• Title/Summary/Keyword: metallic junction

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Influences of Trap States at Metal/Semiconductor Interface on Metallic Source/Drain Schottky-Barrier MOSFET

  • Cho, Won-Ju
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.7 no.2
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    • pp.82-87
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    • 2007
  • The electrical properties of metallic junction diodes and metallic source/drain (S/D) Schottky barrier metal-oxide-semiconductor field-effect transistor (SB-MOSFET) were simulated. By using the abrupt metallic junction at the S/D region, the short-channel effects in nano-scaled MOSFET devices can be effectively suppressed. Particularly, the effects of trap states at the metal-silicide/silicon interface of S/D junction were simulated by taking into account the tail distributions and the Gaussian distributions at the silicon band edge and at the silicon midgap, respectively. As a result of device simulation, the reduction of interfacial trap states with Gaussian distribution is more important than that of interfacial trap states with tail distribution for improving the metallic junction diodes and SB-MOSFET. It is that a forming gas annealing after silicide formation significantly improved the electrical properties of metallic junction devices.

Tunneling magnetoresistance in ferromagnetic tunnel junctions with conditions of insulating barrier preparation (부도체층 제작조건에 따른 강자성 터널접합의 투과자기저항 특성 연구)

  • 백주열;현준원
    • Journal of the Korean institute of surface engineering
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    • v.32 no.1
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    • pp.61-66
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    • 1999
  • The Spin-dependent tunneling magnetoresistance (TMR) effect was observed in $NiFe/Al_2O_3$/Co thin films. The samples were prepared by magnetron sputtering in a system with a base pressure of $3\times10^{-6}$Torr. the insulating $Al_2O_3$layer was prepared by r.f. plasma oxydation method of a metallic Al layer. The ferromagnetic and insulating layers were deposited through metallic masks to produce the cross pattern form. The junction has an active area of $0.3\times0.3\textrm{mm}^2$ and the $Al_2O_3$layer is deposited through a circular mask with a diameter of 1mm. It is very important that insulating layer is formed very thinly and uniformly in tunneling junction. The ferromagnetic layer was fabricated in optimum conditions and the surface of that was very flat, which was observed by AFM. Tunneling junction was confirmed through nonlinear I-V curve. $NiFe/Al_2O_3$/Co junction was observed for magnetization behavior and magnetoresistance property and magnetoresistance property is dependent on magnetization behavior and magnetoresistance property and magnetoresistance property is dependent on magnetization behavior of t재 ferromagnetic layer. The maximum magnetoresistance ratio was about 6.5%.

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Reference Electrode for Monitoring Cathodic Protection Potential

  • Panossian, Z.;Abud, S.E.
    • Corrosion Science and Technology
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    • v.16 no.5
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    • pp.227-234
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    • 2017
  • Reference electrodes are generally implemented for the purpose of monitoring the cathodic protection potentials of buried or immersed metallic structures. In the market, many types of reference electrodes are available for this purpose, such as saturated calomel, silver/silver chloride and copper/copper sulfate. These electrodes contain a porous ceramic junction plate situated in the cylindrical body bottom to permit ionic flux between the internal electrolyte (of the reference electrode) and the external electrolyte. In this work, the copper/copper sulfate reference electrode was modified by replacing the porous ceramic junction plate for a metallic platinum wire. The main purpose of this modification was to avoid the ion copper transport from coming from the inner reference electrode solution into the surrounding electrolyte, and to mitigate the copper plating on the coupon surfaces. Lab tests were performed in order to compare the performance of the two mentioned reference electrodes. We verified that the experimental errors associated with the measurements conducted with developed reference electrode would be negligible, as the platinum surface area exposed to the surrounding electrolyte and/or to the reference electrolyte are maintained as small as possible.

A Study of ultrasonic welding system design (초음파 용접 시스템 설립에 관한 연구)

  • Lee, In-Hyuk;Song, Sung-Geun;Lee, Sang-Hun;Park, Sung-Jun;Chun, Chang-Keun;Yun, Cheol-Ho
    • Proceedings of the KIEE Conference
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    • 2006.07b
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    • pp.988-989
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    • 2006
  • The ultrasonic welding is with features of high electric conductivity and hot conductivity when it is used in metallic bond, high electric conductivity and hot conductivity when it is used in various metallic bonds, excellent quality when it is used for advanced junction, easiness when it is used in various metallic bonds, being needless for the exhaustive material and being benefit for the environment. Currently the use of ultrasonic welding is increasing in the industrial fields such as the automobile battle, the refrigerator, the air conditioner, the battery and the solar cell junction. But the production ability is insufficient in our country and it is necessary to explore the core technology of the ultrasonic welding. In this paper, the output LC resonance filter and 35kHz squal wave onion occurrence Full Bridge plans was designed. The output examination of the ultrasonic oscillator and the ultrasonic welding examination were done. The method for getting more smooth result in the ultrasonic welding machine system was researched.

