• 접착 및 계면
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• 제5권2호
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• pp.1-7
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• 2004

A novel carboxyl terminated butadiene-acrylonitrile (CTBN) modified, low temperature cure epoxy film adhesive was developed in this paper. It can be cured at as low as $75^{\circ}C$ for 4 hours with a pressure of 0.1MPa. After post cure at $120^{\circ}C$ for 2 hours, the bonding strengths of Phosphoric Acid Anodizing(PAA) surface treated aluminum adherend were similar to those of structural film adhesives curing at $120^{\circ}C$. It is suitable to bond both metal/composite laminate-to-laminate and laminate to honeycomb structure.

• 폴리머
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• 제38권2호
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• pp.171-179
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• 2014

우수한 성능을 지닌 대형 구조의 섬유강화 고분자(FRP) 복합재료 제품을 제조하기 위해 저온 경화형 프리프레그 개발이 활발히 진행되고 있다. 본 연구에서는 저온 경화형 프리프레그 제조에 적합한 매트릭스 수지를 확보하기 위하여 에폭시 수지, 경화제, 경화 촉진제로 구성된 저온 경화형 에폭시 수지 조성물의 경화거동 및 화학유변학을 고찰하였다. 경화반응 특성은 시차주사열량분석법과 유변물성측정법을 활용하여 승온 및 등온 조건에서 분석하였다. 연구 결과 매트릭스 수지로 제안된 저온 경화형 에폭시 수지 조성물은 $80^{\circ}C$에서 3시간에 경화시킬 수 있었고, 80과 $90^{\circ}C$에서의 젤화 시간은 각각 120분과 20분인 것으로 나타났다. 저온 경화형 수지를 경화시킨 수지 경화물의 열적, 기계적 물성은 고온 경화형 수지 경화물의 물성과 거의 동등하였다.

• Korean Chemical Engineering Research
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• 제46권1호
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• pp.200-204
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• 2008

비대칭성 고리형 지방족 아민 경화제를 이용한 diglycidyl ether of bisphenol F(DGEBF) 계열의 에폭시의 경화 반응을 등온 및 동적 경화 실험을 통하여 분석하였다. 등온 부분경화 실험 및 동적 경화반응을 통하여 아민 경화제의 비대칭성으로 인해 경화 반응이 저온부 및 고온부분의 두 가지 반응으로 구성되어 있다는 것을 확인하였고, 따라서 경화도가 0.6 이상인 영역에서는 등온경화반응 모델식을 이용하여 실험값을 예측하기는 어렵다는 것을 확인하였다. 승온 속도를 여러 가지로 변화시키며 동적 경화반응을 분석하여 저온부 및 고온부 각각의 반응에 대한 활성화에너지 및 속도상수를 알아보았고, 경화 초기에는 저온부의 반응이 주가 되는 것을 확인하였다.

• Design & Manufacturing
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• 제17권1호
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• pp.1-5
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• 2023

In multi-material injection molding, since two or more materials with different process conditions are used, it is essential to maximize process efficiency by operating the cooling or heating system to a minimum. In this study, Liquid silicone rubber (LSR) that can be cured at a low temperature suitable for the multi-material injection molding was selected and the cure behavior according to the process conditions was analyzed through differential scanning calorimetry (DSC). Dynamic measurement results of DSC with different heating rate were obtained, and through this, the total heat of reaction when the LSR was completely cured was calculated. Isothermal measurement results of DSC were derived for 60 minutes at each temperature from 80 ℃ to 110 ℃ at 10 ℃ intervals, and the final degree of cure at each temperature was calculated based on the total heat of reaction identified from the Dynamic DSC measurement results. As the result, it was found that when the temperature is lowered, the curing start time and the time required for the curing reaction increase, but at a temperature of 90 ℃ or higher, LSR can secure a degree of cure of 80% or more. However, at 80 ℃., it was found that not only had a relatively low degree of curing of about 60%, but also significantly increased the curing start time. In addition, in the case of 110 ℃, the parameters were derived from experimental result using the Kamal kinetic model.

