• 제목/요약/키워드: metal coating

검색결과 935건 처리시간 0.027초

Ni/MH 전지에서 Cu 도금에 의한 음극활물질의 전극 특성 향상 (An Improvement in the Properties of MH Electrode of Ni/MH Battery by the Copper Coating)

  • 조진훈;김인중;이윤성;남기석;김기주;이홍기
    • 공업화학
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    • 제8권4호
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    • pp.568-574
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    • 1997
  • Ni/MH전지에서 Cu 도금이 MH(metal hydride)음극의 전극 특성에 미치는 영향을 실험적으로 조사하였다. $LaNi_5$와 Cu도금된 $LaNi_5$를 활물질로 사용하여 냉간압착법과 페이스트법의 혼용법으로 전극을 제조하였다. 그 결과 소량의 CMC(carboxymethylcellulose sodium salt)를 첨가하고 열처리를 행하지 않은 전극이 높은 방전용량을 보였다. $LaNi_5$보다는 Cu 도금된 $LaNi_5$를 활물질로 사용하여 제조한 전극의 방전용량이 증가하였으며, 이는 $LaNi_5$표면에 도금된 구리에 의해 전극의 전자 전도도가 증가되었기 때문이며 도금된 구리의 양이 증가할 수록 그 효과는 현저하였다. 또한 전극의 방전용량은 산성 무전해도금의 경우가 알칼리성 무전해도금을 행한 전극보다 우수한 용량을 나타내었다. Al이 첨가된 $LaNi_{4.5}Al_{0.5}$ 전극이 $LaNi_5$전극보다 우수한 방전용량을 보였다. 구리 도금이 $LaNi_5$의 피독특성에 미치는 영향을 CO기체의 피독실험으로 조사하였다.

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Sol-Gel 법으로 제작한 Zn1-xCoxO 박박의 미세조직 및 자기적 특성 (Microstructure and Magnetic Properties of Zn1-xCoxO Thin Films Grown by Sol-Gel Process)

  • 고윤덕;태원필;김응권;김기출;최춘기;김종민;송준태;박태석;서수정;김용성
    • 한국세라믹학회지
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    • 제42권7호
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    • pp.475-482
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    • 2005
  • Zn$_{l-x}$Co$_{x}$O (x = 0.05 - 0.20) films were grown on Coming 7059 glass by sol-gel process. A homogeneous and stable Zn$_{l-x}$Co$_{x}$O sol was prepared by dissolving zinc acetate dihydrate (Zn(CH$_{3}$COO)$_{2}$$\cdot$2H$_{2}$O), cobalt acetate tetrahydrate ((CH$_{3}$)$_{2}$$\cdot$CHOH) and aluminium chloride hexahydrate (AlCl$_{3}$ $\cdot$ 6H$_{2}$O) as solute in solution of isopropanol ((CH$_{3}$)$_{2}$$\cdot$CHOH) and monoethanolamine (MEA:H$_{2}$NCH$_{2}$CH$_{2}$OH). The films grown by spin coating method were postheated in air at 650°C for 1 h and annealed in the condition of vacuum (5 $\times$ 10$^{-6}$ Torr) at 300$^{\circ}C$ for 30 min and investigated the nature of c-axis preferred orientation and physical properties with different Co concentrations. Znl_xCOxO thin films with different Co concentrations were well oriented along the c-axis, but especially a highly c-axis oriented Zn$_{l-x}$Co$_{x}$O thin film was grown at 10 at$\%$ Co concentration. The transmittance spectra showed that Zn$_{l-x}$Co$_{x}$O thin films occur typical d-d transitions and sp-d exchange interaction became activated with increasing Co concentration. The electrical resistivity of the films at 10 at$\%$ Co had the lowest value due to the highest c-axis orientation. X-ray photoelectron spectroscopy and alternating gradient magnetometer analyses indicated that no Co metal cluster was formed, and the ferromagnetic properties appeared, respectively. The characteristics of the electrical resistivity and room temperature ferromagnetism of Zn$_{l-x}$Co$_{x}$O thin films suggested the possibility for the application to dilute magnetic semiconductors.