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Employing Al Etch Stop Layer for Nb-based SNS Josephson Junction Fabrication Process (Al 식각정지층을 이용한 Nb-based SNS 조셉슨 접합의 제조공정)

  • Choi, J.S.;Park, J.H.;Song, W.;Chong, Y.
    • Progress in Superconductivity
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    • v.12 no.2
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    • pp.114-117
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    • 2011
  • We report our efforts on the development of Nb-based non-hysteretic Josephson junction fabrication process for quantu device applications. By adopting and modifying the existing Nb-aluminum oxide tunnel junction process, we develop a process for non-hysteretic Josephson junction circuits using metal-silicide as metallic barrier material. We use sputter deposition of Nb and $MoSi_2$, PECVD deposition of silicon oxide as insulator material, and ICP-RIE for metal and oxide etch. The advantage of the metal-silicide barrier in the Nb junction process is that it can be etched in $SF_6$ RIE together with Nb electrode. In order to define a junction area precisely and uniformly, end-point detection for the RIE process is critical. In this paper, we employed thin Al layer for the etch stop, and optimized the etch condition. We have successfully demonstrated that the etch stop properties of the inserted Al layer give a uniform etch profile and a precise thickness control of the base electrode in Nb trilayer junctions.

The study of characteristics on metallic electrical contacts to CdZnTe based X-ray image detectors (상부전극 물질에 따른 CdZnTe 박막 특성 비교 연구)

  • Gong, H.G.;Kang, S.S.;Cha, B.Y.;Jo, S.H.;Kim, J.H.;Nam, S.H.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07b
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    • pp.813-816
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    • 2002
  • We investigate the junction between CdZnTe and a variety of metals with the aim of determining whether the choice of metal can improve the performance of X-ray image detectors, in particular minimizing the dark current. The samples consist of $5{\mu}m$ thick CdZnTe with top electrodes formed from In, Al, and Au. For each metal, current transients following application of valtages from -10V to 10V are measured for up to 1 hour. We find that dark currents depending on the metal used. The current is controlled by hole injection at the metal-CdZnTe junction and there is consistent trend with the metal's work function possibly and it seems that metal to CdZnTe layer junction is ohmic contact.

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Fabrication and characterization of NbTi-Au-NbTi Josephson junctions

  • Pyeong Kang, Kim;Heechan, Bang;Bongkeon, Kim;Yong-Joo, Doh
    • Progress in Superconductivity and Cryogenics
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    • v.24 no.4
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    • pp.6-10
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    • 2022
  • We report on the fabrication and measurements of metallic Josephson junctions (JJs) consisting of Au nanoribbon and NbTi superconducting electrodes. The maximum supercurrent density in the junction reaches up to ~ 3×105 A/cm2 at 2.5 K, much larger than that of JJ using single-crystalline Au nanowire. Temperature dependence of the critical current exhibits an exponential decay behavior with increasing temperature, which is consistent with a long and diffusive junction limit. Under the application of a magnetic field, monotonous decrease of the critical current was observed due to a narrow width of the Au nanoribbon. Our observatons suggest that NbTi/Au/NbTi JJ would be a useful platform to develop an integrated superconducing quantum circuit combined with the superconducting coplanar waveguide and ferromagnetic π junctions.

Development of Contaminant Detection System using HTS SQUIDs

  • Ohtani, T.;Tanaka, S.;Narita, Y.;Ariyoshi, S.;Suzuki, S.
    • Progress in Superconductivity and Cryogenics
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    • v.17 no.4
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    • pp.38-42
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    • 2015
  • In terms of food safety,mixture of contaminants in food is a serious problem for not only consumers but also manufacturers. In general, the target size of the metallic contaminant to be removed is 0.5 mm. However, it is a difficult task for manufacturers to achieve this target, because of lower system sensitivity. Therefore, we developed a food contaminant detection system based on high-Tc RF superconducting quantum interference devices (SQUIDs), which are highly sensitive magnetic sensors. This study aims to improve the signal to noise ratio (SNR) of the system and detect a 0.5 mm diameter steel ball. Using a real time digital signal processing technique along with analog band-pass filters, we improved the SNR of the system. Owing to the improved SNR, a steel ball with a diameter as small as 0.3 mm, with stand-off distance of 117 mm was successfully detected. These results suggest that the proposed system is a promising candidate for the detection of metallic contaminants in food products.

