• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.12
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• pp.1387-1394
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• 2014

In a photoelastic experiment, it is necessary to know the material stress fringe constant of the photoelastic specimen to determine the stresses from the measured isochromatic fringe orders. The material stress fringe constant can be obtained using a simple tension specimen and/or a circular disk under diametric compression. In these methods, there is generally a need to apply numerous loads to the specimen in response to the relationship of the fringe order. Then, the least squares method is used to obtain the material constant. In this paper, the fringe orders that appear on a four-point bending specimen are used to determine the fringe constant. This method requires four photoelastic fringes obtained from a circular polariscope by rotating the analyzer to 0, ${\pi}/4$, ${\pi}/2$, and $3{\pi}/4$ radians. Using the four-point bending specimen to determine the material stress fringe constant has an advantage because measurements can be made at different locations by applying a constant load. The stress fringe constant measured with this method is within the range suggested by the manufacturer of the photoelastic material.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.57-67
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• 2002

Increased signal speed can be obtained in three ways: changing the layout and/or the ratio of the width to thickness of the metal lines, decreasing the specific resistance of the interconnect metal, and decreasing the dielectric constant of the insulating material (intermetal dielectric). Further advancement cannot be expected from changing layout or decreasing specific resistance. The only alternative is to use an insulating material with a lower dielectric constant than other ones used presently. A large variety of polymers has been proposed for use as materials with low dielectric constants for applications in microelectronics. In this review, the properties of selected polymers as well as various fabrication methods for polymer thin films are discussed. Based on the properties described so far, and the requirements for applications as intermetal dielectric material, the possibilities for further developments also are discussed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.11
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• pp.1022-1027
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• 2008

TPE is used as alternative for rubber, the best example is the weather strip for automobile. The nonlinear material properties of weather strip were important to predict the behaviors of weather strip. Uniaxial tension and equi-biaxial tension tests were performed to achieve the nonlinear material constant and stress-strain curves. The nonlinear material constant of weather strip is evaluated by using the nonlinear finite element analysis. In this paper, the prediction for weather strip is analyzed by using commercial finite element program, ANSYS. The nonlinear finite element analysis of weather strip is executed to predict the behavior of weather strip for automobile.

• Korean Journal of Materials Research
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• v.27 no.1
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• pp.39-42
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• 2017

E-glass (electrical glass) fiber is the widely used as a reinforced composite material of PCBs (printed circuit boards). However, E-glass fiber is not stable because it has a dielectric constant of 6~7. On the other hand, D-glass (dielectric glass) fiber has a low dielectric constant of 3~4.5. Thus, it is adaptable for use as a reinforcing material of PCBs. In this study, we fabricated D-glass compositions with low dielectric constant, and measured the electrical and optical properties. In the glass composition, the boron content was changed from 9 to 31 wt%. To confirm the dependence of the dielectric constant on melting properties, D-glass with 22 wt% boron was melted at $1550^{\circ}C$ and $1650^{\circ}C$ for 2hrs. The glass melted at $1650^{\circ}C$ had a lower dielectric constant than the glass melted at $1550^{\circ}C$. Therefore, the D-glass with boron of 9~31 wt% was fabricated by melting at $1650^{\circ}C$ for 2hrs, and transparent clear glass was obtained. We identified the non-crystalline nature of the glass using an XRD (x-ray diffractometer) graph. The visible light transmittance values depending on the boron contents were measured and found to be 88.6 % ~ 82.5 %. Finally, the dielectric constant of the D-glass with 31 wt% boron was found to have decreased from 4.18 to 3.93.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.2
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• pp.144-150
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• 2008

Recently, there has been growing interest in low loss and low dielectric constant material for LTCC application, as the frequency range for electronic devices increases. This study was designed to evaluate the effect of cordierite filler for low dielectric constant LTCC material. From the previous experiments, two glass compositions of B-Si-Al-Zn-Ba-Ca-O and B-Si-Al-Sr-Ca-O system, were chosen. Each powder of two glass compositions was sintered respectively with commercial cordierite powder in temperature range from $800^{\circ}C\;to\;900^{\circ}C$. Crystalline cordierite and glass peaks were affected only with two factors of composition and sintering temperature among various factors. With the optimized condition of two cordierite/glass compositions, obtained dielectric constant was below 5.5 and quality factor was above 1,000. Closed pore of sintered body was controled by sintering temperature and sintering time. When cordierite/glass composite with ratio of 5.5:4.5 was sintered at $900^{\circ}C$, densification was sufficient with good dielectric characteristics of ${\epsilon}_r<5.1,\;Q{\ge}1,000$. Residual fine closed pores could be reduced with control of sintering temperature and time. 3 point bending strength and chemical durability were evaluated to obtain feasibility for substrate material.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.159-159
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• 2007

