• 자원리싸이클링
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• 제25권4호
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• pp.42-48
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• 2016

주석도금폐액으로부터 고순도 주석 금속을 회수하는 연구를 실시하였다. 먼저 주석도금폐액을 Iminodiacetic 관능기를 가진 이온교환수지(Lewatit TP 207)를 사용하여 1차적으로 유기물 및 Fe, Zn, Na 등의 불순물을 제거하였고, 2차적으로 Ethylhexyl-phosphate의 관능기를 가진 이온교환수지(Lewatit VPOC 1026)를 사용하여 잔류하고 있는 불순물들을 모두 제거하여 고순도의 주석용액으로 회수하였다. 회수된 주석용액으로부터 고순도 금속주석으로 회수하기 위하여 사이클론식 전해방법을 사용하였으며, 전해채취 결과 약 99.98% 순도의 주석을 회수할 수 있었다.

• Macromolecular Research
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• 제10권2호
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• pp.103-107
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• 2002

High purity water soluble chitosans (WsCs) were employed as a flocculant to remove heavy metal ions from wastewater of industrial plating wastewater treatment complex. Their weight average molecular weights and polydispersities were 272,000~620,000 g/mol and 1.4~1.9 range, respectively and were readily soluble in water in the pH range of 3~11. Heavy metal ions such as chromium, iron and copper were removed well by WsCs. When WsCs was blended with either sodium N, N-diethyldithiocarbamate trihydrate (SDDC$_{T}$) or sodium salicylate (SSc), the removal efficiency was further increased primarily due to the excess amount of hydrophilic sulfonic and carboxylic groups. Especially, in the case of WsCs-SSc the remaining chromium and copper concentrations were 0.1 mg/L and 9.5 mg/L, which are 1/15 and 1/3 compared with that of pure WsCs, respectively. The former is within the acceptable limit, but the latter is not. Therefore, the effective copper flocculant remains to be studied.d.

• 대한금속재료학회지
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• 제49권11호
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• pp.905-909
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• 2011

The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surfaces. One of the available front metal contacts is Ni/Cu plating, which can be mass produced via asimple and inexpensive process. A selective emitter, meanwhile, involves two different doping levels, with higher doping (${\leq}30{\Omega}/sq$) underneath the grid to achieve good ohmic contact and low doping between the grid in order to minimize the heavy doping effect in the emitter. This study describes the formation of a selective emitter and a nickel silicide seed layer for the front metallization of silicon cells. The contacts were thickened by a plated Ni/Cu two-step metallization process on front contacts. The experimental results showed that the Ni layer via SEM (Scanning Electron Microscopy) and EDX (Energy dispersive X-ray spectroscopy) analyses. Finally, a plated Ni/Cu contact solar cell displayed efficiency of 18.10% on a $2{\times}2cm^2$, Cz wafer.

• 한국분말재료학회지
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• 제22권2호
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• pp.134-137
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• 2015

The monolayer engineering diamond particles are aligned on the oxygen free Cu plates with electroless Ni plating layer. The mean diamond particle sizes of 15, 23 and $50{\mu}m$ are used as thermal conductivity pathway for fabricating metal/carbon multi-layer composite material systems. Interconnected void structure of irregular shaped diamond particles allow dense electroless Ni plating layer on Cu plate and fixing them with 37-43% Ni thickness of their mean diameter. The thermal conductivity decrease with increasing measurement temperature up to $150^{\circ}C$ in all diamond size conditions. When the diamond particle size is increased from $15{\mu}m$ to $50{\mu}m$ (Max. 304 W/mK at room temperature) tended to increase thermal conductivity, because the volume fraction of diamond is increased inside plating layer.

• 한국표면공학회지
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• 제43권2호
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• pp.64-72
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• 2010

CuSnZn electroplating was investigated as alternative to Ni plating. Evaluation of electrolyte and plating process was performed to control physical characteristics of the film, and to collect practical data for application. Hull-cell test was conducted for basic comparison of two commercialized products and developed product. Based on hull-cell test results, long term test of three electrolytes was performed. Various analysis on long term tested electrolyte and samples have been done. Reliable and practical data was collected using FE-SEM (FEI, Sirion), EDX (ThermoNoran SIX-200E), ICP Spectrometer (GBC Scientifi c, Integra XL), FIB (FEI, Nova600) for anlysis. Physical analysis and reliability test of the long term tested film were also carried out. Through this investigation plating time, plating speed, electrolyte composition, electrolyte metal consumption, hardness and corrosion resistance has been compared. This set of data is used to predict and control the chemical composition of the film and modify the physical characteristics of the CuSnZn alloy.

