• 제목/요약/키워드: mechanical connection

검색결과 549건 처리시간 0.03초

Distribution of shear force in perforated shear connectors

  • Wei, Xing;Shariati, M.;Zandi, Y.;Pei, Shiling;Jin, Zhibin;Gharachurlu, S.;Abdullahi, M.M.;Tahir, M.M.;Khorami, M.
    • Steel and Composite Structures
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    • 제27권3호
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    • pp.389-399
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    • 2018
  • A perforated shear connector group is commonly used to transfer shear in steel-concrete composite structures when the traditional shear stud connection is not strong enough. The multi-hole perforated shear connector demonstrates a more complicated behavior than the single connector. The internal force distribution in a specific multi-hole perforated shear connector group has not been thoroughly studied. This study focuses on the load-carrying capacity and shear force distribution of multi-hole perforated shear connectors in steel-concrete composite structures. ANSYS is used to develop a three-dimensional finite element model to simulate the behavior of multi-hole perforated connectors. Material and geometric nonlinearities are considered in the model to identify the failure modes, ultimate strength, and load-slip behavior of the connection. A three-layer model is introduced and a closed-form solution for the shear force distribution is developed to facilitate design calculations. The shear force distribution curve of the multi-hole shear connector is catenary, and the efficiency coefficient must be considered in different limit states.

Critical Cleaning Requirements for Flip Chip Packages

  • Bixenman, Mike;Miller, Erik
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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    • pp.43-55
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    • 2000
  • In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

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Non-linear analysis of side-plated RC beams considering longitudinal and transversal interlayer slips

  • Kolsek, Jerneja;Hozjan, Tomaz;Kroflic, Ales;Saje, Miran;Planinc, Igor
    • Steel and Composite Structures
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    • 제16권6호
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    • pp.559-576
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    • 2014
  • A new mathematical model and its finite element formulation for the non-linear stress-strain analysis of a planar beam strengthened with plates bolted or adhesively bonded to its lateral sides is presented. The connection between the layers is considered to be flexible in both the longitudinal and the transversal direction. The following assumptions are also adopted in the model: for each layer (i.e., the beam and the side plates) the geometrically linear and materially non-linear Bernoulli's beam theory is assumed, all of the layers are made of different homogeneous non-linear materials, the debonding of the beam from the side-plates due to, for example, a local buckling of the side plate, is prevented. The suitability of the theory is verified by the comparison of the present numerical results with experimental and numerical results from literature. The mechanical response arising from the theoretical model and its numerical formulation has been found realistic and the numerical model has been proven to be reliable and computationally effective. Finally, the present formulation is employed in the analysis of the effects of two different realizations of strengthening of a characteristic simply supported flexural beam (plates on the sides of the beam versus the tension-face plates). The analysis reveals that side plates efficiently enhance the bearing capacity of the flexural beam and can, in some cases, outperform the tensile-face plates in a lower loss of ductility, especially, if the connection between the beam and the side plates is sufficiently stiff.

Experimental investigation of force-distribution in high-strength bolts in extended end-plate connections

  • Abdalla, K.M.;Abu-Farsakh, G.A.R.;Barakat, S.A.
    • Steel and Composite Structures
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    • 제7권2호
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    • pp.87-103
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    • 2007
  • This paper presents some of the results from an experimental research project on the behavior of extended end-plate connections subjected to moment conducted at the Structural Laboratory of Jordan University of Science and Technology. Since the connection behavior affects the structural frame response, it must be included in the global analysis and design. In this study, the behavior of six full-scale stiffened and unstiffened cantilever connections of HEA- and IPE-sections has been investigated. Eight high strength bolts were used to connect the extended end-plate to the column flange in each case. Strain gauges were installed inside each of the top six bolts in order to obtain experimentally the actual tension force induced within each bolt. Then the connection behavior is characterized by the tension force in the bolt, extended end-plate behavior, moment-rotation relation, and beam and column strains. Some or all of these characteristics are used by many Standards; therefore, it is essential to predict the global behavior of column-beam connections by their geometrical and mechanical properties. The experimental test results are compared with two theoretical (equal distribution and linear distribution) approaches in order to assess the capabilities and accuracy of the theoretical models. A simple model of the joint is established and the essential parameters to predict its strength and deformational behavior are determined. The equal distribution method reasonably determined the tension forces in the upper two bolts while the linear distribution method underestimated them. The deformation behavior of the tested connections was characterized by separation of the column-flange from the extended end-plate almost down to the level of the upper two bolts of the lower group and below this level the two parts remained in full contact. The neutral axis of the deformed joint is reasonably assumed to pass very close to the line joining the upper two bolts of the lower group. Smooth monotonic moment-rotation relations for the all tested frames were observed.

