• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.05b
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• pp.30-33
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter-level dielectrics (ILD). Especially, defects like micro-scratch lead to severe circuit failure, and affects yield. CMP slurries can contain particles exceeding $1{\mu}m$ size, which could cause micro-scratch on the wafer surface. The large particles in these slurries may be caused by particle agglomeration in slurry supply line. To reduce these defects, slurry filtration method has been recommended in oxide CMP. In this work, we have studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in inter-metal dielectric(IMD)-CMP. The filter installation in CMP polisher could reduce defect after IMD-CMP. As a result of micro-scratches formation, it shows that slurry filter plays an important role in determining consumable pad lifetime.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.359-361
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• 2006

As circuits become increasingly complex and devices sizes shrinks, the demands placed on global planarization of higher level. Chemical Mechanical Polishing (CMP) is an indispensable manufacturing process used to achieve global planarity. In the CMP process, Diamond Disk (DD) plays an important role in the maintenance of removal rate. According to studies, the cause of removal rate decrease in the early or end stage of diamond disk lifetime comes from pad surface change. We also presented pad cutting rate (PCR) as a useful cutting ability index of DD and studied PCR trend about variable parameters that including size, hardness, shape of DD and RPM, pressure of conditioner It has been shown that PCR control ability of pressure and shape is superior to RPM and size. High pressure leads to a decrease of cell open ratio of pad surface because polyurethane of pad is destroyed by pressure. So low pressure high RPM condition is a proper removal rate sustain. By examining correlations between RPM and pressure of conditioner, it has been shown that PCR safe zoneto satisfy proper removal rate has the range 0.06mm/hr to 0.12mm/hr.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.707-710
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• 2004

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). In this paper, we have investigated slurry properties and CMP performance of silicon dioxide (oxide) as a function of different temperature of slurry. Thermal effects on the silica slurry properties such as pH, particle size, conductivity and zeta potential were studied. Moreover, the relationship between the removal rate (RR) with WIWNU and slurry properties caused by changes of temperature were investigated. Therefore, the understanding of these temperature effects provides a foundation to optimize an oxide CMP Process for ULSI multi-level interconnection technology.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.7
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• pp.557-561
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• 2001

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integraded circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). Especially, defects such as micro-scratch lead to severe circuit failure which affect yield. CMP slurries can contain particles exceeding 1㎛ in size, which could cause micro-scratch on the wafer surface. The large particles in these slurries may be caused by particles agglomeration in slurry supply line. To reduce these defects, slurry filtration method has been recommended in oxide CMP. In this work, we have studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in inter-metal dielectrics(IMD)-CMP process. The filter installation in CMP polisher could reduce defects after IMD-CMP process. As a result of micro-scratch formation, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. We have concluded that slurry filter lifetime is fixed by the degree of generating defects.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.5
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• pp.563-569
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• 2015

For some low-frequency applications such as power-related circuits, NEM relays have been known to show better performance than MOSFETs. For example, in a step-down charge pump circuit, the NEM relays showed much smaller layout area and better energy efficiency than MOSFETs. However, severe process variations of NEM relays hinder them from being widely used in various low-frequency applications. To mitigate the process-variation problems of NEM relays, in this paper, a new NEM-relay charge pump circuit with the self-adjustment is proposed. By self-adjusting a pulse amplitude voltage according to process variations, the power consumption can be saved by 4.6%, compared to the conventional scheme without the self-adjustment. This power saving can also be helpful in improving the power efficiency of the proposed scheme. From the circuit simulation of NEM-relay charge pump circuit, the efficiency of the proposed scheme is improved better by 4.1% than the conventional.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.9
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• pp.754-760
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• 2008

