• Journal of Internet of Things and Convergence
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• v.9 no.3
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• pp.93-98
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• 2023

In this paper, an artificial neural network based on simulated annealing was constructed. The mapping relationship between the parameters of micro-scaled flow channels electrochemical machining and the channel shape was established by training the samples. The depth and width of micro-scaled flow channels electrochemical machining on stainless steel surface were predicted, and the flow channels experiment was carried out with pulse power supply in NaNO3 solution to verify the established network model. The results show that the depth and width of the channel predicted by the simulated annealing artificial neural network with "4-7-2" structure are very close to the experimental values, and the error is less than 5.3%. The predicted and experimental data show that the etching degree in the process of channels electrochemical machining is closely related to voltage and current density. When the voltage is less than 5V, a "small island" is formed in the channel; When the voltage is greater than 40V, the lateral etching of the channel is relatively large, and the "dam" between the channels disappears. When the voltage is 25V, the machining morphology of the channel is the best.

• Journal of Sensor Science and Technology
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• v.20 no.3
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• pp.187-192
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• 2011

Abrasive blaster is similar to sand blaster, and effectively removes hard and brittle materials. Exiting abrasive blaster has applied to rough working such as deburring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro abrasive blaster was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro blaster in MEMS process of glass and succeed in domestically producing complete micro blaster. Diameter of hole and width of line in this etching is 100 ${\mu}m$ ~ 1000 ${\mu}m$. Experimental results showed good performance in micro channel and hole in glass wafer. Therefore, this micro blaster could be effectively applied to the micro machining of semiconductor, micro PCR chip.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.493-494
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• 2006

SU-8 can be implemented as a mask for micro Abrasive Jet Machining (micro-AJM) process [1]. In this paper, we will evaluate the quality of micro grooving result on glass substrate by micro-AJM process which using SU-8 as a mask. It was evaluated on width and edge profile of the micro grooving. The result was having distortion compare with the master film used to pattern the SU-8 mask. The value of distortion with other properties which came along with it, such as depth and surface roughness, can be optimized in order to fabricate micro-channel for micro-fluidic application.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1194-1197
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• 2005

Micro nozzle is employed as a dynamic passive valve in micro fluidic devices. Micro nozzle array is used in micro droplet generation in bio-medical applications and propulsion device for actuating satellite and aerospace ship in vacuum environments. Aperture angle and the channel length of the micro nozzle affect its retification efficiency, and thus it is needed to produce micro nozzle precisely. MEMS process has a limit on making a micro nozzle with high-aspect ratio. Reactive ion etching process can make high-aspect ratio structure, but it is difficult to make the complex shape. Focused ion beam deposition has advantage in machining of three-dimensional complex structures of sub-micron size. Moreover, it is possible to monitor machining process and to correct defected part at simultaneously. In this study, focused ion beam deposition was applied to micro nozzle production.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.401-402
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.685-686
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.33-34
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• 2013

• Journal of Powder Materials
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• v.22 no.3
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• pp.163-168
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• 2015

Ti alloys are extensively used in high-technology application because of their strength, oxidation resistance at high temperature. However, Ti alloys tend to be classified very difficult to cut material. In this paper, The powder synthesis, spark plasma sintering (SPS), bulk material properties such as electrical conductivity and thermal conductivity are systematically examined on $Ti_2AlN$ and $Ti_2AlC$ materials having most light-weight and oxidation resistance among the MAX phases. The bulk samples mainly consisted of $Ti_2AlN$ and $Ti_2AlC$ materials with density close to theoretical value were synthesized by a SPS method. Machining characteristics such as machining time, surface quality are analyzed with measurement of voltage and current waveform according to machining condition of micro-electrical discharge machining with micro-channel shape.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.229-232
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• 2005

This paper presents the design and fabrication of backflow prevented Micropump using the metal membrane. The Micropump is consisted of the lower plate, metal membrane, upper plate and the piezoelectric-element. The lower plate includes the micro channel and the inlet, outlet of the Micropump. The upper plate includes the micro channel and connects the piezoelectric-element. These plate are fabricated on the Pyrex glass wafer by sandblasting process. The metal membrane does roll of check valve that is prevented backflow of the Micropump. The metal membrane is fabricated on the stainless steel by laser machining. Piezoelectric-element is actuated the Micropump and controlled flowing of fluid. The Micropump is fabricated by bonding process of these multi-layer.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.315-316
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• 2002

Electrochemical discharge machining is a very recent technique for non-conducting materials such as ceramics and glasses. ECDM is conducted in the NaOH solution and the cathode electrode is separated from the solution by $H_2$ gas bubble. Then the discharge is appeared and the non-conductive material is removed by spark and some chemical reactions. In the ECDM technology, the $H_2$ bubble control is the most important factor to stabilize the discharging condition. In this paper, we proposed the discharge peak monitoring/ discharging duty feedback algorithms for the discharge stabilization and the feasibility of this algorithm is verified by various pattern machining in the constant preload conditions for the cathode electrode.