Vibration Analysis of an Elevated Railroad Station Considering Station-Bridge Connection Characteristics (교량 접속부 특성을 고려한 선하역사의 진동 해석)

  • Choi, Sanghyun;Kwon, Soonjung
    • Journal of the Society of Disaster Information
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    • 제10권2호
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    • pp.274-281
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    • 2014
  • Since the vibration induced by a train is transferred directly to a station via a roadbed structure, the elevated station is particularly vulnerable to noise and vibration. To establish more appropriate measures to reduce vibration, the structural behavior and damping characteristics depending on the structural type and the composition of a elevated station should be identified, because the noise inside the station is mainly structure borne noise by the vibration of a station structure. In this paper, the vibration characteristic changes depending on mechanical connection types between an elevated station and a connected bridge are analyzed. The finite element model for Daecheon Station is constructed for the purpose of this study, and the analysis is performed using ABAQUS. The analyses are conducted for with and without bridge connections, and for the bridge connections, ramen and bearing types are considered in the analysis.

Design of a Chain-Type Modular Robot (체인형 모둘러 로봇의 설계)

  • Lee, Bo-Hee;Lee, Sang-Kyung;Kong, Jung-Shik
    • Journal of the Korean Institute of Intelligent Systems
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    • 제19권5호
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    • pp.674-682
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    • 2009
  • The modular robot is one which was developed to get over limit of the space movement for the mobile robot. The chain type robot in particular is connected by series each other and this form expression method is simple and easy to really make a docking method efficiently. However, the related studies were focused on the movement that used to be combination, and the movement of a cell independent mainly does not consist and have a problem to dock only in a direction, not to be connected with all directions. Therefore, we suggested a modular structure for quick, independent movement to solve such a problem and had own autonomy. In addition, we are intended to get some effectiveness for connection mechanism using one locking motor. In this paper, we dealt with the design for the mechanical and electrical points and docking algorithm including communication method. All of the structure is verified with real action experiment through the shape expressions of various application platform.

Energy-dispersive X-ray spectroscopic investigation of a fractured non-submerged dental implant associated with abutment fracture

  • Truc Thi Hoang Nguyen;Mi Young Eo;Kezia Rachellea Mustakim;Mi Hyun Seo;Hoon Myoung;Soung Min Kim
    • Journal of the Korean Association of Oral and Maxillofacial Surgeons
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    • 제49권1호
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    • pp.43-48
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    • 2023
  • The biocompatibility and durability of implant fixtures are major concerns for dentists and patients. Mechanical complications of the implant include abutment screw loosening, screw fracture, loss of implant prostheses, and implant fracture. This case report aims to describe management of a case of fixture damage that occurred after screw fracture in a tissue level, internal connection implant and microscopic evaluation of the fractured fixture. A trephine bur was used to remove the fixture, and the socket was grafted using allogeneic bone material. The failed implant was examined by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS), which revealed a fractured fixture with both normal and irregular bone patterns. The SEM and EDS results give an enlightenment of the failed fixture surface micromorphology with microfracture and contaminated chemical compositions. Noticeably, the significantly high level of gold (Au) on the implant surface and the trace amounts of Au and titanium (Ti) in the bone tissue were recorded, which might have resulted from instability and micro-movement of the implant-abutment connection over an extended period of time. Further study with larger number of patient and different types of implants is needed for further conclusion.

