• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• International Journal of Aeronautical and Space Sciences
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• v.12 no.4
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• pp.371-378
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• 2011

In this paper, the wavelet denoising techniques using thresholding method are applied to the low cost micro electromechanical system (MEMS)-global positioning system(GPS) integrated system. This was done to improve the navigation performance. The low cost MEMS signals can be distorted with conventional pre-filtering method such as low-pass filtering method. However, wavelet denoising techniques using thresholding method do not distort the rapidly-changing signals. They can reduce the signal noise. This paper verified the improvement of the navigation performance compared to the conventional pre-filtering by simulation and experiment.

• Journal of Positioning, Navigation, and Timing
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• v.3 no.2
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• pp.53-62
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• 2014

In the guided missile and unmanned vehicle system, the navigation system is one of the most important components. Recently, low-cost effective smart projectiles and guided bomb are being developed using MEMS based navigation system which has high-G, low-cost and small size. In this paper, locally developed MEMS based GPS/INS integrated navigation system will be introduced in comparison with the state of the art of MEMS based navigation system. And technical design and development method is described to satisfy the required performance of GPS receiver, MEMS inertial sensor assembly, navigation computer and software.

• KEPCO Journal on Electric Power and Energy
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• v.6 no.4
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• pp.405-411
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• 2020

In this paper, we designed the COS MEMS system for sensing the falling detection and explosive noise of fuse link in COS (Cut Out Switch) installing on the power distribution. This system analyzed the failure characteristics and an instantaneous breakdown of power distribution. Therefore, our system strengths the industrial competence and guaranties the stable power supply. In this paper, we applied BLE (Bluetooth Low Energy) technology which is suitable protocol for low data rate, low power consumption and low-cost sensor applications. We experimented with LSM6DSOX which is system-in-module featuring 3 axis digital accelerometer and gyroscope boosting in high-performance mode and enabling always-on low-power features for an optimal motion for the COS fuse holder. Also, we used the MP34DT05-A for gathering an ultra-compact, low power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface. The proposed COS MEMS system is developed based on nRF52 SoC (System on Chip), and contained a 3-axis digital accelerometer, a digital microphone, and a SD card. In this paper of experiment steps, we analyzed the performance of COS MEMS system with gathering the accelerometer raw data and the PDM (Pulse Data Modulation) data of MEMS microphone for broadcasting the failure of COS status.

• Structural Engineering and Mechanics
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• v.30 no.2
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• pp.191-209
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• 2008

A structural monitoring system based on cheap and wireless monitoring system is investigated in this paper. Due to low-cost and low power consumption, micro-electro-mechanical system (MEMS) is suitable for wireless monitoring and the use of MEMS and wireless communication can reduce system cost and simplify the installation for structural health monitoring. For system identification using wireless MEMS, a finite element (FE) model updating method through correlation with the initial analytical model of the structure to the measured one is used. The system identification using wireless MEMS is evaluated experimentally using a three storey frame model. Identification results are compared to ones using data measured from traditional accelerometers and results indicate that the system identification using wireless MEMS estimates system parameters with reasonable accuracy. Another smart sensor considered in this paper for structural health monitoring is Lead Zirconate Titanate (PZT) which is a type of piezoelectric material. PZT patches have been applied for the health monitoring of structures owing to their simultaneous sensing/actuating capability. In this paper, the system identification for building structures by using PZT patches functioning as sensor only is presented. The FE model updating method is applied with the experimental data obtained using PZT patches, and the results are compared to ones obtained using wireless MEMS system. Results indicate that sensing by PZT patches yields reliable system identification results even though limited information is available.