PEMOCVD of Ti(C,N) Thin Films on D2 Steel and Si(100) Substrates at Low Growth Temperatures

  • Kim, Myung-Chan;Heo, Cheol-Ho;Boo, Jin-Hyo;Cho,Yong-Ki;Han, Jeon-Geon
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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    • pp.211-211
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    • 1999
  • Titanium nitride (TiN) thin films have useful properties including high hardness, good electrical conductivity, high melting point, and chemical inertness. The applications have included wear-resistant hard coatings on machine tools and bearings, decorative coating making use of the golden color, thermal control coatings for widows, and erosion resistant coatings for spacecraft plasma probes. For all these applications as feature sizes shrink and aspect ratios grow, the issue of good step coverage becomes increasingly important. It is therefore essential to manufacture conformal coatings of TiN. The growth of TiN thin films by chemical vapor deposition (CVD) is of great interest for achieving conformal deposition. The most widely used precursor for TiN is TiCl4 and NH3. However, chlorine impurity in the as-grown films and relatively high deposition temperature (>$600^{\circ}C$) are considered major drawbacks from actual device fabrication. To overcome these problems, recently, MOCVD processes including plasma assisted have been suggested. In this study, therefore, we have doposited Ti(C, N) thin films on Si(100) and D2 steel substrates in the temperature range of 150-30$0^{\circ}C$ using tetrakis diethylamido titanium (TDEAT) and titanium isopropoxide (TIP) by pulsed DC plamsa enhanced metal-organic chemical vapor deposition (PEMOCVD) method. Polycrystalline Ti(C, N) thin films were successfully grown on either D2 steel or Si(100) surfaces at temperature as low as 15$0^{\circ}C$. Compositions of the as-grown films were determined with XPS and RBS. From XPS analysis, thin films of Ti(C, N) with low oxygen concentration were obtained. RBS data were also confirmed the changes of stoichiometry and microhardness of our films. Radical formation and ionization behaviors in plasma are analyzed by optical emission spectroscopy (OES) at various pulsed bias and gases conditions. H2 and He+H2 gases are used as carrier gases to compare plasma parameter and the effect of N2 and NH3 gases as reactive gas is also evaluated in reduction of C content of the films. In this study, we fond that He and H2 mixture gas is very effective in enhancing ionization of radicals, especially N resulting is high hardness. The higher hardness of film is obtained to be ca. 1700 HK 0.01 but it depends on gas species and bias voltage. The proper process is evident for H and N2 gas atmosphere and bias voltage of 600V. However, NH3 gas highly reduces formation of CN radical, thereby decreasing C content of Ti(C, N) thin films in a great deal. Compared to PVD TiN films, the Ti(C, N) film grown by PEMOCVD has very good conformability; the step coverage exceeds 85% with an aspect ratio of more than 3.

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HIPIMS Arc-Free Reactive Deposition of Non-conductive Films Using the Applied Material ENDURA 200 mm Cluster Tool

  • Chistyakov, Roman
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.96-97
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    • 2012
  • In nitride and oxide film deposition, sputtered metals react with nitrogen or oxygen gas in a vacuum chamber to form metal nitride or oxide films on a substrate. The physical properties of sputtered films (metals, oxides, and nitrides) are strongly influenced by magnetron plasma density during the deposition process. Typical target power densities on the magnetron during the deposition process are ~ (5-30) W/cm2, which gives a relatively low plasma density. The main challenge in reactive sputtering is the ability to generate a stable, arc free discharge at high plasma densities. Arcs occur due to formation of an insulating layer on the target surface caused by the re-deposition effect. One current method of generating an arc free discharge is to use the commercially available Pinnacle Plus+ Pulsed DC plasma generator manufactured by Advanced Energy Inc. This plasma generator uses a positive voltage pulse between negative pulses to attract electrons and discharge the target surface, thus preventing arc formation. However, this method can only generate low density plasma and therefore cannot allow full control of film properties. Also, after long runs ~ (1-3) hours, depends on duty cycle the stability of the reactive process is reduced due to increased probability of arc formation. Between 1995 and 1999, a new way of magnetron sputtering called HIPIMS (highly ionized pulse impulse magnetron sputtering) was developed. The main idea of this approach is to apply short ${\sim}(50-100){\mu}s$ high power pulses with a target power densities during the pulse between ~ (1-3) kW/cm2. These high power pulses generate high-density magnetron plasma that can significantly improve and control film properties. From the beginning, HIPIMS method has been applied to reactive sputtering processes for deposition of conductive and nonconductive films. However, commercially available HIPIMS plasma generators have not been able to create a stable, arc-free discharge in most reactive magnetron sputtering processes. HIPIMS plasma generators have been successfully used in reactive sputtering of nitrides for hard coating applications and for Al2O3 films. But until now there has been no HIPIMS data presented on reactive sputtering in cluster tools for semiconductors and MEMs applications. In this presentation, a new method of generating an arc free discharge for reactive HIPIMS using the new Cyprium plasma generator from Zpulser LLC will be introduced. Data (or evidence) will be presented showing that arc formation in reactive HIPIMS can be controlled without applying a positive voltage pulse between high power pulses. Arc-free reactive HIPIMS processes for sputtering AlN, TiO2, TiN and Si3N4 on the Applied Materials ENDURA 200 mm cluster tool will be presented. A direct comparison of the properties of films sputtered with the Advanced Energy Pinnacle Plus + plasma generator and the Zpulser Cyprium plasma generator will be presented.

