• Corrosion Science and Technology
• /
• 제9권6호
• /
• pp.247-253
• /
• 2010

The characteristics of selective oxidation prior to hot-dip galvanizing with the annealing atmosphere dew point and chemical composition in dual-phase steels and their effect on the inhibition layer formation relevant to coating adhesion have been studied using a combination of electron microscopic and surface analytical techniques. The annealed and also galvanized samples of 3 kinds of Si/Mn ratios with varied amounts of Si addition were prepared by galvanizing simulator. The dew point was controlled at soaking temperature $800^{\circ}C$ in 15%$H_2$ -85%$N_2$ atmosphere. It was shown that good adhesion factors were mainly uniformity of oxide particle distribution of low number density and low Si/Mn ratio prior to hot-dip galvanizing. Their effect was the greatly reduced coating bare spots and the formation of uniform inhibition layer leading to good adhesion of Zn overlay. The mechanism of good adhesion is suggested by two processes: the formation of inhibition layer on the oxide free surface uncovered with no $SiO_2$-containing particles in particular, and the inhibition layer bridging of oxide particles. The growth of inhibition layer was enhanced markedly by the delayed reaction of Fe and Al with the increase of Si/Mn ratio.

• 한국진공학회지
• /
• 제6권S1호
• /
• pp.122-126
• /
• 1997

the Cu/polyimide system is known to be the best candidate for a multilevel interconnection system due to the low resistance of Cu and to the low dielectric constant of polyimide respectively. Ion beam mixing of Cu(40nm)/polyimide was carried out at room temperature with 80 keV Ar+ and N2+ form $1.5\times$1015 to 15$\times$1015 ions/cm2. The quantitative adhesion strength was measured by a standard scratch test. X-ray photoelectron spectroscopy and x-ray emission spectrocopy are employed to investigate the chemical bonds and the interlayer compound formation of the films Cu/Al/polyimide showed more adhesion strength than Cu/polyimide after ion beam mixing and N2+ ions are more effective in the adhesion enhancement than Ar+ with the same sample geometry. The XES results shows the formation of interlayer compound of CuAl2O4 which can reflect more adhesive Cu/Al/polyimide which has not been reported previously. The latter results is understood by the fact that N2+ ions produce more pyridinelike moiety, amide group and tertiary amine moiety whcih are known as adhesion promotors.

• Transactions on Electrical and Electronic Materials
• /
• 제8권3호
• /
• pp.125-130
• /
• 2007

DLC coating on ceramics is very useful for manufacturing the materials with hardness and low friction. Adhesion of DLC thin film on ceramics, on the other hand, is usually very weak. Adhesion of DLC film depends on many parameters such as contamination and chemical bonding between thin film and substrate. In this study, adhesion of DLC film on ceramics was improved by the intermediate layer when the plasma immersion ion deposition (PIID) technique was applied. It is found that the chemical composition and the thickness of intermediate layer have significantly an effect on the adhesion of DLC thin film on $Al_2O_3$.

• 한국건축시공학회:학술대회논문집
• /
• 한국건축시공학회 2018년도 추계 학술논문 발표대회
• /
• pp.173-174
• /
• 2018

In this study, the objective of this study was to evaluate the adhesive characteristics of existing self-adhesive rubber asphalt sheet, butyl sheet and acrylate sheet in a low temperature environment through Tack Rolling Ball Test to obtain basic data on acrylate. As a result of this experiment, in the case of the self-molding rubber asphalt sheet and the butyl rubber sheet, the compound of the sheet was frozen in the low temperature environment and the iron bead was separated. On the other hand, the acrylate sheet did not freeze the acrylate even at 0 ℃, It is confirmed that the measured value is shown by Ball Test.

• 한국염색가공학회지
• /
• 제17권6호
• /
• pp.36-41
• /
• 2005

The effects of low temperature plasma treatment on the properties of three types of foams, polyurethane(PU), injection phylon(IP), and phylon(PH) that used for footwear mid-sole were examined. The change of surface properties of foams were characterized by electron scanning microscope, contact angle measurement, and universal testing machine. Adhesion was tested by T-peel tests of plasma treated foams/polyurethane adhesive joints. The contact angle of three types of foams were decreased dramatically with the plasma treatment time, specifically noticeable in the case of phylon(Ph). It has shown the relationship with the contact angle of phylon(PH) and the distance between electrode and samples. The peel strength of foams were increased with the increase of plasma treatment time.

