• Title/Summary/Keyword: low-power system chip

Search Result 284, Processing Time 0.025 seconds

Microfluidic Components and Bio-reactors for Miniaturized Bio-chip Applications

  • Euisik Yoon;Yun, Kwang-Seok
    • Biotechnology and Bioprocess Engineering:BBE
    • /
    • v.9 no.2
    • /
    • pp.86-92
    • /
    • 2004
  • In this paper miniaturized disposable micro/nanofluidic components applicable to bio chip, chemical analyzer and biomedical monitoring system, such as blood analysis, micro dosing system and cell experiment, etc are reported. This system includes various microfluidic components including a micropump, micromixer, DNA purification chip and single-cell assay chip. For low voltage and low power operation, a surface tension-driven micropump is presented, as well as a micromixer, which was implemented using MEMS technology, for efficient liquid mixing is also introduced. As bio-reactors, DNA purification and single-cell assay devices, for the extraction of pure DNA from liquid mixture or blood and for cellular engineering or high-throughput screening, respectively, are presented.

A 900MHz RP CMOS Power Amplifier for Wireless One-chip Tranceiver

  • Yoon, Jin-Han;No, Ju-Young;Son, Sang-Hee
    • Proceedings of the IEEK Conference
    • /
    • 2002.07b
    • /
    • pp.782-785
    • /
    • 2002
  • Power amplifier of wireless communication tranceiver can be effectually controlled output power. And small size and low power dissipation are indispensable to portable system. In this paper, to reduce the size of portable tranceiver, inductor is integrated in a single chip. And to reduce power dissipation, a power amplifier that can be digitally controlled output power, is proposed and designed.

  • PDF

A Low Power GaAs MMIC Multi-Function Chip for an X-Band Active Phased Array Radar System (X-대역 능동 위상 배열 레이더시스템용 저전력 GaAs MMIC 다기능 칩)

  • Jeong, Jin-Cheol;Shin, Dong-Hwan;Ju, In-Kwon;Yom, In-Bok
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.25 no.5
    • /
    • pp.504-514
    • /
    • 2014
  • An MMIC multi-function chip with a low DC power consumption for an X-band active phased array radar system has been designed and fabricated using a 0.5 ${\mu}m$ GaAs p-HEMT commercial process. The multi-function chip provides several functions: 6-bit phase shifting, 6-bit attenuation, transmit/receive switching, and signal amplification. The fabricated multi-function chip with a compact size of $16mm^2(4mm{\times}4mm)$ exhibits a gain of 10 dB and a P1dB of 14 dBm from 7 GHz to 11 GHz with a DC low power consumption of only 0.6 W. The RMS(Root Mean Square) errors for the 64 states of the 6-bit phase shift and attenuation were measured to $3^{\circ}$ and 0.6 dB, respectively over the frequency.

Giga-Hertz-Level Electromagnetic Field Analysis for Equivalent Inductance Modeling of High-Performance SoC and SiP Designs

  • Yao Jason J.;Chang Keh-Jeng;Chuang Wei-Che;Wang, Jimmy S.
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.5 no.4
    • /
    • pp.255-261
    • /
    • 2005
  • With the advent of sub-90nm technologies, the system-on-chip (SoC) and system-in-package (SiP) are becoming the trend in delivering low-cost, low-power, and small-form-factor consumer electronic systems running at multiple GHz. The shortened transistor channel length reduces the transistor switching cycles to the range of several picoseconds, yet the time-of-flights of the critical on-chip and off-chip interconnects are in the range of 10 picoseconds for 1.5mm-long wires and 100 picoseconds for 15mm-long wires. Designers realize the bottleneck today often lies at chip-to-chip interconnects and the industry needs a good model to compute the inductance in these parts of circuits. In this paper we propose a new method for extracting accurate equivalent inductance circuit models for SPICE-level circuit simulations of system-on-chip (SoC) and system-in-package (SiP) designs. In our method, geometrical meshes are created and numerical methods are used to find the solutions for the electromagnetic fields over the fine meshes. In this way, multiple-GHz SoC and SiP designers can use accurate inductance modeling and interconnect optimization to achieve high yields.

8.2-GHz band radar RFICs for an 8 × 8 phased-array FMCW receiver developed with 65-nm CMOS technology

  • Han, Seon-Ho;Koo, Bon-Tae
    • ETRI Journal
    • /
    • v.42 no.6
    • /
    • pp.943-950
    • /
    • 2020
  • We propose 8.2-GHz band radar RFICs for an 8 × 8 phased-array frequency-modulated continuous-wave receiver developed using 65-nm CMOS technology. This receiver panel is constructed using a multichip solution comprising fabricated 2 × 2 low-noise amplifier phase-shifter (LNA-PS) chips and a 4ch RX front-end chip. The LNA-PS chip has a novel phase-shifter circuit for low-voltage operation, novel active single-to-differential/differential-to-single circuits, and a current-mode combiner to utilize a small area. The LNA-PS chip shows a power gain range of 5 dB to 20 dB per channel with gain control and a single-channel NF of 6.4 dB at maximum gain. The measured result of the chip shows 6-bit phase states with a 0.35° RMS phase error. The input P1 dB of the chip is approximately -27.5 dBm at high gain and is enough to cover the highest input power from the TX-to-RX leakage in the radar system. The gain range of the 4ch RX front-end chip is 9 dB to 30 dB per channel. The LNA-PS chip consumes 82 mA, and the 4ch RX front-end chip consumes 97 mA from a 1.2 V supply voltage. The chip sizes of the 2 × 2 LNA-PS and the 4ch RX front end are 2.39 mm × 1.3 mm and 2.42 mm × 1.62 mm, respectively.