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3D 스캔 시 품질향상을 위한 스프레이 도포 자동화 장비 개발 (Development of Auto-spray system to improve the quality of 3D Scanning Quality)

  • 김원섭;조재흥;김동수;김동규;홍석무
    • 한국산학기술학회논문지
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    • 제17권4호
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    • pp.100-105
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    • 2016
  • 3D 프린터의 증가에 따라 대량 생산이 아닌 소량 제품의 빠른 개발 시간을 고려하여 3D 스캐너의 활용도 점차 증가하고 있다. 소량 생산 개발 트렌드뿐만 아니라 최근 자동차 및 전자부품의 제조업에 있어서도 정밀 부품의 개발 및 검사, 측정 등의 품질 문제가 중요한 이슈로 떠오르고 있다. 최근 3D 스캐너 장비 효율성 및 인식기술은 지속적으로 향상되었지만, 이에 반해, 이를 준비하는 스프레이 작업은 시간이 많이 걸리고 환경문제가 유발되기 때문에 제조업 제품 개발자들은 자동스프레이 도포 시스템 개발에 대해 지속적으로 요구해 왔다. 본 연구를 통해서 3D 스캔 준비 작업으로 필요한 스프레이 자동 도포 장비를 개발하였으며, 스프레이 도포 시 균일하게 미세 분말이 도포 될 수 있도록 파라미터 세팅에 대해 실험적으로 연구하였다. 결과적으로 빠르고 쉬운 자동 스프레이 도포 장비가 개발 되었고, 이를 활용해서 3D 측정을 위한 준비 시간이 기존 대비 1/10수준으로 단축되었다. 또한 다양한 조건에 대한 비교를 통해 최적의 도포 조건을 실험적으로 제시하였다.

표면처리가 다른 5종 임플랜트의 안정성에 관한 연구 (A STUDY ON THE STABILITY OF 5 DIFFERENT SURFACE TREATMENT METHODS TO DENIAL IMPLANT USING RESONANCE FREQUENCY AND HISTOMORPHOMETRIC ANALYSIS)

  • 김선종;신상완;정성민;류재준
    • 대한치과보철학회지
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    • 제43권1호
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    • pp.78-94
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    • 2005
  • Purpose. The purpose of this study was to compare the effects of various surface treatments by measuring resonance frequency and histomorphometric analyses. Material and methods. In 5 adult dogs, the mandibular premolar were extracted. Six months later, 30 screw titanium implants (Dentium Co., Seoul, Korea) 6mm in length and 3.4mm in diameter, were placed in the mandibles of 5 dogs. Implants were divided into five groups following to surface treatment methods ; Group 1 is machined controls, Group 2 is sandblasted with large grit and acid-etched (SLA), Group 3 is anodized (Autoelectric Co., Korea, 660Hz, Duty10), Group 4 is hydroxyapatite(HA) coated by ion beam assisted deposition(E-beam), Group 5 is hydroxyapatite(HA) coated with Sol-gel coating process. Resonance frequency was measured implant placement immediately, and 3, 6 weeks and 10 weeks of healing perods. With the animal subject's sacrifice 10 weeks after implantation, implants were removed on bloc and histologic and computer-based histomorphometric analyses were performed. Histomorphometric analysis involved quantification of the entire bone to metal contact around the implants. Statistical analyses were performed using the SPSS for Windows (ver. 9.0 SPSS Inc.) Statistical differences were considered significant at P<0.05. Results. The results were as follows : 1) In five groups, mean value of resonance frequency analysis(RFA) were highest in group 5 (Sol-gel implant) at implantation and those of group 4 (E-beam)was highest at 10 weeks . but there was no correlation between surface treatments and RFA. 2) In all surface treatment groups, the RFA values of implants decreased until 3 weeks and increased to 10 weeks. 3) The percentage of direct bone-to-implant contact (BIC) had statistical significance between five groups in cancellous bone, (P<0.05) the percentage of bone density inside the thread had no statistical significance between five groups. (P>0.05) 4) There was a significant difference between cortical bone and cancellous bone in BIC. (P<0.05) and bone density. (P<0.05) 5) There was a correlation between the RFA value of implants at 10 weeks and BIC in cancellous bone, and between the RFA value of implants at 10 weeks and bone density in cortical bone. (P<0.05). Conclusions. These results indicate that surface treatment does not affect the implant stability in case of good bone quality.

