• 한국세라믹학회지
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• 제34권10호
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• pp.1092-1098
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• 1997

Electrical discharge machining (EDM) was attempted on a ceramic matrix composite containing non-conductive alumina as a matrix and conductive titania as a second phase, and was found successful. As the current or duty factor increased, the material removal rate (MRR) increased and the surface roughness also increased. The EDMed surface was covered with a number of craters of a circular shape having 100-200 microns of diameter. The melting and evaporation was suggested for the EDM mechanism. The bending strength decreased 44% after EDM, but the Weibull modulus increased more than twice. Combination of EDM and barre이 polishing resulted in the maintenance of the bending strength level. Temperature distribution near a spark in the sample was computer-simulated by use of finite element method, and was found to have similar shape to the one which the observed craters have.

• 한국정밀공학회지
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• 제14권9호
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• pp.80-89
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• 1997

Die sinking electrical discharge machining(EDM) was conducted for ceramic composite of 33 weight percent TiC based on AI$_{2}$O$_{3}$ ceramic matrix according to the change of current and duty factor(DF). Material removal rate(MRR) was increased as the current and the duty factor increased, but better surface mor-pholoty was obtained in the region of lower current and duty factor. From the scanning electron microscopy(SEM) photographs and the energy dispersive X-ray spectroscopy(EDX) of the EDMed surface, EDM trace formed by one discharge spark was analyzed. Although the bending strength after EDM was highly decreased, reliability obtained by weibull analysis was increased twice. The bending strength was recovered or more by barrel polishing after EDM. From the FEM analysis of temperature for one spark, the possible melting region of AI$_{2}$O$_{3}$and TiC was obtained.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1682-1687
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• 2003

Die polishing technology is very critical to determine quality and performance of the final products. Generally, the rotation-type tool is used most widely in the polishing process. However it is difficult to make the mirror surface, because the method using the rotation-type tool causes a lot of tiny scratch on the polished surface. This paper proposes a new method using the oscillation-type tool that reduces the scratch and improves the surface roughness. As result. the mirror surface was able to obtain by using the oscillation-type tool. AE is known to be closely related to material removal rate(MRR). As the surface is rougher, MRR gets larger and AE increase. The surface roughness can be indirectly estimated using the AE signal measured during automatic die polishing process. In this study. an AE sensor based monitoring system was developed to investigate the relation the level of AE RMS with the surface roughness during polishing process.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
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• pp.8-13
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• 2000

Die polishing technology is very critical to determine quality and performance of the final products. Die polishing processes have not been automated because the automation requires a great deal of experience and skill of experts. Thus, to implement a fully automated polishing process, the development of polishing status monitoring system replacing the skill of experts is critical. AE is known to be closely related to material removal rate(MRR). As the surface is rougher, MRR gets larger and AE increased. The surface roughness can be indirectly estimated using the AE signal measured during automatic die polishing process. In this study, The polishing state monitoring system using AEms signal was developed. This system can be not only to monitor the abnormal state but also to estimate a state of surface roughness of polishing surface qualitatively.

• 한국기계가공학회지
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• 제2권1호
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• pp.32-38
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• 2003

Engineering ceramics have many unique characteristics both in mechanical and physical properties such as high temperature hardness, high thermal, chemical and electrical resistance. However, its machinability is very poor in conventional machining due to its high hardness and severe tool wear. In the current experimental study alumina($Al_2O_3$) was ultrasonically machined using SiC abrasives under various machining conditions to investigate the material removal rate and surface quality of the machined samples. Under the applied amplitude of 0.02mm, 27kHz frequency, three slurry ratios (abrasives water by weight) of 11, 13 and 15 with different tool shapes and applied pressure levels, the machining was conducted. Using the mesh number of 240 abrasive, slurry ratio of 11 and static pressure of $25kg/cm^2$, maximum material removal rate of $18.97mm^3/mm$ was achieved with mesh number of 600 SiC abrasives and static pressure of $30kg/cm^2$, best surface roughness of $0.76{\mu}m$ Ra was obtained.

