• Journal of the Korean institute of surface engineering
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• v.26 no.6
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• pp.327-333
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• 1993

The effect of heat treatment on the adhesion between Cu-18wt% Cr film and polyimide has been studied by using T-peel test, AES, and XRD. Cu-18wt% Cr alloy and pure Cu films were sputter deposited onto pol-yimide. Cu was electroplated before and after heat treatment at $400^{\circ}C$ for 0.5 hr and 2 hrs respectively. The adhesion of metal film onto polyimide was considerably good before heat treatment, but heat treatment re-duced the peel adhesion strength in all specimens. The reduction in adhesion in adhesion strength values in the specimens which were plated after heat treatment was mainly due to Cr-O rich pahse formed in the metal/polyimide in-terface. In the specimens which were heat treated after plating, the enhanced ductility in the metal films con-tributes the peel adhesion strength by increasing the amount of deformation in metal strips.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.270-271
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• 2008

The contact resistance between organic semiconductor and source-drain electrode in Bottom Contact Organic Thin-Film Transistors (BCOTFTs) can be effectively reduced by metal oxide/molybdenum double layer structure; metal oxide layers including nickel oxide (NiOx/Mo) and moly oxide(MoOx) under molybdenum work as a high performance carrier injection layer. Step profiles of source-drain electrode can be easily achieved by simultaneous etching of the double layers using the difference etching rate between metal oxides and metal layers.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.13-17
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• 2014

The direct-patternable $SnO_2$ thin film was successfully fabricated by photochemical metal-organic deposition. The composition and chemical bonding state of $SnO_2$ thin film were analyzed by using X-ray photoelectron spectroscopy (XPS) from the surface to the interface with Si substrate. XPS depth profiling analysis allowed the determination of the atomic composition in $SnO_2$ film as a function of depth through the evolution of four elements of C 1s, Si 2p, Sn 3d, and O 1s core level peaks. At the top surface, nearly stoichiometric $SnO_2$ composition (O/Sn ratio is 1.92.) was observed due to surface oxidation but deficiency of oxygen was increased to the interface of patterned $SnO_2/Si$ substrate where the O/Sn ratio was about 1.73~1.75 at the films. This O deficient state of the film may act as an n-type semiconductor and allow $SnO_2$ to be applied as a transparent electrode in optoelectronic applications.

• Transactions on Electrical and Electronic Materials
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• v.12 no.3
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• pp.110-114
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• 2011

Polymeric films of high chemical stability and mechanical strength covered with a thin metallic film have been extensively used in various fields as electric and electronic materials. In this study, we have chosen polypropylene (PP) as the polymer due to its outstanding chemical resistance and good creep resistance. We coated thin nickel film on PP films by the electroless plating process. The surfaces of PP films were pre-treated and modified to increase the adhesion strength of metal layer on PP films, prior to the plating process, by an environment-friendly process with atmospheric plasma generated using dielectric barrier discharges in air. The surface morphologies of the PP films were observed before and after the surface modification process using a scanning electron microscope (SEM). The static contact angles were measured with deionized water droplets. The cross-sectional images of the PP films coated with thin metal film were taken with SEM to see the combined state between metallic and PP films. The adhesion strength of the metallic thin films on the PP films was confirmed by the thermal shock test and the cross-cutting and peel test. In conclusion, we made a composite material of metallic and polymeric films of high adhesion strength.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.635-636
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• 2013

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.92.1-92.1
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1583-1584
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• 2011

• Journal of the Korean Electrochemical Society
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• v.25 no.1
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• pp.42-49
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• 2022

In this study, the surface protection film based on organic-inorganic composite is manufactured for suppressing lithium dendrite growth, and the film is applied on the surface of Li metal negative electrode for lithium metal batteries (LMBs). The film is consist of the polyvinylidene fluoride (PVDF) polymeric binder which has good mechanical strength and high electrochemical stability, and carbon black (Super-P) which has outstanding electrical conductivity as the inorganic compound. First, in order to confirm the suppression of the internal short circuit by the lithium dendrite, the time required for the short circuit is measured while a constant current is continuously applied. As a result, the internal short circuit is delayed in proportion to the carbon black content of the film, and it is significantly delayed than bare Li metal electrode which does not use protection film. The cycle performance of the thick protection film (8 ㎛), is worse than that of the thin film (4 ㎛). However, as the carbon black content of the film increased, the cycle performance is improved. Thus, the surface protection film based on carbon black/PVDF composite can delay the internal short circuit, and has low overvoltage during the cycle. However, more stable cycle performance needs to be built through further improvements.

• Journal of the Speleological Society of Korea
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• no.75
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• pp.49-54
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• 2006

Electrophoretic Deposition (EPD) is the most convenient technology to deposit natural or oxide powders of nonconductive materials in alcoholic suspension solution with adding electrolyte of iodine to form ceramic thick film on metal substrate under applied electric field with double electric layer between electrode and metal substrate. In this research work, the important parameters and technical ways were studied to form EPD thick films of typical oxide ceramics of Al2O3, YBCO and tourmaline powders.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.259-264
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• 2000

Systematic research of metal alkoxide electrophoretic deposition has been developed. The formation mechanism of electrophoretic deposits has been offered. The structure study of dry and heat-treated electrophoretic deposits has been established. The concrete examples of one and bi-component oxide thin film formation were considered. The new approaches for thin film technology have developed on various substrates of different shapes and sizes. The correlation between thin film structure, mechanism of their formation, and physico-chemical properties has been determined.