forming temperature, load and time. Reduction of the workpiece thickness increases according to press hold time. In process of time, reduction ratio of workpiece thickness decreases because of surface area increment of the workpiece and pressure decline on it.

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Photoactive Layer Formation with Oven Annealing for a Carbon Electrode Perovskite Solar Cell

  • Kim, Kwangbae;Song, Ohsung
    • Korean Journal of Materials Research
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    • v.30 no.11
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    • pp.595-600
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    • 2020
  • The photovoltaic properties of perovskite solar cells (PSCs) with a carbon electrode fabricated using different annealing processes are investigated. Perovskite formation (50 ℃, 60 min) using a hot-plate and an oven is carried out on cells with a glass/fluorine doped TiO2/TiO2/ZrO2/carbon structure, and the photovoltaic properties of the PSCs are analyzed using a solar simulator. The microstructures of the PSCs are characterized using an optical microscope, a field emission scanning electron microscope, and an electron probe micro-analyzer (EPMA). Photovoltaic analysis shows that the energy conversion efficiency of the samples fabricated using the hot-plate and the oven processes are 2.08% and 6.90%, respectively. Based on the microstructure of the samples and the results of the EPMA, perovskite is formed locally on the carbon electrode surface as the γ-butyrolactone (GBL) solvent evaporates and moves to the top of the carbon electrode due to heat from the bottom of the sample during the hot plate process. When the oven process is used, perovskite forms evenly inside the carbon electrode, as the GBL solvent evaporates extremely slowly because heat is supplied from all directions. The importance of the even formation of perovskite inside the carbon electrode is emphasized, and the feasibility of oven annealing is confirmed for PSCs with carbon electrodes.

Numerical simulation of hot embossing filling (핫엠보싱 충전공정에 관한 수치해석)

  • Kang T. G.;Kwon T. H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.05a
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    • pp.43-46
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    • 2005
  • Micro molding technology is a promising mass production technology for polymer based microstructures. Mass production technologies such as the micro injection/compression molding, hot embossing, and micro reaction molding are already in use. In the present study, we have developed a numerical analysis system to simulate three-dimensional non-isothermal cavity filling for hot embossing, with a special emphasis on the free surface capturing. Precise free surface capturing has been successfully accomplished with the level set method, which is solved by means of the Runge-Kutta discontinuous Galerkin (RKDG) method. The RKDG method turns out to be excellent from the viewpoint of both numerical stability and accuracy of volume conservation. The Stokes equations are solved by the stabilized finite element method using the equal order tri-linear interpolation function. To prevent possible numerical oscillation in temperature Held we employ the streamline upwind Petrov-Galerkin (SUPG) method. With the developed code we investigated the detailed change of free surface shape in time during the mold filling. In the filling simulation of a simple rectangular cavity with repeating protruded parts, we find out that filling patterns are significantly influenced by the geometric characteristics such as the thickness of base plate and the aspect ratio and pitch of repeating microstructures. The numerical analysis system enables us to understand the basic flow and material deformation taking place during the cavity filling stage in microstructure fabrications.

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Development of New Micro Pattern Fabrication Process by U sing Isostatic Pressing (정수압을 이용한 미세 패턴 전사 신공정 개발)

  • Seol, J.W.;Joo, B.Y.;Rhim, S.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2009.10a
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    • pp.267-270
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    • 2009
  • In the present investigation, we are newly developing a new forming process which can fabricate micro patterns on large-area polymeric substrates for high speed mass production. The key idea of the new process is to pressurize multiple vacuum-packed substrate-mold stacks above the glass transition temperature ($T_g$) of the polymeric substrates. The new process is thought to be promising micro-pattern fabrication technique in three aspects; firstly, isostatic pressing ensures the uniform micro-pattern replicating condition regardless of the substrate area. Secondly, the control of forming condition such as temperature and pressure can realize well-defined process condition exploited in the conventional hot embossing research field. Thirdly, multiple substrates can be patterned at the same time. A prototype forming machine for the new process was developed with the design consideration realizing the present idea. With a developed machine, micro prismatic array patterns with 50 um in size were successfully made on the $380{\times}300{\times}6\;mm$ PMMA plate.

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