• 한국정밀공학회지
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• 제32권1호
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• pp.69-74
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• 2015

Cadmium telluride (CdTe) is being developed for thin film of the X-Ray detector recently. But a rough surface of the CdTe should be improved for resolution and signal speed. This paper shows the study on the improvement of surface roughness and removal rate by applying Chemical Mechanical Polishing. The conventional potassium hydroxide (KOH) based colloidal silica slurry could not realize a mirror surface without physical defects, resulting in low material removal rate and many scratches on surface. In order to enhance chemical reaction such as form oxidized layer on the surface of cadmium telluride, we used hydrogen peroxide ($H_2O_2$) as an oxidizer. Consequently, in case of 3 wt% concentration of hydrogen peroxide, the highest MRR (938 nm/min) and the lowest surface roughness ($R_{p-v}=10.69nm$, $R_a=0.8nm$) could be obtained. EDS was also used to confirm the generated oxide of cadmium telluride surface.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 춘계학술대회 논문요약집
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• pp.208-208
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• 2004

공작기계와 절삭 공구의 발달로 고속 가공(high speed machining)의 도입이 가속화되고 있다. 고속 가공은 소재 제거율(MRR; material removal rate)을 향상시킴으로써 생산비용 및 생산 시간의 단축이 가능하며, 소경 공구를 이용한 고속 고회전 가공으로 고정밀 가공이 가능한 방법으로 생산 효율성 및 정밀성의 증대를 동시에 추구할 수 있는 가공 방법이다. 고속 가공에서 공구의 절입 및 퇴출 시에 급격한 절삭력의 변화로 인하여 공구의 파손(breakout) 및 칩핑(chipping)의 발생 가능성이 보다 높다.(중략)

• Advances in materials Research
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• 제5권2호
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• pp.67-80
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• 2016

The objective of the present work is to optimize process parameters namely, cutting speed, feed rate, and depth of cut in milling of AISI 304 stainless steel. In this work, experiments were carried out as per the Taguchi experimental design and an $L_{27}$ orthogonal array was used to study the influence of various combinations of process parameters on surface roughness (Ra) and material removal rate (MRR). As a dynamic approach, the multiple response optimization was carried out using grey relational analysis (GRA) and desirability function analysis (DFA) for simultaneous evaluation. These two methods are considered in optimization, as both are multiple criteria evaluation and not much complicated. The optimum process parameters found to be cutting speed at 63 m/min, feed rate at 600 mm/min, and depth of cut at 0.8 mm. Analysis of variance (ANOVA) was employed to classify the significant parameters affecting the responses. The results indicate that depth of cut is the most significant parameter affecting multiple response characteristics of GFRP composites followed by feed rate and cutting speed. The experimental results for the optimal setting show that there is considerable improvement in the process.

• Structural Engineering and Mechanics
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• 제84권1호
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• pp.17-33
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• 2022

An experimental study is carried out to investigate the performance of the cutting tool regarding the insert wear, surface roughness, cutting forces, cutting power and material removal rate of three coated carbides GC2015 (TiCN-Al₂O₃-TiN), GC4215 (Al₂O₃-Ti(C,N)) and GC1015 (TiN) during the dry turning of AISI4140 steel. For this purpose, a Taguchi design (L₉) was adopted for the planning of the experiments, the effects of cutting parameters on the surface roughness (R_a), tangential cutting force (F_z), the cutting power (P_c) and the material removal rate (MRR) were studied using analysis of variance (ANOVA), the response surface methodology (RSM) was used for mathematical modeling, with which linear mathematical models were developed for forecasting of R_a, F_z, P_c and MRR as a function of cutting parameters (V_c, f, and a_p). Then, Multi-Objective Ant Lion Optimizer (MOALO) has been implemented for multi-objective optimization which allows manufacturers to enhance the production performances of the machined parts. Furthermore, in order to characterize and quantify the flank wear of the tested tools, some machining experiments were performed for 5 minutes of turning under a depth of 0.5 mm, a feed rate of 0.08 mm/rev, and a cutting speed of 350 m/min. The wear results led to a ratio (V_B-GC4215/V_B-GC2015) of 2.03 and (V_B-GC1015/V_B-GC2015) of 4.43, thus demonstrating the efficiency of the cutting insert GC2015. Moreover, SEM analysis shows the main wear mechanisms represented by abrasion, adhesion and chipping.

• 한국전기전자재료학회논문지
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• 제21권3호
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• pp.203-207
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• 2008

Chemical mechanical polishing (CMP) allows the planarization of wafers with two or more materials. There are many elements such as slurry, polishing pad, process parameters and conditioning in CMP process. Especially, polishing pad is considered as one of the most important consumables because this affects its performances such as WIWNU(within wafer non-uniformity) and MRR(material removal rate). In polishing pad, grooves and pores on its surface affect distribution of slurry, flow and profile of MRR on wafer. A subject of this investigation is to apply CMP for planarization of shallow trench isolation structure using microstructure(MS) pad. MS pad is designed to have uniform structure on its surface and manufactured by micro-molding technology. And then STI CMP performances such as pattern selectivity, erosion and comer rounding are evaluated.