• JSTS:Journal of Semiconductor Technology and Science
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• 제10권2호
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• pp.143-151
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• 2010

In this work, we propose a single electron memory 'SEM' design which consist of two key blocs: A memory bloc, with a voltage source $V_{Mem}$, a pure capacitor connected to a tunnel junction through a metallic memory node coupled to the second bloc which is a Single Electron Transistor "SET" through a coupling capacitance. The "SET" detects the potential variation of the memory node by the injection of electrons one by one in which the drainsource current is presented during the memory charge and discharge phases. We verify the design of the SET/SEM cell by the SIMON tool. Finally, we have developed a MAPLE code to predict the retention time and nonvolatility of various SEM structures with a wide operating temperature range.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.92.1-92.1
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• 2013

Molecular electronics has been the subject of intese research for many years because of the fundamental interest in molecular charge transport and potential applications, such as (bio)nanosensors and molecular memory devices. Molecular electronics requires a method for making reliable eletrical contacts to singlemolecules. To date, several approaches have been reported: scanning-probe microscopy, mechanical break junctions, nano patterning, and direct deposition of electrode on a self-assembled monolayers. However, most methods are laborious and difficult for large-scale application and more importantly, cannot control the number of moleucles in the junction. Recently, DNA has been used as a template for metallic nanostructures (e.g., Ag, Pd, and Au nanowires) through DNA metallization process. Furthermore, oligodeoxynucleotides have been tethered to organic molecules by using conventional organic reactions. Collectively, these techniques should provide an efficient route toward reliable and reproducible molecular electronic devices with large-scale fabrication. Therefore, I will present a paradigm for the fabrication of moleuclar electronic devices by using micrometer-sized DNA-singe organic molecule and DNA triblock structures.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.278-278
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• 2009

A photovoltaic device consisting of arrays of radial p-n junction wires enables a decoupling of the requirements for light absorption and carrier extraction into orthogonal spatial directions. Each individual p-n junction wire in the cell is long in the direction of incident light, allowing for effective light absorption, but thin in orthogonal direction, allowing for effective carrier collection. To fabricate radial p-n junction solar cells, p or n-type vertical Si wire cores need to be produced. The majority of Si wires are produced by the vapor-liquid-solid (VLS) method. But contamination of the Si wires by metallic impurities such as Au, which is used for metal catalyst in the VLS technique, results in reduction of conversion efficiency of solar cells. To overcome impurity issue, top-down methods like noble metal catalytic etching is an excellent candidate. We used noble metal catalytic etching methods to make Si wire arrays. The used noble metal is two; Au and Pt. The method is noble metal deposition on photolithographycally defined Si surface by sputtering and then etching in various BOE and $H_2O_2$ solutions. The Si substrates were p-type ($10{\sim}20ohm{\cdot}cm$). The areas that noble metal was not deposited due to photo resist covering were not etched in noble metal catalytic etching. The Si wires of several tens of ${\mu}m$ in height were formed in uncovered areas by photo resist. The side surface of Si wires was very rough. When the distance of Si wires is longer than diameter of that Si nanowires are formed between Si wires. Theses Si nanowires can be removed by immersing the specimen in KOH solution. The optimum noble metal thickness exists for Si wires fabrication. The thicker or the thinner noble metal than the optimum thickness could not show well defined Si wire arrays. The solution composition observed in the highest etching rate was BOE(16.3ml)/$H_2O_2$(0.44M) in Au assisted chemical etching method. The morphology difference was compared between Au and Pt metal assisted chemical etching. The efficiencies of radial p-n junction solar Cells made of the Si wire arrays were also measured.

