• International Journal of Precision Engineering and Manufacturing
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• 제2권1호
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• pp.81-86
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• 2001

This paper deals with the monitoring of grinding wheel wear in surface grinding process. A monitoring system, which makes use of a laser scanning micrometer, is developed to measure the circumferential shape as well as the axial profile of grinding wheel. The monitoring system is applied to surface grinding processes. The experimental results show that the developed monitoring system is useful not only for monitoring the amount of wear in grinding wheel but also for evaluation the quality of ground surface and determining proper derssing time for the grinding wheel.

• 한국기계가공학회지
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• 제15권5호
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• pp.73-79
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• 2016

In this paper, the grinding characteristics in thrust internal grinding have been studied using vitreous CBN wheels with a machining center. Grinding experiments have been performed according to grinding conditions such as wheel feed speed, cut depth, workpiece speed, rate of grinding width and number of grinding passes. The machining error, shape of machined surfaces, grinding force, and surface roughness have been investigated though these experiments. Based on the experimental results, the grinding characteristics on the machined surface in the internal thrust grinding are discussed.

• International Journal of Precision Engineering and Manufacturing
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• 제4권3호
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• pp.62-67
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• 2003

The grinding force generated during the grinding process causes an elastic deformation of the workpiece, grinding wheel, and machine system. Thus, the true depth of cut is always smaller than the apparent depth of cut. This is known as machining elasticity phenomenon. The machining elasticity parameter is defined as a ratio between the true depth of cut and the apparent depth of cut. It is an important factor to understand the material removal mechanism of the grinding process. To increase productivity, the value of this machining elasticity parameter must be large. Therefore, it is essential to know the characteristics of this parameter. The objective of this research is to study the effect of the major grinding conditions, such as table speed, depth of cut, on this parameter experimentally, Through this research, it is found that this parameter value is increasing when the table speed is decreasing or the depth of cut is increasing. Also, this parameter value depends on the grinding mode (up grinding, down grinding).

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1996년도 춘계학술대회 논문집
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• pp.108-113
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• 1996

Conventionally, grinding of stainless steel, aluminium alloy, copper alloy, and titanum alloy is difficult due to the mechanical properties such as low hardness, high toughness which result in the loading of wheel and the poor surface finish. In order to grind this sort of materials easily, discontinuous grinding wheel with multi-porous grooves was newly developed. The multi-porous grooves were formed during wheel production. This discontinuous grinding wheel drastically increases the grinding performance. It is desirable to use the discontinuous grinding wheel when grinding materials with high efficiency and accuracy which is impossible by conventional wheels. In this paper, the construction and manufacturing method of grinding wheel with multi-porous grooves are explained. The grinding charateristics of discontinuous grinding wheel was also illustrated.

• 한국기계가공학회지
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• 제19권8호
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• pp.8-14
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• 2020

In the air current pulverizing type grinding method, the blade wings fitted inside a casing are rotated at a high speed to generate a cornering air current, which facilitates the collision of materials with one another, leading to the pulverizing phenomenon. In contrast to mechanical grinding, grit pulverizing leads to fine grinding and less acid waste and degeneration of the material. Moreover, this approach prevents the loss of nutritional value, while allowing the milling grain to have an excellent texture. However, the existing air current pulverizing type machines consist of prefabricated blades, which cannot be rotated at a speed higher than 5,000 rpm. Consequently, the grinding process becomes time consuming with a low productivity. To overcome these problems, in this study, the shape and structure of the air current pulverizing type wings were optimized to allow rapid grinding at more than 8,000 rpm. Moreover, the optimal design for the ripening parts for the air current pulverizing type device was determined by performing a computational fluid dynamics analysis based on airflow analyses to produce machinery that can grinding materials to the order of micrometers.

• Tribology and Lubricants
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• 제35권6호
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• pp.323-329
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• 2019

Sapphire is currently used as a substrate material for blue light-emitting diodes (LEDs). The market for sapphire substrates has expanded rapidly as the use of LEDs has extended into various industries. However, sapphire is classified as one of the most difficult materials to machine due to its hardness and brittleness. Recently, a lap-grinding process has been developed to combine the lapping and diamond mechanical polishing (DMP) steps in a single process. This paper studies, the effect of wafer surface roughness on the chemical mechanical polishing (CMP) process by pressure and abrasive concentration in the lap-grinding process of a sapphire wafer. In this experiment, the surface roughness of a sapphire wafer is measured after lap-grinding by varying the pressure and abrasive concentration of the slurry. CMP is carried out under pressure conditions of 4.27 psi, a plate rotation speed of 103 rpm, head rotation speed of 97 rpm, and slurry flow rate of 170 ml/min. The abrasive concentration of the CMP slurry was 20wt, implying that the higher the surface roughness after lapgrinding, the higher the material removal rate (MRR) in the CMP. This is likely due to the real contact area and actual contact pressure between the rough wafer and polishing pad during the CMP. In addition, wafers with low surface roughness after lap-grinding show lower surface roughness values in CMP processes than wafers with high surface roughness values; therefore, further research is needed to obtain sufficient surface roughness before performing CMP processes.