• Membrane and Water Treatment
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• 제10권3호
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• pp.239-244
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• 2019

Plating wastewater containing various heavy metals can be produced by several industries. Specifically, we focused on the removal of copper (Cu2+) and nickel (Ni+) ions from the plating wastewater because all these ions are strictly regulated when discharged into watershed in Korea. The application of both nanofiltration (NF) and reverse osmosis (RO) technologies for the treatment of wastewater containing copper and nickel ions to reduce fresh water consumption and environmental degradation was investigated. In this work, the removal of copper (Cu2+) and nickel (Ni+) ions from synthetic water was studied on pilot scale remove by before using two commercial nanofiltration (NF) and reverse osmosis(RO) spiral-wound membrane modules (NE2521-90 and RE2521-FEN by Toray Chemical). The influence of main operating parameters such as feed concentration on the heavy metals rejection and permeate flux of both membranes, was investigated. Synthetic plating wastewater samples containing copper ($Cu^{2+}$) and nickel ($Ni^{2+}$) ions at various concentrations(1, 20, 100, 400 mg/L) were prepared and subjected to treatment by NF and RO in the pilot plant. The results showed that NF, RO process, with 98% and 99% removal for copper and nickel, respectively, could achieve high removal efficiency of the heavy metals.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2013년도 춘계학술대회 논문집
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• pp.133-134
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• 2013

본 연구는 비전도성 소재 상에 무전해 동도금(Electroless Copper)시 수행되는 씨앗층이나 촉매공정 없이 직접 구리 석출물을 얻는 방법 중 하나에 관한 연구이다. 실리콘 웨이퍼상에 확산방지를 위한 Ta 금속확산방지(Metal barrier)막층 형성 후 무전해 동도금에 침지 후 최소한의 전류를 인가한 결과 균일한 구리피막을 얻을 수 있었으며, 표면 및 단면 조직 분석결과 이를 확인할 수 있었다.

• 세라미스트
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• 제21권2호
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• pp.83-88
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• 2018

There is close relation between the heat generation and the performance of electronic device. The durability and efficiency of the device are degraded due to heat generation. It is necessary to release the generated heat from an electronic device. Based on demands of the printed circuit board (PCB) manufacturing, the robust and reliable plating technique of PCB is necessary. In this study, we review various methods for improving the heat sink property. These methods were considered to enhance the adhesion between ceramic substrate as heat sink and metal layer as electrode.

• 대한치과교정학회지
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• 제28권1호
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• pp.123-133
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• 1998

TiN ion-plating된 Co-Cr 선재(.016", .016"x.022")와 ion-plating되지 않은 선재(.016", .016"x.022")를 이용하고, 3 가지 종류의 브라켓(TiN ion-plating된 금속 브라켓, 세라믹 브라켓 및 플라스틱 브라켓)을 대상으로 마찰실험을 행하고, 거기에서 얻어진 마찰 특성곡선과 곡선으로부터 구한 최대 정지마찰력, 그리고 선재와 브라켓의 표면양상을 주사전자현미경으로 관찰하여 TiN ion-plating의 효과를 검토한 결과 다음과 같은 결론을 얻었다. $\cdot$3가지 종류의 브라켓에 TiN ion-plating된 선재를 사용한 경우의 마찰력은 TiN ion-plating되지 않은 선재를 사용한 경우의 마찰력보다 각각 통계학적으로 유의성있게 낮았다(p<0.05). $\cdot$3가지 종류의 브라켓에 원형 선재를 사용한 경우의 마찰력은 각형 선재를 사용한 경우의 마찰력보다 각각 통계학적으로 유의성있게 낮았다(p<0.05). $\cdot$원형 선재를 사용한 경우 TiN ion-plating되지 않은 선재를 사용한 경우가 TiN ion-plating된 선재를 사용한 경우보다 선재 및 브라켓 슬롯의 표면이 더욱 거친 양상을 나타내었다. $\cdot$각형 선재를 사용한 경우 전반적으로 원형 선재를 사용한 경우보다 선재 및 브라켓 슬롯의 표면이 더욱 거친 양상을 나타내었다. $\cdot$TiN ion-plating된 원형 선재를 사용한 경우 정지마찰력과 운동마찰력의 차는 별로 없었으나 TiN ion-plating된 각형 선재를 사용한 경우 정지마찰력은 운동마찰력보다 다소 높았다. $\cdot$TiN ion-plating되지 않은 선재를 사용한 경우가 TiN ion-plating된 선재를 사용한 경우에 비해 정지마찰력이 운동마찰력보다 휠씬 높았다.

• 한국생물공학회:학술대회논문집
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• 한국생물공학회 2000년도 춘계학술발표대회
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• pp.357-360
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• 2000

Biosorption process is an economic and potential process for metal sequestering from the water. The oxidized Undaria pinnatifida by nitric acid had high uptake capacity for heavy metals of 4 - 6 meq / g dry mass. For the application of oxidized Undaria pinnatifida, recovery of metal in plating wastewater was studied. The uptake capacity of the oxidized Undaria pinnatifida was high compared to the ion exchanger IR-120 plus. The treatment efficiency of chromium and copper in the wastewater was 85% In batch. Activated carbon was used to assist the recovery of water by removing organic matters of the wastewater.