• 반도체디스플레이기술학회지
• /
• 제6권2호
• /
• pp.35-40
• /
• 2007

An integrated material removal model considering thermal, chemical and contact mechanical effects in CMP process is proposed. These effects are highly coupled together in the current modeling effort. The contact mechanics is employed in the model incorporated with the heat transfer and chemical reaction mechanisms. The mechanical abrasion actions happening due to the mechanical contacts between the wafer and abrasive particles in the slurry and between the wafer and pad asperities cause friction and consequently generate heats, which mainly acts as the heat source accelerating chemical reaction(s) between the wafer and slurry chemical(s). The proposed model may be a help in understanding multi-physical interactions in CMP process occurring among the wafer, pad and various consumables such as slurry.

• Elastomers and Composites
• /
• 제47권3호
• /
• pp.231-237
• /
• 2012

본 연구에서는 EPDM 컴파운드에 여러 종류의 충전제를 사용하여 물리적, 기계적 특성을 관찰하였다. 충전제로는 Semi-reinforcing furnace black(SRF), high abrasion furnace black(HAF) 그리고 acetylene black을 사용하였다. 가교제로는 dicumyl peroxide (DCP)를 사용하였다. 레오미터, 경도계, 만능 재료 시험기, 영구 압축 줄음율 그리고 동적 점탄성 분석을 통하여 재료의 성질을 관찰하였다. EPDM 컴파운드에 충전제로 SRF를 사용하였을 때함량의 증가에 따라 인장강도와 파단 연신율은 증가하였으나, acetylene black을 사용하였을 때 함량의 증가에 따라 인장강도와 파단 연신율은 감소하였다. Acetylene black을 사용하였을 때 넓은 온도 범위에서 저장탄성률의 변화율이 적었다. 또한 EPDM 컴파운드의 tan ${\delta}$는 acetylene black을 사용하였을 때 우수한 결과를 보였다.

• Journal of Chest Surgery
• /
• 제31권11호
• /
• pp.1070-1075
• /
• 1998

연구배경 : 흉강경의 출현으로 인하여 개흉술보다는 덜 침습적인 기포절제술과 흉막유착술에 대한 관심이 높아지고 있다. 그러나 흉강경수술은 개흉술에 비하여 높은 재발율을 보이며 이는 부적절한 흉막유착술의 결과 때문이라고 여겨진다. 재료 및 방법 : 저자들은 1996년 4월에서 1997년 8월 사이에 자연기흉으로 흉강경수술을 받은 62예의 환자에 있어서 흉막찰과의 강도에 따른 단기 재발율을 비교하고자 하였다. 환자는 내시경감자기구로 거즈를 집어서 벽측흉막에 점상출혈을 유발할 정도의 약한 흉막찰과를 시행한 군(A군, 32예)과 고식적인 수술기구(대동맥감자)의 끝에 거즈를 단단히 감아서 흉막에 적당한 열상과 출혈을 유발할 정도로 강한 찰과를 시행한 군(B군, 30예)으로 나누어서 임상 경과, 합병증, 그리고 단기 재발율을 비교하여 보았다. 결과 : 두 군간의 수술적응증, 나이와 성별의 분포는 비슷하였다. 술 후 흉관거치기간(3.78$\pm$3.35일:3.80$\pm$2.49일)과 입원기간(4.72$\pm$1.87일:4.67$\pm$2.20일)에 있어서도 두 군간에 유의한 차이가 없었으며, 진통제 사용량과 기간도 비슷하였다. 합병증의 대부분은 지속적인 공기누출이었고 A군에서 4예(12.5%), B군에서 2예(6.7%)로 비슷하게 발생하였으며, 출혈과 관련된 합병증은 없었다. A군과 B군에 있어서 각각 평균 9.7개월과 9.6개월의 단기 관찰기간동안 12.5%(4/32)와 0%(0/30)의 재발율을 보여서 통계학적으로 유의한 차이가 있었다(p<0.05). 결론 : 자연기흉의 흉강경수술에 있어서 적절한 강도의 흉막찰과술의 시행은 재발을 감소시키는 중요한 인자이며, 이러한 수술로서 흉부절개술에 버금가는 낮은 재발율 성적을 얻을 수 있었다.

