• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
• /
• pp.357-358
• /
• 2013

The non-linear characteristics of ON states are important for the application to the high density cross-point memory industry because the sneak current in neighbor cells occurred during reading, erasing, and writing process. Kw of above 20 in ON states, which is the writing current @ Vwrite/the current @ 1/2Vwrite, was required in cross-point ReRAM memory industry. The high current density non-linear IV curve of ZnSe selector was shown and the ALD HfO2 switching device has the linear properties of ON states and the compliance current of 100 uA. To evaluate the performance of the selection device, we connected itto HfO2 switching device in series. The bottom electrode of the selection device was connected to the top electrode of the RRAM. All of the bias was applied with respect to the top electrode of the selection device, whereas the bottom electrode of the RRAM was grounded. In the cross-point application, 1/2Vwrite and -1/2Vwrite were applied to the word-line and bit-line, respectively, which were connected to the selected cell, and a zero bias was applied to the unselected word-lines and bit-lines. The current @ 1/2Vwrite of the unselected cells was blocked by the selection device, thus eliminating the sneak path and obtaining a writing voltage margin. Using this method, the writing voltage margin was analyzed on the basis of the memory size.

• 한국산업융합학회 논문집
• /
• 제25권2_1호
• /
• pp.169-176
• /
• 2022

Prognostics and health management (PHM) is recently converging throughout the industry, one of the trending issue is to detect abnormal conditions at decanter centrifuge during water treatment facilities. Wastewater treatment operation produces corrosive gas which results failures on attached sensors. This scenario causes frequent sensor replacement and requires highly qualified manager's visual inspection while replacing important parts such as bearings and screws. In this paper, we propose anomaly detection by measuring the vibration of the decanter centrifuge based on the video camera images. Measuring the vibration of the screw decanter by applying the optical flow technique, the amount of movement change of the corresponding pixel is measured and fed into the LST M model. As a result, it is possible to detect the normal/warning/dangerous state based on LSTM classification. In the future work, we aim to gather more abnormal data in order to increase the further accuracy so that it can be utilized in the field of industry.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2018년도 춘계학술대회 논문집
• /
• pp.102-102
• /
• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• 한국엔터테인먼트산업학회논문지
• /
• 제13권8호
• /
• pp.627-633
• /
• 2019

본 연구는 지역사회 노인을 대상으로 컴퓨터 기반 인지재활 프로그램 적용 시 백색소음이 기억력과 주의력에 미치는 영향을 알아보고자 하였다. 지역사회에 거주하는 70세 이상 노인 30명을 대상으로 연구를 진행하였다. 컴퓨터 기반 인지재활 프로그램은 COMCOG를 이용하여 총 6주간, 주 3회 30분의 프로그램으로 구성하였다. 기억력 및 주의력이 변화를 알아보기 위해 전산화 신경인지 기능 검사를 실시하였다. 기억력과 주의력은 실험군과 대조군 모두 실험 전에 비해 실험 후 향상되었음을 알 수 있었으며, 통계적으로 유의한 차이를 나타내었다(p<.05). 실험 후 집단 간 비교 검사 결과, 대조군과 실험군에 차이를 나타내었다. 기억력 검사에서는 역방향 시공간 폭 검사를 제외한 나머지 검사에서 통계적으로 유의한 차이를 나타내었으며(p<.05), 주의력 검사에서는 청각적 연속수행 및 시각적 연속수행 검사의 정반응 수에서 통계적으로 유의한 차이를 나타내었다(p<.05). 이상의 결과를 통해 컴퓨터 인지재활 프로그램이 노인의 기억력과 주의력 향상에 효과적이며, 백색소음 환경은 프로그램을 수행하는데 더욱 집중할 수 있도록 긍정적인 영향을 주는 것을 알 수 있었다.

• 한국IT서비스학회지
• /
• 제16권4호
• /
• pp.149-160
• /
• 2017

Sentiment analysis is the process of determining whether a piece of document, text or conversation is positive, negative, neural or other emotion. Sentiment analysis has been applied for several real-world applications, such as chatbot. In the last five years, the practical use of the chatbot has been prevailing in many field of industry. In the chatbot applications, to recognize the user emotion, sentiment analysis must be performed in advance in order to understand the intent of speakers. The specific emotion is more than describing positive or negative sentences. In light of this context, we propose deep learning models for conducting multi-class sentiment analysis for identifying speaker's emotion which is categorized to be joy, fear, guilt, sad, shame, disgust, and anger. Thus, we develop convolutional neural network (CNN), long short term memory (LSTM), and multi-layer neural network models, as deep neural networks models, for detecting emotion in a sentence. In addition, word embedding process was also applied in our research. In our experiments, we have found that long short term memory (LSTM) model performs best compared to convolutional neural networks and multi-layer neural networks. Moreover, we also show the practical applicability of the deep learning models to the sentiment analysis for chatbot.

