• Title/Summary/Keyword: maskless

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진공용 나노 스테이지 개발을 위한 고찰

  • 홍원표;강은구;이석우;최헌종
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2004.05a
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    • pp.223-228
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    • 2004
  • Miniaturization is the central theme in modern fabrication technology. Many of the components used in modern products are becoming smaller and smaller. The direct write FIB technology has several advantages over contemporary micromachining technology, including better feature resolution with low lateral scattering and capability of maskless fabrication. Therefore, the application of FIB technology in micro fabrication has become increasingly popular. In recent model of FIB, however the feeding system has been a very coarse resolution of about a few $\mu\;\textrm{m}$. It is not unsuitable to the sputtering and the deposition to make the high-precision structure in micro or macro scale. Our research is the development of nano stage of 200mm strokes and 10nm resolutions. Also, this stage should be effectively operating in ultra high vacuum of about $1\times10^{-7}$ torr. This paper presents the concept of nano stages and the discussion of the material treatment for ultra high vacuum.

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Roll-to-Roll (R2R) Fabrication of Micro Pillar Array for Biomimetic Functionalization of Surface

  • Jeon, Deok-Jin;Lee, Jun-Young;Yeo, Jong-Souk
    • Applied Science and Convergence Technology
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    • v.23 no.1
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    • pp.54-59
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    • 2014
  • The roll-to-roll (R2R) fabrication method to make micro-scale pillar arrays for biomimetic functionalization of surfaces is presented. Inspired by the micro-structure of plants in nature, a surface with a synthetic micro-scale pillar array is fabricated via maskless photolithography. After the surface is SAM (self-assembled monolayer) coated with trichlorosilane in a vacuum desiccator, it displays a hydrophobic property even in R2R replicas of original substrate, whose properties are further characterized using various pitches and diameters. In order to perform a comparison between the original micro-pattern and its replicas, surface morphology was analyzed using scanning electron microscopy and wetting characteristics were measured via a contact angle measurement tool with a $10{\mu}L$ water droplet. Efficient roll-to-roll imprinting for a biomimetic functionalized surface has the potential for use in many fields ranging from water repelling and self-cleaning to microfluidic chips.

Laser-Induced Thermochemical Wet Etching of Mn-Zn Ferrite (Mn-Zn 페라이트의 레이저 유도 열화학 습식식각)

  • Lee, Kyoung-Cheoul;Lee, Cheon
    • Electrical & Electronic Materials
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    • v.10 no.7
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    • pp.668-673
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    • 1997
  • A Single-crystalline Mn-Zn Ferrite (110 orientation) was masklessly etched by focused Ar laser irradiation in an H$_3$PO$_4$ solution. The depth of the etched grooves increases with increasing a laser power, decreasing a scan speed, and increasing the H$_3$PO$_4$concentration. The width of the etched grooves increases with a increasing laser power, but was relatively insensitive to the scan speed and H$_3$PO$_4$concentration. High etching rate of up to 714 ${\mu}{\textrm}{m}$/s and an aspect ratio of 6 for vertical slab structure have been obtained by the light-guiding effect of the laser bean in the H$_3$PO$_4$ solution.

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Etch Resistance of Mask Layer modified by AFM-based Tribo-Nanolithography in Aqueous Solution (AFM 기반 액중 Tribo nanolithography 에서의 마스크 층 내식각성에 관한 연구)

  • Park Jeong-Woo;Lee Deug-Woo;Kawasegi Noritaka;Morita Noboru
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.268-271
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    • 2005
  • Etch resistance of mask layer on silicon substrate modified by AFM-based Tribo-Nanolithography (TNL) in Aqueous Solution in an aqueous solution was demonstrated. n consists or sequential processes, nano-scratching and wet chemical etching. The simple scratching can form a mask layer on the silicon substrate, which acting as an etching mask. For TNL, a specially designed cantilever with diamond tip, allowing the formation of mask layer on silicon substrate easily by a simple scratching process, has been applied instead of conventional silicon cantilever fur scanning. This study demonstrates how the TNL parameters can affect the etch resistance of mask layer, hence introducing a new process of AFM-based maskless nanolithography in aqueous solution.