• 센서학회지
• /
• 제16권4호
• /
• pp.319-323
• /
• 2007

This paper describes the mechanical characteristics of poly 3C-SiC thin films grown on Si wafers with thermal oxide. In this work, the poly 3C-SiC thin film was deposited by APCVD method using only Ar carrier gas and single precursor HMDS at $1100^{\circ}C$. The elastic modulus and hardness of poly 3C-SiC thin films were measured using nanoindentation. Also, the roughness of surface was investigated by AFM. The resulting values of elastic modulus E, hardness H and the roughness of the poly 3C-SiC film are 305 GPa, 26 GPa and 49.35 nm respectively. The mechanical properties of the grown poly 3C-SiC film are better than bulk Si wafers. Therefore, the poly 3C-SiC thin film is suitable for abrasion, high frequency and MEMS applications.

• 대한기계학회논문집A
• /
• 제28권1호
• /
• pp.85-91
• /
• 2004

The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by chemical and mechanical polishing process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of sapphire crystalline wafer at surfaces has a full width at half maximum of 89 arcsec. The surfaces of sapphire wafer were mechanically affected by residual stress during the polishing process. The wave pattern of optical interference of sapphire wafer implies higher abrasion rate in the edge of the wafer than its center from the Newton's ring.

• 대한소아치과학회지
• /
• 제24권1호
• /
• pp.112-124
• /
• 1997

According to extensive use of composite resin which have superior esthetic property, every effort on improving bonding strength between a tooth and composite resin has been continued. Acid etching technique is a method that micro-etches the tooth surface which provides bonding with composite resin possible. Recently, there were several reports that mechanical treatment obtained from air-abrasion can provide similar bonding strength with acid etching technique. So, this experimental study was designed to compare the shear bonding strength between using air-abrasion technique and using acid etching technique. Initially, bovine teeth were divided into enamel and dentin experimental groups. Respectively each group was categorized into three subgroups. One subgroup was acid etched with 35% phosphoric acid, then bonded with composite resin. The other subgroup was air-abraded with $50{\mu}m$ $Al_2O_3$ particles sprayed with 160psi air pressure using air abrasion unit(KCP-1000, A.D.T., U.SA), and composite resin was bonded. In another subgroup, composite resin was bonded after acid etching following air-abrasion. So, enamel experimental groups were made of E1 (acid etched only), E2(air-abraded only), E3(acid etched following air-abraded), and dentin experimental groups were made of D1(acid etched only), D2(air-abraded only), D3(acid etched following air-abraded). Each subgroup had 10 specimens. Dentin bonding system(Scotchbond Multi-purpose, 3M Co., U.S.A.) and composite resin(Z-100, 3M Co., U.S.A.) were applied on treated surface using 5mm diameter gelatin capsule as manufacturer's direction. After 1200 times thermocycling between $5^{\circ}C$ and $55^{\circ}C$, shear bond strength was measured in 5mm/min crosshead speed with Instron(Instron Co., U.S.A.), and also treated enamel and dentin were observed with SEM(JEOL Co., Japan). The following results were obtained: 1. In the enamel experimental groups, acid etched following air-abraded group had highest shear bond strength, but there was no significant difference compared to acid etched group. Air-abraded only group had lowest shear bond strength, and there was significant difference compared to the rest of groups. 2. In the dentin experimental groups, acid etched following air-abraded group had highest shear bond strength, but there was no significant difference compared to acid etched group. Air-abraded only group had lowest shear bond strength, and there was significant difference compared to the rest of groups. 3. In the SEM study, air-abraded enamel and dentin had irregular and rough surfaces.

• 한국윤활학회:학술대회논문집
• /
• 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
• /
• pp.433-434
• /
• 2002

Chemical mechanical polishing refers to a process by which silicon and partially-processed integrated circuits (IC's) built on silicon substrates are polished to produce planar surfaces for the continued manufacturing of IC's. Chemical mechanical polishing is done by pressing the silicon wafer, face down, onto a rotating platen that is covered by a rough polyurethane pad. During rotation, the pad is flooded with a slurry that contains nanoscale particles. The pad deforms and the roughness of the surface entrains the slurry into the interface. The asperities contact the wafer and the surface is polished in a three-body abrasion process. The contact of the wafer with the 'soft' pad produces a unique elastohydrodynamic situation in which a suction force is imposed at the interface. This added force is non-uniform and can be on the order of the applied pressure on the wafer. We have measured the magnitude and spatial distribution of this suction force. This force will be described within the context of a model of the sliding of hard surfaces on soft substrates.