• Journal of Korea Society of Digital Industry and Information Management
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• v.18 no.4
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• pp.47-54
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• 2022

In this paper, MEMS embedded system design implemented the sensor events via analyzing the characteristics that dynamically happened to an abnormal status in power IoT environments in order to guarantee a maintainable operation. We used three kinds of tools in this paper, at first Bluetooth Low Energy (BLE) technology which is a suitable protocol that provides a low data rate, low power consumption, and low-cost sensor applications. Secondly LSM6DSOX, a system-in-module containing a 3-axis digital accelerometer and gyroscope with low-power features for optimal motion. Thirdly BM1422AGMV Digital Magnetometer IC, a 3-axis magnetic sensor with an I2C interface and a magnetic measurable range of ±120 uT, which incorporates magneto-impedance elements to detect the magnetic field when the current flowed in the power devices. The proposed MEMS system was developed based on an nRF5340 System on Chip (SoC), previously compared to the standalone embedded system without bluetooth technology via mobile App. And also, MEMS embedded system with BLE 5.0 technology broadcasted the MEMS system status to Android mobile server. The experiment results enhanced the performance of MEMS system design by combination of sensors, BLE technology and mobile application.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.9
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• pp.749-755
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• 2007

Recently, novel MEMS probe cards can support reliable wafer level chip test with high density probing capacity. However, manufacturing cost and process complexity are crucial weak points for low cost mass production. To overcome these limitations, we have developed micro spring structured MEMS probe card. For fabrication of micro spring module, a wire bonder and electrolytic polished gold wires are used. In this case, stringent tension force control is essential to guarantee the low level contact resistance of micro spring for reliable probing performance. For this, relation between tension force of fabricated probe card and contact resistance is characterized. Compare to conventional probe cards, developed MEMS probe card requires fewer fabrication steps and it can be manufactured with lower cost than other MEMS probe cards. Also, due to the small contact scratch patterns, we expect that it can be applied to bumping types chip test which require higher probing density.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.5
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• pp.522-526
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• 2015

Generally, underwater unmanned vehicle have adopted an inertial navigation system (INS), dead reckoning (DR), acoustic navigation and geophysical navigation techniques as the navigation method because GPS does not work in deep underwater environment. Even if the tactical inertial sensor can provide very detail measurement during long operation time, it is not suitable to use the tactical inertial sensor for small size and low cost UUV because the tactical inertial sensor is expensive and large. One alternative to INS is attitude heading reference system (AHRS) with the micro-machined electro mechanical system (MEMS) inertial sensor because of MEMS inertial sensor's small size and low power requirement. A cost effective and small size attitude heading reference system (AHRS) which incorporates measurements from 3-axis micro-machined electro mechanical system (MEMS) gyroscopes, accelerometers, and 3-axis magnetometers has been developed to provide a complete attitude solution for UUV. The AHRS based MEMS overcome many problems that have inhibited the adoption of inertial system for small UUV such as cost, size and power consumption. Several evaluation experiments were carried out for the validation of the developed AHRS's function and these experiments results are presented. Experiments results prove the fact that the developed MEMS AHRS satisfied the required specification.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2012.10a
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• pp.394-399
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• 2012

In recent years, MEMS sensors show huge attraction in machine condition monitoring, which have advantages in power, size, cost, mobility and flexibility. They can integrate with smart sensors and MEMS sensors are batch product. So the prices are cheap. And the suitability of it for condition monitoring is researched by experimental study. This paper presents a comparative study and performance test of classification of MEMS sensors in target machine fault classification by 3 intelligent classifiers. We attempt to signal validation of MEMS sensor accuracy and reliability and performance comparisons of classifiers are conducted. MEMS accelerometer and MEMS current sensors are employed for experiment test. In addition, a simple feature extraction and cross validation methods were applied to make sure MEMS sensors availabilities. The result of application is good for using fault classification.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.18 no.4
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• pp.458-464
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• 2008

The structural health monitoring has been gaining more importance in civil engineering areas such as earthquake and wind engineering. The use of health monitoring system can also provide tools for the validation of structural analytical model. However, only few structures such as historical buildings and some important long bridges have been instrumented with structural monitoring system due to high cost of installation, long and complicated installation of system wires. In this paper, the structural monitoring system based on cheap and wireless monitoring system is investigated. The use of advanced technology of micro-electro-mechanical system(MEMS) and wireless communication can reduce system cost and simplify the installation. Further the application of wireless MEMS system can provide enhanced system functionality and due to low noise densities. Identification results are compared to ones using data measured from traditional accelerometers and results indicate that the system identification using wireless MEMS system estimates system parameters accurately.