• Investigative Magnetic Resonance Imaging
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• 제20권1호
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• pp.44-52
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• 2016

Purpose: To quantitatively and qualitatively compare fat-suppressed MRI quality using iterative decomposition of water and fat with echo asymmetry and least-squares estimation (IDEAL) with that using frequency selective fat-suppression (FSFS) T2- and postcontrast T1-weighted fast spin-echo images of the head and neck at 3T. Materials and Methods: The study was approved by our Institutional Review Board. Prospective MR image analysis was performed in 36 individuals at a single-center. Axial fat suppressed T2- and postcontrast T1-weighted images with IDEAL and FSFS were compared. Visual assessment was performed by two independent readers with respect to; 1) metallic artifacts around oral cavity, 2) susceptibility artifacts around upper airway, paranasal sinus, and head-neck junction, 3) homogeneity of fat suppression, 4) image sharpness, 5) tissue contrast of pathologies and lymph nodes. The signal-to-noise ratios (SNR) for each image sequence were assessed. Results: Both IDEAL fat suppressed T2- and T1-weighted images significantly reduced artifacts around airway, paranasal sinus, and head-neck junction, and significantly improved homogeneous fat suppression in compared to those using FSFS (P < 0.05 for all). IDEAL significantly decreased artifacts around oral cavity on T2-weighted images (P < 0.05, respectively) and improved sharpness, lesion-to-tissue, and lymph node-to-tissue contrast on T1-weighted images (P < 0.05 for all). The mean SNRs were significantly improved on both T1- and T2-weighted IDEAL images (P < 0.05 for all). Conclusion: IDEAL technique improves image quality in the head and neck by reducing artifacts with homogeneous fat suppression, while maintaining a high SNR.

• 한국환경과학회지
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• 제16권10호
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• pp.1169-1177
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• 2007

The main objective of this research was to evaluate the effects of process variables which were forming ability, flow displacement, effective stress, effective strain, fluid vector and products defects on manufactured artificial lightweight aggregate made of both incinerated sewage sludge ash and clay by means of the numerical analysis of a rigid-plastic finite element method. CATIA (3D CAD program) was used for an extrusion metal mold design that was widely used in designing aircraft, automobile and metallic molds. A metal forming analysis program (ATES Co.) had a function of a rigid-plastic finite element method was used to analyze the program. The result of extrusion forming analysis indicated clearly that a shape retention of the manufactured artificial light-weight aggregate could be maintained by increasing the extrusion ratio (increasing compressive strength inside of extrusion die) and decreasing the die angle. The stress concentration of metal mold was increased by increasing an extrusion ratio, and it was higher in a junction of punch and materials, friction parts between a bottom of the punch and inside of a container, a place of die angle and a place of die of metal mold. Therefore, a heat treatment as well as a rounding treatment for stress distribution in the higher stress concentration regions were necessary to extend a lifetime of the metallic mold. A deformity of the products could have made from several factors which were a surface crack, a lack of the shape retention and a crack of inside of the products. Specially, the surface crack in the products was the most notably affected by the extrusion ratio.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.60-60
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• 2011

Giant magnetoresistance (GMR), tunneling magnetoresistance (TMR), and magnetic random-access memory (MRAM) are currently active research areas in spintronics. The high magnetoresistance and the high spin polarization (P) of electrons in the ferromagnetic electrodes of tunnel junction or intermediate layers are required. Magnetite, Fe3O4, is predicted to possess as half-metallic nature, P ~ 100% spin polarization, and has a high Curie temperature (TC~850 K). Experiments demonstrated that the P~($80{\pm}5$)%, ~($60{\pm}5$)%, and ~40-55% for epitaxial (111), (110) and (001)-oriented Fe3O4 thin films, respectively. Epitaxial Fe3O4 films may enable us to investigate the effects of half metals on the spin transport without grain-boundary scattering.In addition, it has been reported that the Verwey transition (TV, a first order metal-insulator transition) of 120 K in bulk Fe3O4 is strongly affected by many parameters such as stoichiometry and stress, etc. Here we report that the growth modes, magnetism and transport properties of Fe3O4 thin films were strongly dependent on the oxygen pressure during film growth. The average roughness decreases from 1.021 to 0.263 nm for the oxygen pressure increase from $2.3{\times}10-7$ to $8.2{\times}10^{-6}$ Torr, respectively. The 120 K Verwey transition in Fe3O4 was disappeared for the sample grown under high oxygen pressure.