• Design & Manufacturing
• /
• 제10권2호
• /
• pp.50-54
• /
• 2016

In the semiconductor industry the final products were checked for several environments before sell the products. The burning test of memory and chip was implemented in reliability for all of parts. The memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. In this study, injection molding process analysis was executed for 2 and 4 cavities moldings with runner, gate and sprue. The warpage analysis was also implemented for further gate removal process. Through the analyses the total deformations of the moldings were predicted within maximum 0.05mm deformation. Finally in consideration of these results, 2 and 4 cavities molds were designed and made and tested in injection molding process.

• 한국정보처리학회논문지
• /
• 제6권7호
• /
• pp.1849-1857
• /
• 1999

메모리 기반 추론에서 기억공간의 효율적인 사용과 분류성능의 향상을 위하여, 재귀 분할 평균 기법을 제안하였다. 이 알고리즘은 패턴공간을 구성하는 각 초월 평면이 동일한 클래스소속으로 패턴으로 구성될 때까지 재귀적으로 분할한 후, 초월 평면별로 소속된 패턴들의 평균값을 계산하여 대표패턴을 추출한다. 또한 각 특징과 클래스간의 상호정보를 특징의 가중치로 사용하여 분류 성능의 향상을 시도하였다. 제안된 알고리즘은 k-NN(k-Nearest Neighbors) 분류기에서 필요로 하는 메모리 공간의 30~90%만을 사용하며, 분류에 있어서도 k-NN과 유사한 인식 성능을 보이고 있다. 또한 저장된 패턴 개수의 감소로 인하여, 실제 분류에 소요되는 시간에 있어서도 k-NN보다 월등히 우수한 성능을 보이고 있다.

• 한국의류산업학회지
• /
• 제24권6호
• /
• pp.812-824
• /
• 2022

This study proposes to develop a 3D printed re-entrant(RE) strip by shape memory thermoplastic polyurethane that can be deformed and recovered by thermal stimulation. The most suitable 3D printing infill density condition and temperature condition during shape recovery for mechanical behavior were confirmed. As the poisson's ratio indicated, the higher the recovery temperature, the closer the poisson's ratio to zero and the better the auxetic properties. After recovery testing for five minutes, it appeared that the shape recovery ratio was the highest at 70℃. The temperature range when the shape recovery ratio appeared to be more than 90% was a recovery temperature of more than 50℃ and 60℃ when deformed under a constant load of 100 gf and 300 gf, respectively. This indicated that further deformation occurred after maximum recovery when recovered at a temperature of 80℃, which is above the glass transition temperature range. As for REstrip by infill density, a shape recovery properties of 100% was superior than 50%. Additionally, as the re-entrant structure exhibited a shape recovery ratio of more than 90%, and exhibited auxetic properties. It was confirmed that the infill density condition of 100% and the temperature condition of 70℃ are suitable for REstrips for applying the actuator.

• 반도체디스플레이기술학회지
• /
• 제22권3호
• /
• pp.8-13
• /
• 2023

High bandwidth memory a core technology of the future memory semiconductor industry, is attracting attention. Temporary bonding and debonding process technology, which plays an important role in high bandwidth memory process technology, is also being studied. In this process, total thickness variation is a major factor determining wafer performance. In this study, the reliability of the equipment measuring total thickness variation is identified, and the servo motor settling, and wafer total thickness variation measurement accuracy are analyzed. As for the experimental variables, vacuum, acceleration time, and speed are changed to find the most efficient value by comparing the stabilization time. The smaller the vacuum and the larger the radius, the longer the settling time. If the radius is small, high-speed rotation performance is good, and if the radius is large, low-speed rotation performance is good. In the future, we plan to conduct an experiment to measure the entire of the wafer.

• International Journal of Precision Engineering and Manufacturing
• /
• 제8권1호
• /
• pp.21-26
• /
• 2007

In industry, multihead automatic combination weighers are used to provide accurate weights at high speed. To minimize giveaway, greater accuracy is desired, especially for valuable products. This paper describes a combination algorithm based on bit operation. The combination method is simple and saves time, since only the elements to be considered for combination are generated. The total number of combinations from which the desired output weight is chosen can be increased by extending the combination from memory hoppers to include some weighing hoppers. For an eight-channel weigher, three or four combination elements are best. In addition to targeting approximately equal amounts of products in each channel, this study investigated other schemes. Simulation results show that schemes targeting combination elements with an unequal distribution of the output weight are more accurate. The most accurate scheme involves supplying products to all memory and weighing hoppers before commencing the combination operation. However, this scheme takes more time.