Low Power SoC Modem Design for High-Speed Wireless Communications (초고속 무선 통신을 위한 저전력 모뎀 SoC 설계)

  • Kim, Yong-Sung;Lim, Yong-Seok;Hong, Dae-Ki
    • Journal of the Semiconductor & Display Technology
    • /
    • v.9 no.2
    • /
    • pp.7-10
    • /
    • 2010
  • In this paper, we design a modem SoC (System on Chip) for low power consumption and high speed wireless communications. Among various schemes of high speed communications, an MB-OFDM (Multi Band-Orthogonal Frequency Division Multiplexing) UWB (Ultra-Wide-Band) chip is designed. The MB-OFDM uses wide-band frequency to provide high speed data rate. Additionally, the system imposes no interference to other services. The 90nm CMOS (Complementary Metal-Oxide Semiconductor) technology is used for the SoC design. Especially, power management mode is implemented to reduce the power consumption.

Research about Design Techniques of A Fire Control System Main Control Board for Individual Combat Weapons using a Small and Low power Processor (소형.저 전력 프로세서를 이용한 소화기 사격통제장치 주제어보드 설계기법 연구)

  • Kwak, Ki-Ho
    • Journal of the Korea Institute of Military Science and Technology
    • /
    • v.8 no.2 s.21
    • /
    • pp.30-37
    • /
    • 2005
  • In this paper, we propose how to design a fire control system main control board for individual combat weapons using a small and low power processor. To design an electric board of small weapon systems, Size and power consumption are very important factors. We solved the problem using selection of an adaptive processor, introduction of MicroChipPackaging method, and separate design of a main board Also we applied these methods to make the fire control system for small arms.

Power-aware Test Framework for NoC(Network-on-Chip) (NoC에서의 저전력 테스트 구조)

  • Jung, Jun-Mo;Ahn, Byung-Gyu
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.8 no.3
    • /
    • pp.437-443
    • /
    • 2007
  • In this paper, we propose the power-aware test framework for Network-on-Chip, which is based on embedded processor and on-chip network. First, the possibility of using embedded processor and on-chip network isintroduced and evaluated with benchmark system to test the other embeddedcores. And second, a new generation method of test pattern is presented to reduce the power consumption of on-chip network, which is called don't care mapping. The experimental results show that the embedded processor can be executed like the automatic test equipments, and the test time is reduced and the power consumption is reduced up to 8% at the communication components.

  • PDF

GaN Etch Process System using Parallel Plasma Source for Micro LED Chip Fabrication (병렬 플라즈마 소스를 이용한 마이크로 LED 소자 제작용 GaN 식각 공정 시스템 개발)

  • Son, Boseong;Kong, Dae-Young;Lee, Young-Woong;Kim, Huijin;Park, Si-Hyun
    • Journal of the Semiconductor & Display Technology
    • /
    • v.20 no.3
    • /
    • pp.32-38
    • /
    • 2021
  • We developed an inductively coupled plasma (ICP) etcher for GaN etching using a parallel plasma electrode source with a multifunctional chuck matched to it in order for the low power consumption and low process cost in comparison with the conventional ICP system with a helical-type plasma electrode source. The optimization process condition using it for the micro light-emitting diode (µ-LED) chip fabrication was established, which is an ICP RF power of 300 W, a chuck power of 200 W, a BCl3/Cl2 gas ratio of 3:2. Under this condition, the mesa structure with the etch depth over 1 ㎛ and the etch angle over 75° and also with no etching residue was obtained for the µ-LED chip. The developed ICP showed the improved values on the process pressure, the etch selectivity, the etch depth uniformity, the etch angle profile and the substrate temperature uniformity in comparison with the commercial ICP. The µ-LED chip fabricated using the developed ICP showed the similar or improved characteristics in the L-I-V measurements compared with the one fabricated using the conventional ICP method

Low-Power Bus Architecture Composition for AMBA AXI

  • Na, Sang-Kwon;Yang, Sung;Kyung, Chong-Min
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.9 no.2
    • /
    • pp.75-79
    • /
    • 2009
  • A system-on-a-chip communication architecture has a significant impact on the performance and power consumption of modern multi-processors system-on-chips (MPSoCs). However, customization of such architecture for a specific application requires the exploration of a large design space. Thus, system designers need tools to rapidly explore and evaluate communication architectures. In this paper we present the method for application-specific low-power bus architecture synthesis at system-level. Our paper has two contributions. First, we build a bus power model of AMBA AXI bus communication architecture. Second, we incorporate this power model into a low-power architecture exploration algorithm that enables system designers to rapidly explore the target bus architecture. The proposed exploration algorithm reduces power consumption by 20.1% compared to a maximally connected reduced matrix, and the area is also reduced by 20.2% compared to the maximally connected reduced matrix.