• Elastomers and Composites
• /
• 제39권1호
• /
• pp.61-70
• /
• 2004

본 연구는 폐식용유를 이용하여 아스팔트계 봉함재(sealant)를 제조하는 것이다. 아스팔트계 봉함재는 포장도로의 균열 봉함재 및 교량 조인트용 봉함재로 사용되는 재료이다. 아스팔트(AP-5), 열가소성 고무(SBS triblock copolymer), 점착제(tackifier) 및 안정제를 기본 성분으로 하여 연화제로 방향족계 또는 파라핀계 공정유, DOP(dioctyl phthalate), 벙커 C유 또는 폐식용유와 혼합하여 침입도, 연화점, 신도 및 인장 접착 신율(상온 및 저온)을 측정하였다. 연화제의 종류 및 함량에 따라 봉함재의 물성이 크게 변화하였다. 폐식용유 또는 DOP를 사용한 경우가 저온 인장 접착 특성이 가장 우수하였다. 폐식용유 함량이 증가함에 따라 아스팔트 봉함재의 침입도는 및 인장 접착 신율은 증가하였고 증량제로 탈크를 첨가할 경우 함량에 비례하여 침입도 및 저온 인장 신율은 감소하였다. 배합비를 최적화하여 침입도가 낮으면서도 저온 인장 접착성이 우수한 아스팔트 봉함재를 제조할 수 있었다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 1995년도 춘계학술대회 논문집
• /
• pp.35-38
• /
• 1995

Indium Tin Oxide(ITO) thin film is transparent to visible ray and conductive in electricity. It is seen that the samples made by the sputtering process have high transmission rate to visible ray and high adhesion , but the planar type magnetron sputtering process with is very well known in industrial region have a defect of partial erosion on the surface of target and a high loss of target and also since the substrate is positioned in plasma, the damage on thin film surface is caused by the reaction with plasma. In cylindrical magnetron sputtering system. it is known that the loss of target is little , the damage of thin film is very little and the adhesion of thin film with substrate is strong. In this study, we have made ITO thin film in the cylindrical DC magnetron system with the variable of substrate temperature , magnetic field, vacuum condution and the applied voltage. The general temperature for formation on ITO is asked at 350 $^{\circ}C$~400$^{\circ}C$ but we have made ITO is low temperature(80-150$^{\circ}C$) By studing electrical and optical properties of ITO thin fims made by varing several condition, we have searched the optimal condition for formation in the best ITO in low temperature.

• 접착 및 계면
• /
• 제17권2호
• /
• pp.67-71
• /
• 2016

본 연구에서는 반응성 희석제 함량에 따라 접착강도 및 물성을 향상시키기 위해 polyether polyol/polyester polyol, 4,4-dicyclohexylmethane diisocyanate ($H_{12}MDI$), 2-butanone oxime (MEKO)를 사용하여 저점도 폴리우레탄 핫멜트를 합성하였다. 합성된 저점도 폴리우레탄 핫멜트의 물성은 FT-IR, viscosity meter 및 UTM 등을 통해 확인하였다. 반응성 희석제의 함량이 증가하고 NCO-blocked prepolymer가 감소함에 따라 저점도 폴리우레탄 핫멜트 접착제의 점도는 증가하였으며, OH-terminated oligomer, NCO-blocked prepolymer, 반응성 희석제 함량의 비가 1 : 0.5 : 0.5일 때 1.1 kgf/cm 접착강도를 나타내었다.

• 한국섬유공학회:학술대회논문집
• /
• 한국섬유공학회 2003년도 봄 학술발표회 논문집
• /
• pp.434-435
• /
• 2003

Physicochemical properties of a polymer surface significantly affect adhesion, wetting, and dyeing properties. In recent years, low temperature plasma technology has been widely used for surface modification of polymers. Surface fluorination by low temperature plasma treatment has been employed to improve the water and oily repellency of textile fabrics. However, very few results have been reported on soil release properties of the oxygen plasma treated textile fabrics. (omitted)

• 마이크로전자및패키징학회지
• /
• 제18권4호
• /
• pp.63-70
• /
• 2011

Anorthite forming glass frits in amounts up to 25 vol% of the silver powder were added to improve the adhesion between the conductor pattern formed by thick film photoimageable process and the low temperature co-fired ceramics (LTCC) substrate. The sheet resistance of the conductor pattern was raised from 0.13 ${\Omega}/{\square}$ to 2.25 ${\Omega}/{\square}$ as the volume percentage of glass frit increased up to 25 vol%. The adhesion strength was improved with this glass frit increase, but it decreased when the glass content exceeded 20 vol% which are possibly attributed to the liquid pool effect and the reduced fracture toughness in the interface between conductor and LTCC layer. The shrinkage of the width of the conductor pattern decreased with the addition of glass contents.