• Journal of the Korean Society of Safety
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• v.36 no.5
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• pp.86-91
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• 2021

Calculating the scrutable core damage frequency (CDF) of nuclear power plants is an important component of the seismic probabilistic safety assessment (SPSA). In this work, a simple approach is developed to calculate CDF from minimal cut sets (MCSs) with non-rare events. When conventional calculation methods based on rare event approximations are employed, the CDF of industry SPSA models is significantly overestimated by non-rare events in the MCSs. Recently, quantification algorithms using binary decision diagrams (BDDs) have been introduced to prevent CDF overestimation in the SPSA. However, BDD structures are generated from a small part of whole MCSs due to limited computational memory, and they cannot be reviewed due to their complicated logic structure. This study suggests a simple approach for scrutinizing the CDF calculation based on whole MCSs in the SPSA system analysis model. The proposed approach compares the new results to outputs from existing algorithms, which helps in avoiding CDF overestimation.

• Journal of the Korea Society of Computer and Information
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• v.24 no.9
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• pp.1-8
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• 2019

In this paper, we propose a performance isolation of shared space for virtualized SSD based storage systems, to solve the weakness in a VSSD framework. The proposed scheme adopts a CFQ scheduler and a shared space-based FTL for the fairness and the performance isolation for multiple users on virtualized SSD based storage systems. Using the CFQ scheduler, we ensure SLOs for the storage systems such as a service time, a allocated space, and a IO latency for users on the virtualized storage systems. In addition, to improve a throughput and reduce a computational latency for garbage collection, a shared space-based FTL is adopted to maintain the information of SLOs for users and it manages shared spaces among the users. In our experiments, the proposal improved the throughput of garbage collection by 7.11%, on average, and reduced the computational latency for garbage collection by 9.63% on average, compared to the previous work.

• Journal of the Korea Society of Computer and Information
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• v.24 no.7
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• pp.1-8
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• 2019

Recently, an SSD with hybrid buffer memories is actively researching to reduce the overall latency in server computing systems. However, existing hybrid buffer policies caused many swapping operations in pages because it did not consider the overall latency such as read/write operations of flash chips in the SSD. This paper proposes the clock with hybrid buffer memories (CLOCK-HBM) for a new hybrid buffer policy in the SSD with server computing systems. The CLOCK-HBM constructs new policies based on unique characteristics in both DRAM buffer and NVMs buffer for reducing the number of swapping operations in the SSD. In experimental results, the CLOCK-HBM reduced the number of swapping operations in the SSD by 43.5% on average, compared with LRU, CLOCK, and CLOCK-DNV.

• International Journal of Internet, Broadcasting and Communication
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• v.11 no.2
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• pp.50-58
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• 2019

The clear and specific objective of this study is to design a false news discriminator algorithm for news articles transmitted on a text-based basis and an architecture that builds it into a system (H/W configuration with Hadoop-based in-memory technology, Deep Learning S/W design for bigdata and SNS linkage). Based on learning data on actual news, the government will submit advanced "fake news" test data as a result and complete theoretical research based on it. The need for research proposed by this study is social cost paid by rumors (including malicious comments) and rumors (written false news) due to the flood of fake news, false reports, rumors and stabbings, among other social challenges. In addition, fake news can distort normal communication channels, undermine human mutual trust, and reduce social capital at the same time. The final purpose of the study is to upgrade the study to a topic that is difficult to distinguish between false and exaggerated, fake and hypocrisy, sincere and false, fraud and error, truth and false.

• Journal of Software Assessment and Valuation
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• v.17 no.2
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• pp.19-29
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• 2021

Blockchain technology fulfills the reliance requirement and is now entering a new stage of performance. However, the current blockchain technology has significant disadvantages in scalability and latency because of its architecture. Therefore, to adopt blockchain technology to real industry, we must overcome the performance issue by redesigning blockchain architecture. This paper introduces several element technologies and a novel blockchain architecture TPAC, that preserves blockchain's technical advantage but shows more stable and faster transaction processing performance and low latency.

• Journal of Platform Technology
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• v.11 no.2
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• pp.3-14
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• 2023

This paper proposes a big data sentiment analysis method and deep learning implementation method to provide a webtoon comment analysis web page for convenient comment confirmation and feedback of webtoon writers for the development of the cartoon industry in the video animation field. In order to solve the difficulty of automatic analysis due to the nature of Internet comments and provide various sentiment analysis information, LSTM(Long Short-Term Memory) algorithm, ranking algorithm, and word2vec algorithm are applied in parallel, and actual popular works are used to verify the validity. If the analysis method of this paper is used, it is easy to expand to other domestic and overseas platforms, and it is expected that it can be used in various video animation content fields, not limited to the webtoon field

• International conference on construction engineering and project management
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• 2015.10a
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• pp.179-182
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• 2015

Detecting and assessing human-related risks is critical to improve the on-site safety condition and reduce the loss in lives, time and budget for construction industry. Recent research in neural science and psychology suggest inattentional blindness that caused by overload in working memory is the major cause of unexpected human related accidents. Due to the limitation of human mental workload, laborers are vulnerable to unexpected hazards while focusing on complicated and dangerous construction tasks. Therefore, detecting the risk perception abilities of workers could help to identify vulnerable individuals and reduce unexpected injuries. However, there are no available measurement approaches or devices capable of monitoring construction workers' mental conditions. The research proposed in this paper aims to develop such a measurement framework to evaluate hazards through monitoring electroencephalogram of labors. The research team developed a wearable safety monitoring helmet, which can collect the brain waves of users for analysis. A bispectrum approach has been developed in this paper to enrich the data source and improve accuracy.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.38-47
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• 2023

Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.1-7
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• 2023

Recently, in the semiconductor industry, memory device market is focusing on producing ultra-thin wafers for high integration. In the wafer manufacturing process, wafers after backgrinding and CMP process must be picked up as individual dies and subjected to be peeled off from the dicing tape. However, ultra-thin dies are vulnerable to the possibility of breakage and failure in their thickness and size. This research studies the mechanism of peeling a die with a high-aspect ratio using a thermopneumatic method instead of a die ejector with physical pins. Setting compressed air and the temperature as main factors, we determine the success of the digester using thermopneumatic system and analyze the good die to find the possibility of making mass-production equipment.

• Electronics and Telecommunications Trends
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• v.39 no.3
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• pp.1-12
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• 2024

As the demand for high-performance semiconductors, such as chips for artificial intelligence and high-bandwidth memory devices, increases along with the limitations of ultrafine processing technology in the semiconductor in-line process, advanced packaging becomes an increasingly important breakthrough technology for further improving semiconductor performance. Major countries, including Korea, the United States, Taiwan, and China, and large companies are strengthening their technological industry capabilities through the development of advanced packaging technology and policy support. Nevertheless, Korea has a lower level of development of related technologies by approximately 66% compared with the most advanced countries. Therefore, we aim to discover the needs for an advanced packaging research and development (R&D) policy through written expert interviews and importance satisfaction analysis. As a result, various implications for R&D policy directions are suggested to strengthen the technological capabilities and R&D ecosystem of the Korean advanced packaging technology.