Josephson Property and Magnetoresistance in Y$_1Ba_2Cu_3O_{7-x}$ and La$_{0.2}Sr_{0.8}MnO_3$ Films on Biepitaxial SrTiO$_3$/(MgO/)Al$_2O_3$(1120) (SrTiO$_3$/(MgO/)Al$_2O_3$(1120) 위에 쌍에피택셜하게 성장한 Y$_1Ba_2Cu_3O_{7-x}$와 La$_{0.2}Sr_{0.8}MnO_3$ 박막의 조셉슨 및 자기저항 특성연구)

  • Lee, Sang-Suk;Hwang, Do-Guwn
    • 한국초전도학회:학술대회논문집
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    • v.9
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    • pp.185-188
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    • 1999
  • Biepitaxial Y$_1Ba_2Cu_3O_{7-x}$ (YBCO) and La$_{0.2}Sr_{0.8}MnO_3$ (LSMO) thin films have been prepared on SrTiO$_3$ buffer layer and MgO seed layer grown on Al$_2O_3$(11${\bar{2}}$0)substrates by dc-sputtering with hollow cylindrical targets, respectively. We charaterized Josephson properties and significantly large magnetoresistance in YBCO and LSMO films with 45$^{\circ}$ grain boundary junction, respectively. The observed working voltage (I$_cR_n$) at 77 K in grain boundary junction was below 10${\mu}$V, which is typical I$_cR_n$ value of single biepitaxial Josephson junction. The field magnetoresistance ratio (MR) of LSMO grain boundary juncoon at 77K was enhanced to 13%, which it was significant MR value with high magnetic field sensitivity at a low field of 250 Oe. These results indicate that inserting the insulating layer instead of the grain boundary layer with metallic phase can be possible to apply a new SIS Josephson junction and a novel magnetic device using spin-polarized tunneling junction.

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Magnetotransport Properties of Co-Fe/Al-O/Co-Fe Tunnel Junctions Oxidized with Microwave Excited Plasma

  • Nishikawa, Kazuhiro;Orata, Satoshi;Shoyama, Toshihiro;Cho, Wan-Sick;Yoon, Tae-Sick;Tsunoda, Masakiyo;Takahashi, Migaku
    • Journal of Magnetics
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    • v.7 no.3
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    • pp.63-71
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    • 2002
  • Three fabrication techniques for forming thin barrier layer with uniform thickness and large barrier height in magnetic tunnel junction (MTJ) are discussed. First, the effect of immiscible element addition to Cu layer, a high conducting layer generally placed under the MTJ, is investigated in order to reduce the surface roughness of the bottom ferromagnetic layer, on which the barrier is formed. The Ag addition to the Cu layer successfully realizes the smooth surface of the ferromagnetic layer because of the suppression of the grain growth of Cu. Second, a new plasma source, characterized as low electron energy of 1 eV and high density of $10^{12}$ $cm^{-3}$, is introduced to the Al oxidation process in MTJ fabrication in order to reduce damages to the barrier layer by the ion-bombardment. The magnetotransport properties of the MTJs are investigated as a function of the annealing temperature. As a peculiar feature, the monotonous decrease of resistance area product (RA) is observed with increasing the annealing temperature. The decrease of the RA is due to the decrease of the effective barrier width. Third, the influence of the mixed inert gas species for plasma oxidization process of metallic Al layer on the tunnel magnetoresistance (TMR) was investigated. By the use of Kr-O$_2$ plasma for Al oxidation process, a 58.8 % of MR ratio was obtained at room temperature after annealing the junction at $300{^{\circ}C}$, while the achieved TMR ratio of the MTJ fabricated with usual Ar-$0_2$ plasma remained 48.4%. A faster oxidization rate of the Al layer by using Kr-O$_2$ plasma is a possible cause to prevent the over oxidization of Al layer and to realize a large magnetoresistance.