Effects of Curing Temperature on the Optical and Charge Trap Properties of InP Quantum Dot Thin Films

  • Mohapatra, Priyaranjan;Dung, Mai Xuan;Choi, Jin-Kyu;Jeong, So-Hee;Jeong, Hyun-Dam
    • Bulletin of the Korean Chemical Society
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    • 제32권1호
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    • pp.263-272
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    • 2011
  • Highly luminescent and monodisperse InP quantum dots (QDs) were prepared by a non-organometallic approach in a non-coordinating solvent. Fatty acids with well-defined chain lengths as the ligand, a non coordinating solvent, and a thorough degassing process are all important factors for the formation of high quality InP QDs. By varying the molar concentration of indium to ligand, QDs of different size were prepared and their absorption and emission behaviors studied. By spin-coating a colloidal solution of InP QD onto a silicon wafer, InP QD thin films were obtained. The thickness of the thin films cured at 60 and $200^{\circ}C$ were nearly identical (approximately 860 nm), whereas at $300^{\circ}C$, the thickness of the thin film was found to be 760 nm. Different contrast regions (A, B, C) were observed in the TEM images, which were found to be unreacted precursors, InP QDs, and indium-rich phases, respectively, through EDX analysis. The optical properties of the thin films were measured at three different curing temperatures (60, 200, $300^{\circ}C$), which showed a blue shift with an increase in temperature. It was proposed that this blue shift may be due to a decrease in the core diameter of the InP QD by oxidation, as confirmed by the XPS studies. Oxidation also passivates the QD surface by reducing the amount of P dangling bonds, thereby increasing luminescence intensity. The dielectric properties of the thin films were also investigated by capacitance-voltage (C-V) measurements in a metal-insulator-semiconductor (MIS) device. At 60 and $300^{\circ}C$, negative flat band shifts (${\Delta}V_{fb}$) were observed, which were explained by the presence of P dangling bonds on the InP QD surface. At $300^{\circ}C$, clockwise hysteresis was observed due to trapping and detrapping of positive charges on the thin film, which was explained by proposing the existence of deep energy levels due to the indium-rich phases.

EFFECTS OF SURFACE ROUGHNESS AND MULTILAYER COATING ON THE CORROSION RESISTANCE OF Ti-6Al-4V ALLOY

  • Ko, Yeong-Mu;Choe, Han-Cheol
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2003년도 추계학술발표회초록집
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    • pp.134-135
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    • 2003
  • The dental implant materials required good mechanical properties, such as fatigue strength, combined with a high resistance to corrosion. For increasing fatigue resistance and delaying onset of stress corrosion cracking, shot peening has been used for > 50 years to extend service life of metal components. However, there is no information on the electrochemical behavior of shot peened and hydroxyapatite(HA) coated Ti-6Al-4V alloys. To increase fatigue strength, good corrosion resistance, and biocompatibility, the electrochemical characteristics of Ti/TiN/HA coated and shot peened Ti-6Al-4V alloys by electron beam physical vapor deposition(EB-PVD) have been researched by various electrochemical method in 0.9%NaCl. Ti-6Al-4V alloys were prepared under the condition of hydrogen and vacuum arc furnace. The produced materials were quenched at 1000$^{\circ}C$ under high purity dried Ar atmosphere and were hold at 500$^{\circ}C$ for 2 hrs to achieve the fatigue strength(1140㎫) of materials. Ti-6Al-4V alloys were prepared under the condition of hydrogen and vacuum arc furnace. Shot peening(SP) and sand blasting treatment was carried out for 1, 5, and 10min. On the surface of Ti-6Al-4V alloys using the steel balls of 0.5mm and alumina sand of 40$\mu\textrm{m}$ size. Ti/TiN/HA multilayer coatings were carried out by using electron-beam deposition method(EB-PVD) as shown Fig. 1. Bulk Ti, powder TiN and hydroxyapatite were used as the source of the deposition materials. Electrons were accelerated by high voltage of 4.2kV with 80 - 120mA on the deposition materials at 350$^{\circ}C$ in 2.0 X 10-6 torr vacuum. Ti/TiN/HA multilayer coated surfaces and layers were investigated by SEM and XRD. A saturated calomel electrode as a reference electrode, and high density carbon electrode as a counter electrode, were set according to ASTM GS-87. The potentials were controlled at a scan rate of 100 mV/min. by a potentiostat (EG&G Co.273A) connected to a computer system. Electrochemical tests were used to investigate the electrochemical characteristics of Ti/TiN/HA coated and shot peened materials in 0.9% NaCl solution at 36.5$^{\circ}C$. After each electrochemical measurement, the corrosion surface of each sample was investigated by SEM.