• Elastomers and Composites
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• 제33권5호
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• pp.315-323
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• 1998

본 연구의 목적은 카본블랙 첨가량 변화, 가황조건 및 가황시스템 변화에 따른 배합고무의 가교밀도 및 고무보강성을 조사하고자 하였다. 결합고무량은 배합고무중 카본블랙 체적비가 증가함에 따라 증가하였으나, 총가교밀도는 결합고무량 증가에 따라 감소하였다. 가황반응 속도상수는 가황온도 및 가황시스템에 따라 현저하게 변화하였으며, 특히 가황온도에 강한 의존성을 나타내었다. 가황반응의 활성화에너지는 카본블랙 첨가량이 많고 EC 가황시스템이 적용된 배합고무 또는 카본블랙 첨가량이 적고 CC 가황시스템이 적용된 배합고무에서 높게 나타났다. 가황된 배합고무중 가장 높은 총가교밀도는 카본블랙 첨가량이 적고 가황시스템중 CC 가황시스템이 적용된 배합고무에서 나타났으며, EC 가황시스템에 의한 총가교밀도의 뚜렷한 변화는 나타나지 않았다. Mooney-Rivlin식에 의한 가장 높은 탄성상수는 카본블랙 첨가량이 적고, SEC 가황시스템이 사용된 배합고무에서 나타났다. 모듈러스는 배합고무중 카본블랙 첨가량이 증가함에 따라 증가하였으며, 가황시스템별 영향은 SEC>CC>EC 시스템 순으로 높게 나타났다.

• 대한기계학회논문집A
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• 제24권11호
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• pp.2853-2865
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• 2000

During the curing process of thick glass/epoxy laminates, a substantial amount of temperature lag and overshoot at the center of the laminates is usually experienced due to the large thickness and low thermal conductivity of the glass/epoxy composites. Also, it takes a longer time for full and uniform consolidation. In this work, temperature, degree of cure and consolidation of a 20 mm thick unidirectional glass/epoxy laminate were investigated using an experiment and a 3-dimentional numerical analysis. From the experimental and numerical results, it was found that the experimentally obtained temperature profile agreed well with the numerical one, and the cure cycle recommended by the prepreg manufacturer should be modified to prevent a temperature overshoot and to obtain full consolidation.

• 한국재료학회지
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• 제22권9호
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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• pp.53-58
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• 2000

During the curing process of thick glass/epoxy laminates, a substantial amount of temperature lag and overshoot at the center of the laminates is usually experienced due to the large thickness and low thermal conductivity of the glass/epoxy composites. Also, it requires a longer time for full and uniform consolidation. In this work, temperature, degree of cure and consolidation of a 20mm thick unidirectional glass/epoxy laminate were investigated using an experiment and a 3-dimentional numerical analysis considering the exothermic reaction. From the experimental and numerical results, it was found that the experimentally obtained temperature profile agreed well with the numerical one and the cure cycle recommended by the prepreg manufacturer should be modified to prevent a temperature overshoot and to obtain full consolidation.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1220-1223
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• 2003

The UV nanoimprint technology uses the UV light as the energy source. Because the imprint process is carried out in room temperature and low pressure, this technology has its own merits compared to the thermal nanoimprint. However, in UV nanoimprint technology, a resin which has low viscosity is essential for the improvement of accuracy. In this research, a resin (named as IMS01) which has relatively low viscosity was developed. And a measurement system was developed in order to measure the degree of cure of the resin. The measurement system which is composed of FT-IR, UV light source and optical guide can measure the degree of cure in real time. From the experimental results, it was found that the IMS01 is cured more rapidly than existing resin (PAK01).

• Macromolecular Research
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• 제16권6호
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• pp.561-566
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• 2008

NR composites with different curing systems were aged thermally at 60, 70, 80, and $90^{\circ}C$ for 2-185 days in a convection oven, and the changes in the crosslink density were investigated as a function of the accelerated thermal aging. The overall crosslink densities increased with increasing aging time irrespective of the aging temperatures and curing systems. The changes in crosslink density were enhanced by increasing the aging temperature. The degree of the increased crosslink density was in the following order: "the conventional cure system > the semi-EV system > the EV system". For short term thermal aging, the change in crosslink density with the aging time was complicated, particularly for low temperature aging. The activation energies of the change in crosslink density with thermal aging using the conventional and semi-EV cure systems increased and then remained relatively constant with increasing aging time, whereas that of the specimen with an EV cure system tended to increase linearly. The experimental results were explained by the dissociation of the existing polysulfidic linkages and the formation of new cross links through the crosslinking-related chemicals remaining in the sample.