• Title/Summary/Keyword: metallic conductivity

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Comparison of the Fire Resistance Performance of Firestop Systems on Non-Metallic Pipes, Based on the Type of Through-Penetration Sleeve Used (비금속관 설비관통부의 슬리브 종류에 따른 내화성능 비교)

  • Jeong, A-Yeong;Choi, Hong-Beom;Park, Jin-O;Lee, Hyung-Do
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2023.05a
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    • pp.301-302
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    • 2023
  • In this study, we aimed to identify changes in fire resistance according to the type of sleeves used for pipe penetrations and to examine their accreditation of fire resistance performance and use them as basic data. The test results of fire resistance according to the type of sleeve used in non-metallic pipe facilities showed that the temperature on the support side was higher for sleeves with higher thermal conductivity. For the temperature on the surface of the pipes, in the case of galvanized steel plates, steel pipes, and structures without sleeves, the highest temperature was observed after the expansion of the firestop material for 46 to 53 minutes and then decreased. PVC sleeves showed a steady increase in temperature until 53 minutes, after which the temperature did not increase further. In addition, for non-metallic pipes, the effect of the type of sleeve on fire resistance is considered to be insignificant because the lower part (heating direction of the furnace) under the support structure is cut off to block the heat during the two-hour fire resistance test.

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Development of Surface Coating Technology fey Metallic Bipolar Plate in PEMFC : I. Study on Surface and Corrosion Properties (PEMFCB금속분리판 코팅 기술 개발 : I. 표면 및 부식 특성 평가)

  • Chung, Kyeong-Woo;Kim, Se-Yung;Yang, Yoo-Chang;Ahn, Seung-Gyun;Jeon, Yoo-Taek;Na, Sang-Mook
    • 한국신재생에너지학회:학술대회논문집
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    • 2006.11a
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    • pp.348-351
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    • 2006
  • Bipolar plate, which forms about 50% of the stack cost, is an important core part with polymer electrolyte membrane in PEMFC. Bipolar plates have been commonly fabricated from graphite meterial having high electrical conductivity and corrosion resistance. Lately, many researchers have concentrated their efforts on the development of metallic bipolar plate and stainless steel has been considered as a potential material for metallic bipolar plate because of its high strength, chemical stability, low gas permeability and applicability to mass production. However, it has been reported that its inadequate corrosion behavior under PEMFC environment lead to a deterioration of membrane by dissolved metal ions and an increase in contact resistance by the growth of passive film therefore, its corrosion resistance as well as contact resistance must be improved for bipolar plate application. In this work, several types of coating were applied to 316L and their electrical conductivity and corrosion resistance were evaluated In the simulated PEMFC environment. Application of coating gave rise to low interfacial contact resistances below $19m{\Omega}cm^2$ under the compress force of $150N/cm^2$. It also made the corrosion potential to shift in the posit ive direct ion by 0.3V or above and decreased the corrosion current from ca. $9{\mu}A/cm^2$ to ca. $0.5{\mu}A/cm^2$ in the mixed solution of $0.1N\;N_2SO_4$ and 2ppm HF A coat ing layer under potentiostatic control of 0.6V and $0.75V_{SCE}$ for 500 hours or longer showed some instabilities, however, no significant change in coat Ing layer were observed from Impedance data. In addition, the corrosion current maintained less than $1{\mu}A/cm^2$ for most of time for potentiostatic tests. It indicates that high electrical conductivity and corrosion resistance can be obtained by application of coatings in the present work.

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The growth of GaN on the metallic compound graphite substrate by HVPE (HVPE 방법에 의한 금속 화합물 탄소체 기판 위의 GaN 성장)

  • Kim, Ji Young;Lee, Gang Seok;Park, Min Ah;Shin, Min Jeong;Yi, Sam Nyung;Yang, Min;Ahn, Hyung Soo;Yu, Young Moon;Kim, Suck-Whan;Lee, Hyo Suk;Kang, Hee Shin;Jeon, Hun Soo;Sawaki, Nobuhiko
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.23 no.5
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    • pp.213-217
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    • 2013
  • The GaN layer was typical III-V nitride semiconductor and was grown on the sapphire substrate which cheap and convenient. However, sapphire substrate is non-conductivity, low thermal conductivity and has large lattice mismatch with the GaN layer. In this paper, the poly GaN epilayer was grown by HVPE on the metallic compound graphite substrate with good heat dissipation, high thermal and electrical conductivity. We tried to observe the growth mechanism of the GaN epilayer grown on the amorphous metallic compound graphite substrate. The HCl and $NH_3$ gas were flowed to grow the GaN epilayer. The temperature of source zone and growth zone in the HVPE system was set at $850^{\circ}C$ and $1090^{\circ}C$, respectively. The GaN epilayer grown on the metallic compound graphite substrate was observed by SEM, EDS, XRD measurement.

