• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.664-666
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• 2008

Low-temperature curable organic insulator was prepared through blending of polyimide type base resin and cross-linking agent. The newly developed resin can be formed into films using a wet process and cured at $130^{\circ}C$. Using the low temperature cured film as the gate dielectric layer, the field effect mobility of $0.15\;cm^2/V{\cdot}s$ was obtained from a pentacene field effect transistor in the saturation regime and no hysteresis behavior was observed in transfer curves.

• 한국인쇄학회지
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• 제19권2호
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• pp.68-78
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• 2001

UV-curable resin has the properties of quick-drying, thigh productivity at low temperature, energy savint, space saving, solventless, non-polluting and low-stinking, and thus, UV-curing system has been widely used in the fields of printing inks, adhesives, paints and coating agents. This study has been executed to micro-patterning used UV-curable resin, The micro-patterning properties of this photoresist were investigated under irradiation of UV light low pressure mercury lamp. When the exposed photoresist film was developed by pure water developer, the resolution of this photoresist was about 50$\mu\textrm{m}$.

• 한국재료학회지
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• 제13권1호
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• pp.18-23
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• 2003

Properties of Ag thick films fabricated by using low temperature curable silver pastes were investigated. Ag pastes were consisted of polymer resins and silver powders. Ag pastes were used for conductive or fixing materials between board and various electrical and electronic devices. Low temperature curable Ag pastes have some advantages over high temperature curable types. In cases of chip mounting, soldering properties were required for screen printed Ag thick films. In this study, four types of Ag pastes were fabricated with different compositions. Screen printed Ag thick films on alumina substrates were fabricated at various curing temperatures and times. Thickness, resistivity, adhesive strength and solderability of fabricated Ag thick films were characterized. Finally, Ag thick films produced using Ag pastes, sample A and B, cured at $150^{\circ}C$ for longer than 6 h and $180^{\circ}C$ for longer than 2 h, and $150^{\circ}C$ for longer than 1 h and $180^{\circ}C$ for 1 h, respectively, showed low resistivities of $10^{-4}$ $∼10^{-5}$ Ωcm and good adhesive strength of 1∼5 Mpa. Soldering properties of those Ag thick films with curing temperatures at solder of 62Sn/36Pb/3Ag were also investigated.

• 한국전기전자재료학회논문지
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• 제16권11호
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• pp.994-1000
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• 2003

In this study, gel polymer electrolytes (GPE) with semi-interpenerating network of poly (methyl methacrylate) and hexanediol dimethacrylate were synthesized and their electrochemical performances were evaluated. LiCoO$_2$/GPE/graphite cells were prepared and their performances depending on discharge currents and temperatures were evaluated. The precursor containing 5 vol% curable mixture had a low viscosity relatively. GPE showed good electrochemical stability up to potential of 4.8 V vs. Li/Li$\^$+/. Ionic conductivity of the gel polymer electrolyte at room temperature and -20$^{\circ}C$ was ca. 5.9 and 1.4${\times}$10$\^$-3/ Scm$\^$-1/, respectively. LiCoO$_2$/GPE/graphite cells showed good rate capability, low-temperature performance and cycleability.

• 전기화학회지
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• 제5권4호
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• pp.197-201
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• 2002

In this study, a gel polymer electrolyte was prepared from urethane acrylate and its electrochemical performances were evaluated. And, $LiCoO_2/GPE/graphite$ cells were prepared and their performances depending on discharge currents and temperatures were evaluated. The precursor containing $5 vol\%$ curable mixture had a low viscosity relatively. Ionic conductivity of the gel polymer electrolyte at room temperature and $-20^{\circ}C$ was ca. $5.9\times10^{-3}S{\cdot}cm^{-1}\;and\;1.7\times10^{-3}S{\cdot}cm^{-1}$, respectively. GPE showed electrochemical stability up to potential of 4.5V vs. $Li/Li^+.LiCoO_2/GPE/graphite$ cell showed a good high-rate and a low-temperature performance.

• 마이크로전자및패키징학회지
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• 제19권1호
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• pp.17-24
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• 2012

Recently, flip chip interconnection has been increasingly used in microelectronic assemblies. The common Flip chip interconnection is formed by reflow of the solder bumps. Lead-Tin solders and Tin-based solders are most widely used for the solder bump materials. However, the flip chip interconnection using these solder materials cannot be applied to temperature-sensitive components since solder reflow is performed at relatively high temperature. Therefore the development of low temperature bonding technologies is required in these applications. A few bonding techniques at low temperature of $150^{\circ}C$ or below have been reported. They include the reflow soldering using low melting point solder bumps, the transient liquid phase bonding by inter-diffusion between two solders, and the bonding using low temperature curable adhesive. This paper reviews various low temperature bonding methods.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1220-1223
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• 2003

The UV nanoimprint technology uses the UV light as the energy source. Because the imprint process is carried out in room temperature and low pressure, this technology has its own merits compared to the thermal nanoimprint. However, in UV nanoimprint technology, a resin which has low viscosity is essential for the improvement of accuracy. In this research, a resin (named as IMS01) which has relatively low viscosity was developed. And a measurement system was developed in order to measure the degree of cure of the resin. The measurement system which is composed of FT-IR, UV light source and optical guide can measure the degree of cure in real time. From the experimental results, it was found that the IMS01 is cured more rapidly than existing resin (PAK01).

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2017년도 춘계 학술논문 발표대회
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• pp.218-219
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• 2017

In order to examine the possibility of practical at low-temperature environment curable cement mortar with chloride and nitrite as cold resistance admixture for rebar corrosion prevention. As a result, chloride was used using nitrite complex in low temperature environment and corrosion performance of rebar was improved and mortar strength was promoted. The ratio of nitrite than chloride applied more than twice, corrosion of the reinforcing bars will not occur even in low temperature environment, cement hydration reaction will be promoted and mortar will prevent freezing damage.

• 한국인쇄학회지
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• 제18권1호
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• pp.13-24
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• 2000

UV-curable resin has the properties of quick-drying, high productivity at low temperature, energy, space saving, solventless, non-polluting and low-stinking, and thus, UV-curing system has been widely used in the fields of printing inks, adhesives, paints and coating agents. This study has been executed to develop a new functionnal material by the polymerization induced phase separation. The results obtained were as follows. As for the curing properties of the monomer/prepolymer/alkyd resin blends, it was found out that there was a peak by the polymerization induced phase separation when measuring the changes of viscosity and elasticity. It was also found out that such polymerization phase separation occurred in case that the alkyd resin contents were 20wt% and 30wt% and not found at the contents of 40wt%. Therefore, it would be desirable to maintain the contents of alkyd resin at less than 30wt% in order to use the polymerization induced phase separation.

• 전기화학회지
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• 제6권2호
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• pp.98-102
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• 2003

Urethane acrylate oligomer was synthesized and used in a gel polymer electrolyte (GPE) and then its electrochemical performances were evaluated. $LiCoO_2/GPE/graphite$ cells were prepared and their performances depending on discharge currents and temperatures were evaluated. The precursor containing $5 vol\%$ curable mixture had a low viscosity relatively. ionic conductivity of the gel polymer electrolyte at room temperature and $-20^{\circ}C$ was ca. $5.9\times10^{-3}S{\cdot}cm^{-1}\;and\;1.4times10^{-3}S{\cdot}cm^{-1}$, respectively. GPE showed good electrochemical stability up to potential of 4.5V vs. RLi/Li^+.\;LiCoO_2/GPE/graphite$ cell showed a good high-rate and low-temperature performance.