• 대한금속재료학회지
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• 제50권12호
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• pp.949-953
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• 2012

$MgH_2$ was employed as a starting material instead of Mg in this work. A sample with a composition of 94 wt% $MgH_2-6$ wt% Ni (called $MgH_2-6Ni$) was prepared by reactive mechanical grinding. The hydriding and dehydriding properties were then examined. An $MgH_2-Ni$ hydrogen storage alloy that does not require an activation process was developed. The alloy was prepared in a planetary ball mill by grinding for 4 h at a ball disc revolution speed of 250 rpm under a hydrogen pressure of about 12 bar. The sample absorbed 3.74 wt% H for 5 min, 4.07 wt% H for 10 min, and 4.41 wt% H for 60 min at 573 K under 12 bar $H_2$, and desorbed 0.93 wt% H for 10 min, 1.99 wt% H for 30 min, and 3.16 wt% H for 60 min at 573 K under 1.0 bar $H_2$. $MgH_2-6Ni$ after reactive mechanical grinding contained ${\beta}-MgH_2$ (a room temperature form of $MgH_2$), Ni, ${\gamma}-MgH_2$ (a high pressure form of $MgH_2$), and a very small amount of MgO. Reactive mechanical grinding of Mg with Ni is considered to facilitate nucleation, and to reduce the particle size of Mg. $Mg_2Ni$ formed during reactive mechanical grinding also increases the hydriding and dehydriding rates of the sample.

• Design & Manufacturing
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• 제16권1호
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• pp.50-54
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• 2022

Coverglass of electronic equipments is thinner and slimmer, so the glass must have good bending strength. In these days, the polishing edge of glass is used by solid tool like grinding wheel. But solid tool leave micro crack or edge chipping in edge of glass. MR polishing is an optimal method by polishing edge of glass. MR polishing is used MR fluid that is a liquid tool. MR polishing doesn't leave tool path or residual stress, micro crack and edge chipping unlike grinding wheel polishing. In this paper, the results of grinding and MR polishing were compared and analyzed to improve bending strength by minimizing edge chipping of cover glass. It was derived that the depth and size of cracks have a significant influence on the bending strength of the glass edge. The edges of the glass using MR grinding were analyzed to have a better surface and higher bending strength than the glass using abrasive wheel grinding. It was confirmed that MR polishing had an effect on strength improvement by effectively removing cracks in the specimen.

• 대한기계학회논문집A
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• 제24권2호
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• pp.338-346
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• 2000

Although the net-shape molding of composites is generally recommended, molded composites are frequently required cutting or grinding due to the dimensional inaccuracy for precision machine elements . During the composite machining operations such as cutting and grinding, the temperature at the cutting point may increase beyond the allowed limit due to the low thermal conductivity of composites, which might degrade the matrix of composite. Therefore, in this work, the temperature at the cutting point during cut-off grinding of carbon fiber epoxy composites was measured. The cutting force and surface roughness were also measured to investigate the cut-off grinding characteristics of the composites. The experiments were performed both under dry and wet grinding conditions with respect to cutting speed and feed rate. From the experimental investigation, the optimal conditions for the composite cut-off grinding were suggested.

• 대한기계학회논문집A
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• 제23권6호
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• pp.1011-1017
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• 1999

Electrolytic in-process dressing grinding technique which enables application of metal bond wheels with fine superabrasives in mirror surface grinding operations has developed. It is possible to make efficient precision machining of hard and brittle material such as ceramic and hard metal by the employment of this technique. However, in order to ensure the success of performances such as efficient machining, surface finish, and surface quality, it is important to sustain the insulating layer that has sharply exposed abrasives in wheel surface. Using AE(Acoustic Emission) sensor, this paper will show whether the insulating layer sustains stably or not in real grinding time. And by comparing AErms value and surface roughness their thresholds for stable electrolytic in-process dressing grinding will be determined.