Additive Manufacturing for Sensor Integrated Components
![]() |
Jung, Im Doo
(School of Mechanical and Control Engineering, Handong Global University)
Lee, Min Sik (Korea Institute of Materials Science) Woo, Young Jin (Korea Institute of Materials Science) Kim, Kyung Tae (Korea Institute of Materials Science) Yu, Ji-Hun (Korea Institute of Materials Science) |
1 | I. D. Jung, M. S. Lee, J. S. Lee, H. K. Sung and J. H. Choe: Addit. Manuf., 33 (2020) 101151. DOI |
2 | J. Lei, Q. Zhang, Y. Song, J. Tang, J. Tong, F. Peng and H. Xiao: Opt. Laser Technol., 128 (2020) 106223. DOI |
3 | A. Ghazanfari, W. Lia, M. C. Leu, Y. Zhuang and J. Huang: Mater. Des., 112 (2016) 197. DOI |
4 | C. M. Petrie, D. N. Leonard, Y. Yang, M. P. Trammel, B. C. Jolly and K. A. Terrani: Ph. D. Dissertation, Embedment of Sensors In Ceramic Structures, Oak Ridge National Laboratory, USA (2019) 26. |
5 | A. B. Varotsis, R. J. Friel, R. A. Harris and D. S. Engstrom: J. Manuf. Process., 32 (2018) 664. DOI |
6 | J. T. Muth, D. M. Vogt, R. L. Truby, D. B. Kolesky, R. J. Wood and J. A. Lewis: Adv. Mater., 26 (2014) 6307. DOI |
7 | R. L. Truby, M. Wehner, A. K. Grosskopf, D. M. Vogt, S. G. M. Uzel, R. J. Wood and J. A. Lewis: Adv. Mater., 30 (2018) 1706383. DOI |
8 | L. J. Stiltner, A. M. Elliott and C. B. Williams: J. Intell. Mater. Syst. Struct., 26 (2011) 583. |
9 | C. Shemelya, F. Cedillos, E. Aguilera, E. Maestas, J. Ramos, D. Espalin and D. Muse: IEEE Sens., (2013) 3. |
10 | J. Lee, H. Davari, J. Singh and V. Pandhare: Manufacturing Lett., 18 (2018) 20. DOI |
11 | B. Li, B. Hou, W. Yu, X. Lu and C. Yang: Front. Inf. Technol. Electron. Eng., 18 (2017) 86. DOI |
12 | S. P. L. Kumar: Eng. Appl. Artif. Intell., 65 (2017) 294. DOI |
13 | S. Chu: AASRI Procedia, 1 (2012) 106. DOI |
14 | F. Tao, Q. Qi, A. Liu and A. Kusiak: J. Manuf. Syst., 48 (2018) 157. |
15 | J. M. Perkel: Nature, 542 (2017) 125. DOI |
16 | A. Zanella, N. Bui, A. Castellani, L. Vangelista and M. Zorzi: IEEE Internet Things J., 1 (2014) 22. DOI |
17 | Y. Mehmood, F. Ahmad, I. Yaqoob, A. Adnane, M. Imran and S. Guizani: IEEE Commun. Mag., 55 (2017) 16. |
18 | C. Metallo, R. Agrifoglio, F. Schiavone and J. Mueller: Technol. Forecast. Soc. Change, 136 (2018) 298. DOI |
19 | Z. K. A. Mohammed and E. S. A. Ahmed: WSN, 67 (2017) 126. |
20 | C. Li, X. Hu and L. Zhang: Procedia Comput. Sci., 112 (2017) 2328. DOI |
21 | M. A. Akkaş and R. Sokullu: Procedia Comput. Sci., 113 (2017) 603. DOI |
22 | A. Kusiak: J. Intell., 30 (2019) 1. |
23 | K. S. Aggour, V. K. Gupta, D. Ruscitto and L. Ajdelsztajn: MRS Bulletin, 44 (2019) 545. DOI |
24 | S. Mao, B. Wang, Y. Tang and F. Qian: Engineering, 5 (2019) 995. DOI |
25 | R. T. Kreutzer and M. Sirrenberg: Understanding Artificial Intelligence, Springer, 1 (2020) 87. |
26 | H. Zhang, S. K. Moon and T. H. Ngo: ACS Appl. Mater. Interfaces, 11 (2019) 17994. DOI |
27 | L. P. Mortensen, D. H. Ryu, Y. J. Zhao and K. J. Loh: Key Eng. Mater., 569 (2013) 515. DOI |
28 | A. Dijkshorrn, P. Werkman, M. Welleweerd, G. Wolterink, B. Eijking, J. Delamare, R. Sanders and G. J. M. Krijnen: J. Sens. Sens. Syst., 7 (2018) 169. DOI |
29 | T. D. Ngo, A. Kashani, G. Imbalzano, K. T. Q. Nguyen and D. Hui: Composite Part B, 143 (2018) 172. DOI |
30 | B. Vayre, F. Vignat and F. Villeneuve: Mech. Ind., 13 (2012) 89. DOI |
31 | S. J. Leigh, R. J. Bradley, C. P. Purssell, D. R. Billson and D. A. Hutchins: PLOS One, 7 (2012) 11. |
32 | B. Lu, H. Lan and H. Liu: Opto-Electron. Adv., 1 (2018) 170004. |
33 | A. B. Varotsisa, X. Hana, R. A. Harrisb and D. S. Engstroma: Addit. Manuf., 29 (2019) 100799. |
34 | J. Karthikeyan: NASA/CR, 1 (2007) 214706. |
35 | Saheb and S. Mekid: Materials, 8 (2015) 7938. DOI |
36 | D. Havermann, J. Mathew, W. N. MacPherson, R. R. J. Maier and D. P. Hand: J. Lightwave Technol., 33 (2015) 2474. DOI |
37 | A. Hehr, M. Norfolk, J. Sheridan, M. Davis, W. Leser, P. Leser and J. A. Newman: JOM, 71 (2019) 1528. DOI |
38 | J. J. Lewandowski and M. Seifi: Annu. Rev. Mater. Res. 46 (2016) 151. DOI |
39 | C. M. Petrie, N. Sridharan, M. Subramanian, A. Hehr, M. Norfolk and J. Sheridan: Smart Mater. Struct., 28 (2019) 5. |
40 | C. M. Petrie, N. Sridharan, A. Hehr, M. Norfolk and J. Sheridan: Smart Mater. Struct., 28 (2019) 8. |
41 | P. Stoll, J. Mathew, A. Spierings, T. Bauer, R. R. J. Maier and K. Wegener: Embedding fibre optical sensors into SLM parts, Cham (Ed.), SSF Symp. Proc. Texas (2017) 273. |
![]() |