Thermal and Electronic Properties of Exfoliated Metal Chalcogenides

  • Kim, Jong-Young;Choi, Soon-Mok;Seo, Won-Seon;Cho, Woo-Seok
    • Bulletin of the Korean Chemical Society
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    • v.31 no.11
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    • pp.3225-3227
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    • 2010
  • The thermal conductivity of layered metal chalcogenides such as $MT_2$ (M = Mo, W; T = S, Se) shows a marked decrease after exfoliation and subsequent restacking process. Random stacking of two-dimensional crystalline sheets circumvents thermal conduction pathways along a longitudinal direction, which results in a reduction in thermal conductivity. $WS_2$ and $WSe_2$ compounds retain p-type conducting behavior after exfoliation and restacking with decreased electrical conductivity due to the change in carrier concentration. $MoSe_2$ compound exhibits metallic behavior < $130^{\circ}C$ with a small Seebeck coefficient, which results from metastable 1T-$MoSe_2$ structure of the restacked phase.

Electrical Conductivity and Electromagnetic Interference Shielding Characteristics of Polyaniline Films with Adding Material (첨가물질에 따른 폴리아닐린 필름의 전기전도도 및 전자기파 차폐특성)

  • 김재욱
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.1
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    • pp.1-6
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    • 1998
  • Polyaniline free standing films are prepared by various processing. The properties of these films such as electrical conductivity and electromagnetic shielding efficiency are investigated. The conductivities of films doped with a camphorsulfonic acid and a silver are found to be 170/cm and 190S/cm, respectively, indicating metallic behavior. The films added silver, which are casted from hydrochloric acid and dodecylbenzensulfonic acid, show that the electromagnetic shielding efficiency are obtained 42∼52dB and 46∼56dB in the frequency range of 10MHz∼1GHz, respectively. This suggests that the films added silver, which is casted from dodecylbenzensulfonic acid, can be used as electromagnetic shielding material.

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Growth and Characterization of Conducting ZnO Thin Films by Atomic Layer Deposition

  • Min, Yo-Sep;An, Cheng-Jin;Kim, Seong-Keun;Song, Jae-Won;Hwang, Cheol-Seong
    • Bulletin of the Korean Chemical Society
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    • v.31 no.9
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    • pp.2503-2508
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    • 2010
  • ZnO thin films were grown on Si or $SiO_2$/Si substrates, at growth temperatures ranging from 150 to $400^{\circ}C$, by atomic layer deposition (ALD) using diethylzinc and water. Despite the large band gap of 3.3 eV, the ALD ZnO films show high n-type conductivity, i.e. low resistivity in the order of $10^{-3}\;{\Omega}cm$. In order to understand the high conductivity of ALD ZnO films, the films were characterized with X-ray diffraction, transmission electron microscopy, X-ray photoelectron spectroscopy, elastic recoil detection, Rutherford backscattering, Photoluminescence, and Raman spectroscopy. In addition, the various analytical data of the ZnO films were compared with those of ZnO single crystal. According to our analytical data, metallic zinc plays an important role for the high conductivity in ALD ZnO films. Therefore when the metallic zinc was additionally oxidized with ozone by a modified ALD sequence, the resistivity of ZnO films could be adjusted in a range of $3.8{\times}10^{-3}\;{\sim}\;19.0\;{\Omega}cm$ depending on the exposure time of ozone.

Development status of microcell UO2 pellet for accident-tolerant fuel

  • Kim, Dong-Joo;Kim, Keon Sik;Kim, Dong Seok;Oh, Jang Soo;Kim, Jong Hun;Yang, Jae Ho;Koo, Yang-Hyun
    • Nuclear Engineering and Technology
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    • v.50 no.2
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    • pp.253-258
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    • 2018
  • A microcell $UO_2$ pellet, as an accident-tolerant fuel pellet, is being developed to enhance the accident tolerance of nuclear fuels under accident conditions as well as the fuel performance under normal operation conditions. Improved capture-ability for highly radioactive and corrosive fission product (Cs and I) is the distinct feature of a ceramic microcell $UO_2$ pellet, and the enhanced pellet thermal conductivity is that of a metallic microcell $UO_2$ pellet. The fuel temperature can be effectively decreased by enhanced thermal conductivity. In this study, the material concepts of metallic and ceramic microcell $UO_2$ pellets were designed, and the fabrication process of microcell $UO_2$ pellets embodying the designed concept was developed. We successfully implemented the microcell $UO_2$ pellets and produced microcell $UO_2$ pellets. In addition, an assessment of the out-of-pile properties of a microcell $UO_2$ pellet was performed, and the in-reactor performance and behavior of the developed microcell pellets were evaluated through a Halden irradiation test. According to the expectations, the excellent performance of the microcell $UO_2$ pellets was confirmed by the online measurement data of the Halden irradiation test.