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불용성 전극의 전처리 방법이 전극의 수명에 미치는 영향 (The Effect of Pre-Treatment Methods for the Life Time of the Insoluble Electrodes)

  • 박미정;이택순;강미아;한치복
    • 대한환경공학회지
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    • 제38권6호
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    • pp.291-298
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    • 2016
  • 불용성 전극은 전기화학 공정에 있어 가장 핵심적인 소재이며, 이를 이용한 전기화학적 수처리 공정은 난분해성 물질을 제거하는 유용한 방법으로서 이에 대한 연구가 지속적으로 이루어져 오고 있다. 전기화학적 수처리 공정은 주로 산화전극에서의 산화반응과 환원전극에서의 환원반응을 이용하는 것이다. 본 연구에서는 불용성 전극의 제조공정에서 전처리 방법이 전극의 수명에 미치는 영향을 평가하였다. 실험결과 촉매전극층을 코팅하는 물질계 및 코팅방법을 동일하게 하는 경우에도 기판의 전처리 방법 즉, 기판표면의 조도, 세정방법, 중간층 형성 여부 및 방법 등에 따라 전극의 수명이 크게 달라지는 것을 확인하였다. 실험은 가장 많이 사용되는 전극의 하나인 $IrO_2/Ti$ 전극을 대상으로 하였다. 샌드 블라스팅 공정의 경우 입도를 달리하는 샌딩 미디어를 이용하여 전극을 제조하고 이에 대한 수명을 평가한 결과 #80알루미나(입도 $212{\sim}180{\mu}m$)를 이용하는 경우가 가장 효과적인 것으로 나타났다. 기판에 대한 세정 공정은 arc plasma를 이용하는 것이 가장 우수하였으며, 중간층을 형성함에 있어서는 스퍼터링법을 이용하여 Ta 계열의 중간층을 형성하는 방법을 적용하는 것이 가장 바람직한 것으로 확인되었다.

인위적으로 열화된 황색절연링형 금속플렉시블호스의 패턴 및 특성 (Patterns and Characteristics of Corrugated Stainless Steel Tubing for a Yellow Insulation Ring Type by Artificially Deteriorated)

  • 이장우;최충석
    • 한국화재소방학회논문지
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    • 제32권6호
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    • pp.1-6
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    • 2018
  • 본 논문은 배관용으로 사용되고 있는 황색절연링형(yellow insulation ring type) 금속플렉시블호스(CSST)를 인위적으로 열화(deterioration)시켜 소손되었을 때의 특성을 분석하는데 있다. 배관용 CSST는 튜브, 보호피막, 너트, 황색절연링, 패킹(packing), 이음쇠(socket)로 구성되어 있다. 그리고 튜브와 이음쇠 접속은 기밀성과 절연성능 향상을 위해 황색절연링과 고무 패킹을 사용한 것으로 판단된다. 실험에서 얻은 데이터를 95% 신뢰 구간에서 검증한 결과 AD (Anderson-Darling)는 0.945, P값은 0.015로 해석되었다. 배관용 CSST의 실험 데이터는 신뢰성이 있다는 것이 확인되었다. 가스 토치에 의해서 소손된 CSST의 산술적 평균 절연저항은 $16.7k{\Omega}$으로 가장 컸으며, 전기적인 소손을 입은 CSST는 상대적으로 가장 낮은 $208{\Omega}$, 정상 제품은 $1.72k{\Omega}$으로 분석되었다. 그러므로 화재 현장에서 수거한 CSST의 절연저항 값을 분석하면 소손 원인 판정에 활용할 수 있을 것이다. 또한, 대전류공급장치(PCITS)로 CSST에 최대 전류 97 A를 약 5 s 동안 흘린 결과 보호피막 및 절연링은 정상 제품과 차이가 없었으나 금속 튜브의 일부에서 용융이 형성된 것을 확인할 수 있었다.