In order to reduce a signal delay in ULSI, low resistive metal and intermetal dielectric material of low dielectric constant are required. Ordered mesoporous silica film is proper to intermetal dielectric due to its low dielectric constant and superior mechanical properties. In this study, ordered mesoporous silica films was synthesized using TEOS (tetraethoxysilane) / MTES (methyltriethoxysilane) mixed silica precursor and Brij-$76^{(R)}$ surfactant. These films had the porosity of 40% and dielectric constant of 2.5. To lower dielectric constant, the ordered mesoporous silica films were surface-modified by HMDS (hexamethyldisilazane) treatment. HMDS substituted -OH groups on the surface of silica wall for -Si$(CH_3)_3$ groups. After the HMDS treatment, ordered mesoporous silica films were calcined at various calcination temperatures. Through the investigation, it was concluded that the proper calcination temperature is necessary as aspects of structural, electrical, and mechanical properties.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.1
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• pp.53-57
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• 2012

In this paper, by designing 20 W class driving circuit for driving high-power LED (Light Emitting Diode), we are going to comparatively carry out the analysis of characteristics for power circuit according to each design method. In this case, 200 V 60 Hz was performed as input data. The electrical characteristics such as voltage, current and ripple are checked for constant current circuit and constant voltage circuit in the LED module. In addition, as the ripple has an influence on illumination of LED light, low temperature working (-20 [$^{\circ}C$]) and high temperature working(80 [$^{\circ}C$]) are measured to make sure the ripple characteristics in accordance with temperature. In low temperature operation -20 [$^{\circ}C$] measurements, both constant current circuit and constant-voltage circuit were less impacted on input fluctuation, whereas in the high temperature operation 80 [$^{\circ}C$], current voltage in constant voltage circuit was surge after 430 [hour]. Voltage current ripple of constant current circuit was much less than constant voltage circuit, therefore we can show that constant current circuit is more stable.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.4
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• pp.362-367
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• 2008

We have Manufactured the low-k dielectric interlayer fabricated by plasma enhanced chemical vapor deposition (PECVD), The thin film of SiOCH is studied correlation between components and Dielectric constant. The precursor was evaporated and introduced with the flow rates from 16 sccm to 25 sccm by 1sccm step in the constant flow rate of 60 sccm $O_2$ in process chamber. The chemical characteristics of SiOCH were analyzed by measuring FT/IR absorption lines and obtained each dielectric constant measuring C-V. Then compare respectively. ILD of BTMSM/$O_2$ could have low dielectric constant about $k\sim2$, and react sensitively. Also dielectric constant could be decreased by the effects of decreasing $CH_3$ and growing Si-O-Si(C) after annealing process.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.625-628
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• 1998

This paper presents the design method of a temperature stable stepped-impedance resonator using composite material. In this method temperature coefficient of dielectric constant $(\tau\varepsilon)$ and thermal expansion coefficient $(\alpha1)$ of dielectric material were considered. Ba(Zn1/3Nb2/3)O3 and CaZrO3 as composite material having opposite signs of temperature coefficient of dielectric constant were selected. The length of this resonator for the temperature stability of resonance frequency was calculated at 900MHz, 1.4㎓ and 1.9㎓. It was found that the ratio of the length of positive $\tau\varepsilon$ materal to the length of negative $\tau\varepsilon$ material is constant at various resonance frequencies.

• Geomechanics and Engineering
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• v.20 no.1
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• pp.1-7
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• 2020

In structures excavated in rock mass, load progressively increases to a level and remains constant during the construction. Rocks display different elastic properties such as E_i and ʋ under different loading conditions and this requires to use the true values of elastic properties for the design of safe structures in rock. Also, rocks will undergo horizontal and vertical deformations depending on the amount of load applied. However, under constant loads, values of E_i and ʋ will vary in time and induce variations in the behavior of the rock mass. In some empirical equations in which deformation modulus of the rock mass is taken into consideration, elastic parameters of intact rock become functions in the equation. Hence, the use of time dependent elastic properties determined under constant loading will yield more reliable results than when only constant elastic properties are used. As well known, rock material will play an important role in the deformation mechanism since the discontinuities will be closed due to the load. In this study, E_i and ʋ values of intact rocks were investigated under different constant loads for certain rocks with high deformation capabilities. The results indicated significant time dependent variations in elastic properties under constant loading conditions. E_i value obtained from deformability test was found to be higher than the E_i value obtained from the constant loading test. This implies that when static values of elastic properties are used, the material is defined as more elastic than the rock material itself. In fact, E_i and ʋ values embedded in empirical equations are not static. Hence, this workattempts to emerge a new understanding in designing of safer structures in rock mass by numerical methods. The use of time-dependent values of E_i and ʋ under different constant loads will yield more accurate results in numerical modeling analysis.