A Study on Corrosion Resistance and Electrical Surface Conductivity of an Electrodeposited Ni-W Thin Film (전해도금에 의한 Ni-W 합금의 내식성 및 표면 전도도 특성 연구)

  • Park, Je-Sik;Jeong, Goo-Jin;Kim, Young-Jun;Kim, Ki-Jae;Lee, Churl-Kyoung
    • Journal of the Korean institute of surface engineering
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    • v.44 no.2
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    • pp.68-73
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    • 2011
  • A Ni-W thin-film was synthesized by electrodeposition, and its corrosion resistance and electrical surface conductivity were investigated. Amount of tungsten in the Ni-W thin-film increased linearly with current density during the electrodeposition, and crack-free and low-crystalline Ni-21 at.%W coating layer was obtained. Corrosion resistances of the Ni-W thin-films were examined with an anodic polarization method and a storage test in a strong sulfuric acid solution. As a result, the Ni-21 at.%W thin-film exhibited the greatest corrosion resistance, and maintained the electrical surface conductivity even after the severe corrosion test, which could be applicable as a surface treatment for advanced metallic bipolar plates in fuel cell or redox flow battery systems.

The Thermoelectric Properties of Fe-Si Alloys Prepared by RF Induction Furnace (고주파 진공유도로로 제작한 Fe-Si계 합금의 열전변환특성)

  • 박형진;배철훈
    • Journal of the Korean Ceramic Society
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    • v.37 no.7
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    • pp.632-637
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    • 2000
  • Thermoelectric conversion properties of commercial Fe-Si2 and Fe-Si alloy ingots prepared by RF inductive furnace were investigated. As sintering temperature increased, density of the specimen increased and the phase transformation from metallic phases ($\varepsilon$-FeSi, ${\alpha}$-Fe2Si5) to semiconducting phase (${\beta}$-FeSi2) occurred more effectively. The FeSi phase was detected even after 100hrs of annealing treatment. For the Fesi1.95∼FeSi2.05 specimens prepared by RF inductive furnace, the thermoelectric property improved as the composition of the specimen approached to stoichiometric composition FeSi2. Electrical conductivity of the specimen increased with increasing temperatures showing typical semiconducting behavior. From the electrical conductivity measurements, activation energy in the intrinsic region (above about 700 K) was calculated to be approximately 0.46 eV. In spite of non-doping, the Seebeck coefficient for every specimen exhibited p-type conduction due to Si deficiency. Its maximum value was located at about 475 K, and then decreased abruptly with increasing temperatures. The power factor was governed by the Seebeck coefficient of the specimen more significantly than by electrical conductivity.

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Thermal and mechanical properties of C/SiC composites fabricated by liquid silicon infiltration with nitric acid surface-treated carbon fibers

  • Choi, Jae Hyung;Kim, Seyoung;Kim, Soo-hyun;Han, In-sub;Seong, Young-hoon;Bang, Hyung Joon
    • Journal of Ceramic Processing Research
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    • v.20 no.1
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    • pp.48-53
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    • 2019
  • Carbon fiber reinforced SiC composites (C/SiC) have high-temperature stability and excellent thermal shock resistance, and are currently being applied in extreme environments, for example, as aerospace propulsion parts or in high-performance brake systems. However, their low thermal conductivity, compared to metallic materials, are an obstacle to energy efficiency improvements via utilization of regenerative cooling systems. In order to solve this problem, the present study investigated the bonding strength between carbon fiber and matrix material within ceramic matrix composite (CMC) materials, demonstrating the relation between the microstructure and bonding, and showing that the mechanical properties and thermal conductivity may be improved by treatment of the carbon fibers. When fiber surface was treated with a nitric acid solution, the observed segment crack areas within the subsequently generated CMC increased from 6 to 10%; moreover, it was possible to enhance the thermal conductivity from 10.5 to 14 W/m·K, via the same approach. However, fiber surface treatment tends to cause mechanical damage of the final composite material by fiber etching.