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Mask and Maskless Wearers Detection based on Deep Learning (딥러닝 기반 마스크 착용자 및 미착용자 검출)

  • Kim, Taehyeon;Woo, Seunghee;Kim, Jeongmi;Choi, Haechul
    • Proceedings of the Korean Society of Broadcast Engineers Conference
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    • fall
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    • pp.325-327
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    • 2021
  • 코로나19 전염병 예방을 위한 공공장소에서의 마스크 착용이 의무화되고 있다. 그러나 사람들이 다양한 이유로 마스크를 제대로 착용하지 않아 감염에 노출되는 위험이 발생하고 있다. 이러한 방역 문제를 해결하고 본 논문은 영상을 인식하여 마스크를 쓴 얼굴과 쓰지 않은 얼굴을 검출하는 방식을 제안한다. 제안 방법은 마스크 착용자와 비착용자 얼굴 영상을 딥러닝 기반의 YOLO 네트워크로 학습하여, 마스크 착용 유무를 판별한다. 동일 YOLO 네트워크에 대해 여러가지 조건으로 학습을 수행하고, 학습에 사용되지 않은 검증 데이터를 이용해 정확도가 가장 높은 네트워크의 가중치를 선택하였다. 실험결과, 마스크 착용자는 67.2%, 미착용자는 39.8%의 판별 정확도를 보였다. 미착용자에 대해 낮은 정확도를 보인 이유는 학습 데이터의 부족으로 판단되며, 이를 보완하기 위하여 더 많은 학습데이터를 제작하여 성능을 개선시키고자 한다.

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Investigation on the Electrical Characteristics of mc-Si Wafer and Solar Cell with a Textured Surface by RIE (플라즈마기반 표면 Texturing 공정에 따른 다결정 실리콘 웨이퍼 표면물성과 태양전지 동작특성 연구)

  • Park, Kwang-Mook;Jung, Jee-Hee;Bae, So-Ik;Choi, Si-Young;Lee, Myoung-Bok
    • Journal of the Korean Vacuum Society
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    • v.20 no.3
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    • pp.225-232
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    • 2011
  • Reactive ion etching (RIE) technique for maskless surface texturing of mc-silicon solar wafers has been applied and succeed in fabricating a grass-like black-silicon with an average reflectance of $4{\pm}1%$ in a wavelength range of 300~1,200 nm. In order to investigate the optimized texturing conditions for mass production of high quantum efficiency solar cell Surface characteristics such as the spatial distribution of average reflectance, micrscopic surface morphology and minority carrier lifetime were monitored for samples from saw-damaged $15.6{\times}15.6\;cm^2$ bare wafer to key-processed wafers as well as the mc-Si solar cells. We observed that RIE textured wafers reveal lower average reflectance along from center to edges by 1% and referred the origin to the non-uniform surface structures with a depth of 2 times deeper and half-maximum width of 3 times. Samples with anti-reflection coating after forming emitter layer also revealed longer minority carrier lifetime by 40% for the edge compared to wafer center due to size effects. As results, mc-Si solar cells with RIE-textured surface also revealed higher efficiency by 2% and better external quantum efficiency by 15% for edge positions with higher height.