• Tribology and Lubricants
• /
• 제38권1호
• /
• pp.1-7
• /
• 2022

Chemical-mechanical polishing (CMP) process is a semiconductor process that planarizes a wafer surface using mechanical friction between a polishing pad and a substrate surface during a specific chemical reaction. During the CMP process, polishing pad conditioning is applied to prevent the rapid degradation of the polishing quality caused by polishing pad glazing through repeated material removal processes. However, during the conditioning process, uneven wear on the polishing pad is inevitable because the disk on which diamond particles are electrodeposited is used. Therefore, the abrasion of the polishing pad should be considered not only for the variables during the conditioning process but also when designing the CMP conditioning system. In this study, three design variables of the conditioning system were analyzed, and the effect on the pad wear profile during conditioning was investigated. The three design variables considered in this study were the length of the conditioner arm, diameter of the conditioner disk, and distance between centers. The Taguchi method was used for the experimental design. The effect of the three design variables on pad wear and uniformity was assessed, and new variables used in conditioning system design were proposed.

• Structural Engineering and Mechanics
• /
• 제86권6호
• /
• pp.779-791
• /
• 2023

Long-termly used in water supply, an underground concrete pipe is easily subjected to the coupled action of pressure loading and flowing water, which can cause the chemo-mechanical damage of the pipe, resulting in its premature failure and lifetime reduction. Based on the leaching characteristics and damage mechanism of concrete pipe, this paper proposes a coupled chemo-mechanical damage and failure model of underground concrete pipe for water supply, including a calcium leaching model, mechanical damage equation and a failure criterion. By using the model, a numerical simulation is performed to analyze the failure process of underground concrete pipe, such as the time-varying calcium concentration in concrete, the thickness variation of pipe wall, the evolution of chemo-mechanical damage, the distribution of concrete stress on the pipe and the lifetime of the pipe. Results show that, the failure of the pipe is a coupled chemo-mechanical damage process companied with calcium leaching. During its damage and failure, the concentrations of calcium phase in concrete decrease obviously with the time, and it can cause an increase in the chemo-mechanical damage of the pipe, while the leaching and abrasion induced by flowing water can lead to the boundary movement and wall thickness reduction of the pipe, and it results in the stress redistribution on the pipe section, a premature failure and lifetime reduction of the pipe.

• Elastomers and Composites
• /
• 제34권5호
• /
• pp.391-398
• /
• 1999

폴리염화비닐(PVC)에 프탈산계 가소제인 di-2-ethyl hexyl phthalate (DOP)와 아디프산계 가소제인 di-2-ethyl hexyl adiphate (DOA)를 혼련하였다. 혼련한 컴파운드의 비중, 인장강도, 신율, 경도, 내마모성, 내한굴곡성을 측정하였다. 먼저 PVC의 중합도에 따른 물성을 알아보면, 중합도 2500인 PVC를 사용한 컴파운드(이하 P2500계)가 중합도 1300인 PVC를 사용한 컴파운드(이하 P1300계)보다 인장강도, 경도에서 상대적으로 우수하게 나타났고, 신율, 내마모성, 내한굴곡성에서는 P1300계가 P2500계 보다 우수하게 나타났다. 그리고, 비중은 PVC의 중합도에 상관없이 비슷하게 나타났다. 또 가소제의 종류에 따른 PVC 컴파운드의 기계적 물성을 알아보면, 가소제로 DOP를 첨가한 PVC 컴파운드(이하 DOP계)가 DOA를 첨가한 PVC 컴파운드(이하 DOA계)보다 인장강도, 신율에서 우수하게 나타났고, 내마모성, 내한굴곡성에서는 DOA계가 상대적으로 DOP계보다 우수하게 나타났다. 그리고 경도는 DOP계가 높게, 비중은 DOA계가 더 낮게 나타났다.