• E2M - 전기 전자와 첨단 소재
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• 제8권2호
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• pp.176-183
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• 1995

The present work is concerned with the switching conduction characteristics of PI LB films in metal insulator metal sandwiches. By applying various DC voltage bias to MIM junctions, conduction characteristics of junctions can be changed between the high-voltage low-current(off) condition, the low-voltage high-current (on) condition and the medium(mid) condition. Switching conduction characteristics can be also observed in MIM junctions employing some aromatic compounds as insulators. Switching conduction characteristics is assumed to be owing to the existence of aromatic rings, space charge in films, impurities on metal-insulator interface, and difference in work functions of base and top electrodes metal. To study the conduction process of on, off, and mid conductions, we measured I-V, d$^{2}$V/d I$^{2}$-V characteristics of junctions with several different top electrodes under various temperatures. Small conductance changes of junctions can be measured by observing the second derivative, d$^{2}$V/dI$^{2}$, of I-V curve. A dynamical technique is used to get the second derivatives. That is, a finite modulation of the current is applied to the junctions and the second harmonic of the voltage is detected.

• 한국초전도ㆍ저온공학회논문지
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• 제21권4호
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• pp.13-18
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• 2019

Superconducting junctions of topological insulator (TI) are expected to host Majorana bound state, which is essential for developing topological quantum information devices. In this study, we fabricated Josephson junctions (JJs) made of Sb-doped Bi2Se3 TI nanoribbon and PbIn superconducting electrodes. In the normal state, the axial magnetoresistance data exhibit periodic oscillations, so-called Aharonov-Bohm oscillations, due to a metallic surface state of TI nanoribbon. At low temperature of 1.5 K, the TI JJ reveals the superconducting proximity effects, such as the critical current and multiple Andreev reflections. Under the application of microwave, integer Shapiro steps are observed with satisfying the ac Josephson relation. Our observations indicate that highly-transparent superconducting contacts are formed at the interface between TI nanoribbon and conventional superconductor, which would be useful to explore Majorana bound state in TI.

• 한국자기학회지
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• 제12권4호
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• pp.127-131
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• 2002

자성터널접합(magnetic tunnel junction: MTJ)소자의 AlO$_{x}$터널장벽 절연층을 플라즈마 산화법으로 2번에 나누어 금속증착.산화를 반복하여 만들어 보았다. 이중산화I그룹은 10A의 $\AA$의 Al 하부 절연막을 증착하고 산화시간을 10 s로 완성한 후 그 위에 13$\AA$의 Al을성막하고 50, 80, 120s간 산화시켜 완성한 절연막의 특성을 알아보았다. 이중산화II그룹은 10$\AA$봐 Al하부 절연막의 산화시간을 30~120 s간 달리하고 그 위에 13 $\AA$의 Al을 성막하고 210 s간 산화시켜 완성한 절연막의 특성을 알아보았다. 이중산화공정으로 제조된 시편은 전 실험범위에서 자기저항비(magnetoresistance： MR)는 27% 이상으로 우수하였고, 이는 13 $\AA$의 Al을 증착하고 한번만 산화시키는 통상의 단일산화에 비해 MR비가 우수하고 공정범위가 넓었다. 수직단면 투과전자현미경(transmission electron microscope： TEM)으로 미세구조를 확인한 결과 이중산화가 단일산화보다도 더 얇고 균일한 두께를 유지함을 알 수 있었다 X선광전자분석(X-ray photoelectron spectroscopy： XPS)으로 확인한 결과 이중산화는 절연막층 하부 CoFe 자성층의 Fe의 산화를 방지하여, 결과적으로 단일산화법에 비해서 하부자성층의 산화를 방지하여 긴 산화시간 공정 범위에서도 우수한 MR비를 가질 수 있었다.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.