Mechanical Characteristics of High Tension Bolted Joint Connections using Shear Ring (전단링을 사용한 고장력볼트 이음부의 역학적 특성에 관한 연구)

  • Lee, Seung Yong;Park, Young Hoon
    • KSCE Journal of Civil and Environmental Engineering Research
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    • 제26권2A호
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    • pp.327-338
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    • 2006
  • Friction type high tension bolted joints is one of the most common steel structure connections and requires significant concerns on axial force of the bolts. However, its high shear capacity is not appropriately considered in design and hence the number of bolts is over-designed than actually required. It is primarily due to a slip-load-based design method. This study, therefore, suggests a new technology of connection using a shear ring, which may reduce the shortcomings from the friction-typed high tension bolted joints and maximize the advantages from the bearing-typed joints. Experimental and numerical studies were performed to compare the capacity of the suggested method with traditional high tension bolted joints. From the results, it is known that the suggested connections has higher bearing capacity than friction-typed high tension bolted joints due to the higher shear resistance from the ring. For further study, it may be necessary to investigate on design parameters including the depth of shear ring, for increased connection capacity.

Thermo-Mechanical Analysis of Continuous-Adjustment Thruster using Explosion Pressure (폭압을 사용하는 연속조정 추진구조체의 열-구조해석)

  • Kim, Kyung-Sik;Kwon, Young-Doo;Kwon, Soon-Bum;Gil, Hyuck-Moon
    • Journal of the Computational Structural Engineering Institute of Korea
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    • 제24권6호
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    • pp.699-705
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    • 2011
  • High-maneuver missile is a projectile which demands a strong momentum at short time. To produce a necessary thrust for the flight, the gas of high temperature and pressure is generated through explosive combustion of solid propellant, and a great thrust can be obtained by expanding this high temperature and pressure gas. Although the operating time of a rocket motor is less than a few seconds, a failure of part or ablation near the throat of nozzle may take place during the expansion of high temperature and pressure gas for great thrust. In other words, for the precise control of a missile an exact stress analysis considering both, the thermal stress caused by the heat transfer between combustion gas and wall, and the mechanical stress caused by the pressure change in the flow, should be considered first. In this connection, this study investigated the safety, as a point of view of stress and melting point of the material, of the pre-designed thrust generating structure which is subjected to high temperature and pressure as a function of motor operating time.

Additive Manufacturing for Sensor Integrated Components (센서 융합형 지능형 부품 제조를 위한 적층 제조 기술 연구)

  • Jung, Im Doo;Lee, Min Sik;Woo, Young Jin;Kim, Kyung Tae;Yu, Ji-Hun
    • Journal of Powder Materials
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    • 제27권2호
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    • pp.111-118
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    • 2020
  • The convergence of artificial intelligence with smart factories or smart mechanical systems has been actively studied to maximize the efficiency and safety. Despite the high improvement of artificial neural networks, their application in the manufacturing industry has been difficult due to limitations in obtaining meaningful data from factories or mechanical systems. Accordingly, there have been active studies on manufacturing components with sensor integration allowing them to generate important data from themselves. Additive manufacturing enables the fabrication of a net shaped product with various materials including plastic, metal, or ceramic parts. With the principle of layer-by-layer adhesion of material, there has been active research to utilize this multi-step manufacturing process, such as changing the material at a certain step of adhesion or adding sensor components in the middle of the additive manufacturing process. Particularly for smart parts manufacturing, researchers have attempted to embed sensors or integrated circuit boards within a three-dimensional component during the additive manufacturing process. While most of the sensor embedding additive manufacturing was based on polymer material, there have also been studies on sensor integration within metal or ceramic materials. This study reviews the additive manufacturing technology for sensor integration into plastic, ceramic, and metal materials.