Maskless etching of the PDP barrier rib using focused laser beam (집속 레이저 빔에 의한 PDP 격벽의 마스크레스 식각)

  • Ahn, Min-Young;Lee, Kyoung-Cheol;Lee, Hong-Kyu;Choi, Hoon-Young;Lee, Cheon
    • Proceedings of the KIEE Conference
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    • 1999.07d
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    • pp.1849-1851
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    • 1999
  • The PDP(Plasma Display Panel) barrier rib was fabricated by focused $Ar^+$ laser ($\lambda$=514nm) and Nd:YAG($\lambda$=532, 266 nm) laser irradiation. The depth of the etched groove increases with increasing a laser fluence. and decreasing a scan speed. Using the second harmonic of the Nd:YAG laser, the threshold laser fluence was $6.5mJ/cm^2$ for the sample of PDP barrier rib dried at $120^{\circ}C$. The thickness of $150{\mu}m$ of the sample on the glass was etched without any damage on the glass substrate by fluence of $19.5J/cm^2$. The barrier rib sample on hot plate was etched by Nd:YAG laser(532 nm) as increasing a temperature of the sample. In this case, the etch rate was $95{\mu}m/s$, $190{\mu}m/s$ at room temperature, $175^{\circ}C$ respectively.

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High -Rate Laser Ablation For Through-Wafer Via Holes in SiC Substrates and GaN/AlN/SiC Templates

  • Kim, S.;Bang, B.S.;Ren, F.;d'Entremont, J.;Blumenfeld, W.;Cordock, T.;Pearton, S.J.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.3
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    • pp.217-221
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    • 2004
  • [ $CO_2$ ]laser ablation rates for bulk 4H-SiC substrates and GaN/AIN/SiC templates in the range 229-870 ${\mu}m.min^{-1}$ were obtained for pulse energies of 7.5-30 mJ over diameters of 50·500 ${\mu}m$ with a Q-switched pulse width of ${\sim}30$ nsec and a pulse frequency of 8 Hz. The laser drilling produces much higher etch rates than conventional dry plasma etching (0.2 - 1.3 ${\mu}m/min$) making this an attractive maskless option for creating through-wafer via holes in SiC or GaN/AlN/SiC templates for power metal-semiconductor field effect transistor applications. The via entry can be tapered to facilitate subsequent metallization by control of the laser power and the total residual surface contamination can be minimized in a similar fashion and with a high gas throughput to avoid redeposition. The sidewall roughness is also comparable or better than conventional via holes created by plasma etching.

Development of 2-Axes Linear Motion System with Nano resolution for UHV (초진공용 2축 대변위 나노 스테이지 개발)

  • Kang, E.G.;Hong W.P.;Lee S.W.;Jung M.S.;Choi H.Z.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1871-1874
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    • 2005
  • The direct write FIB technology has several advantages over contemporary micro-machining technology, including better feature resolution with low lateral scattering and capability of maskless fabrication. Therefore, the application of FIB technology in micro fabrication has become increasingly popular. In recent model of FIB, however the feeding system has been a very coarse resolution of about a few ${\mu}m$. Our research is the development of nano stage of 200mm strokes and 10nm resolutions. Also, this stage should be effectively operating in ultra high vacuum of about $1x10^{-7}$ torr. This paper presents the discussion and results of CAE of the 2 axes stages. we have estimated the stable static and dynamic characteristics for dual servo system. Therefore the 2 axes stages developed and future work are introduced at the end of the paper.

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Status of Research on Selective Laser Sintering of Nanomaterials for Flexible Electronics Fabrication (나노물질의 선택적 레이저소결을 이용한 유연전기소자 구현 연구현황)

  • Ko, Seung-Hwan
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.35 no.5
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    • pp.533-538
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    • 2011
  • A plastic-compatible low-temperature metal deposition and patterning process is essential for the fabrication of flexible electronics because they are usually built on a heat-sensitive flexible substrate, for example plastic, fabric, paper, or metal foil. There is considerable interest in solution-processible metal nanoparticle ink deposition and patterning by selective laser sintering. It provides flexible electronics fabrication without the use of conventional photolithography or vacuum deposition techniques. We summarize our recent progress on the selective laser sintering of metals and metal oxide nanoparticles on a polymer substrate to realize flexible electronics such as flexible displays and flexible solar cells. Future research directions are also discussed.