A two-photon induced photoreduction process suggests a possibility for fabricating complicated metallic microstructures which can be applied to 3-D micro-circuits and optical devices, etc. The process employs the photoreduction of silver ions in a metallic solution which is composed of metallic salt ($AgNO_3$) and watersoluble polymer ((poly(4-styrenesulfonique acid) 18wt. % in $H_2O$, $(C_8H_8O_3S)_n$)). In this process, the improvement of the resolution and the uniformity of fabricated metallic structures are important issues. To address these problems, continuous forming window (CFW) is obtained from a parametric study on the conditions of laser power and scanning velocity and the direct seed generation (DSG) method is proposed. Silver nano particles are uniformly generated in a metallic solution through the DSG method, which enables the decrease of a laser power to trigger the photoreduction of silver ions as well as the increase of metal contents in a metallic solution. So the two-photon induced photoreduction property of a metallic solution is improved. Through this work, precise silver patterns are fabricated with a minimum line width of 400 nm.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.2
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• pp.185-192
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• 2012

The paper presents the development of a cooling circuit design system that automatically creates 3D cooling circuit on a given section plane conforming to design specifications, generates 3D solid model of cooling line segments defined on a 2D sketch plane, and verifies interference of 3D cooling channel with the molding die surface. The system was developed mainly for designing plastic injection molding die of vehicular lamp, which helps the mold designer to rapidly construct cooling circuits but also reduce designer's unintended mistakes by conforming to the dimensional design specifications. It is used by an injection molding die manufacturing company in Korea, and reported approximately 20% reduction of cooling channel design time.

• Journal of Electrical Engineering and Technology
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• v.10 no.3
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• pp.983-989
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• 2015

Power transformer is one of the major and key apparatus in electric power system. Monitoring and diagnosis of transformer fault is necessary for improving the life period of transformer. The failures caused by short circuits are one of the causes of transformer outages. The short circuit currents induce excessive forces in the transformer windings which result in winding deformation affecting the mechanical and electrical characteristics of the winding. In the present work, a transformer producing only the radial flux under short circuit is considered. The corresponding axial displacement profile of the windings is computed using Finite Element Method based transient structural analysis and thus obtained displacements are compared with the experimental result. The change in inter disc capacitance and mutual inductance of the deformed windings due to different short circuit currents are computed using Finite Element Method based field analyses and the corresponding Sweep Frequency Responses are computed using the modified electrical equivalent circuit. From the change in the first resonant frequency, the winding movement can be quantified which will be useful for estimating the mechanical withstand capability of the winding for different short circuit currents in the design stage itself.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.9
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• pp.897-902
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• 2011

Chemical reactions occurring in a PEMFC are dominated by the physical conditions and interface properties, and the reactions are expressed in terms of impedance. The performance of a PEMFC can be simply diagnosed by examining the impedance because impedance characteristics can be expressed by an equivalent electrical circuit. In this study, the characteristics of a PEMFC are assessed using the AC impedance and various equivalent circuits such as a simple equivalent circuit, equivalent circuit with a CPE, equivalent circuit with two RCs, and equivalent circuit with two CPEs. It was found in this study that the characteristics of a PEMFC could be assessed using impedance and an equivalent circuit, and the accuracy was highest for an equivalent circuit with two CPEs.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.1
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• pp.7-12
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• 2008

The vacuum interrupter (VI) is used for medium-voltage switching circuits due to its abilities and advantages as a compacted environmental friendly circuit breaker. In general, the application of a sufficiently strong axial magnetic field (AMF) permits the arc to be maintained in a diffused mode to a high-current vacuum arc. A full understanding of the vacuum arc physics is very important since it can aid to improve the performance of vacuum interrupter. In order to closely examine the vacuum arc phenomena, it is necessary to predict the magnetohydrodynamic (MHD) characteristics by the multidisciplinary numerical modeling, which is coupled with the electromagnetic and hydrodynamic fields, simultaneously. In this study, we have investigated the effect of changing geometrical parameters for electromagnetic behaviors of high-current vacuum arcs with two different types of AMP contacts, which are coil-type and cup-type, using a commercial finite element analysis (FEA) package, ANSYS. The present results are compared with those of MAXWELL 3D, a reliable electromagnetic analysis software, for verification.