• 제목/요약/키워드: low aspect ratio

검색결과 407건 처리시간 0.031초

Magnetic Force Microscopy (MFM) Study of Remagnetization Effects in Patterned Ferromagnetic Nanodots

  • Chang, Joon-Yeon;Fraerman A. A.;Han, Suk-Hee;Kim, Hi-Jung;Gusev S. A.;Mironov V. L.
    • Journal of Magnetics
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    • 제10권2호
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    • pp.58-62
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    • 2005
  • Periodic magnetic nanodot arrays were successfully produced on glass substrates by interference laser lithography and electron beam lithography methods. Magnetic force microscopy (MFM) observation was carried out on fabricated nanodot arrays. MFM tip induced magnetization effects were clearly observed in ferromagnetic elliptical nanodots varying in material and aspect ratio. Fe-Cr dots with a high aspect ratio show reversible switching of the single domain magnetization state. At the same time, Co nanomagnets with a low aspect ratio exhibit tip induced transitions between the single domain and the vortex state of magnetization. The simple nanolithography is potentially an efficient method for fabrication of patterned magnetic arrays.

폴리에틸렌 섬유 종류에 따른 고로슬래그 기반 무시멘트 복합재료의 역학특성 (Mechanical Properties of Slag-Based Cementless Composites According to Types of Polyethylene Fibers)

  • 진정언;최정일;박세언;이방연
    • 한국건설순환자원학회논문집
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    • 제10권3호
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    • pp.243-251
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    • 2022
  • 이 연구의 목적은 인장강도 및 형상비가 다른 폴리에틸렌 섬유가 무시멘트 복합재료의 인장거동에 미치는 영향을 실험적으로 조사하는 것이다. 이를 위하여 섬유 종류 및 물-결합재비를 달리한 세 가지 배합을 준비하였고, 밀도 실험, 압축강도 실험 및 일축인장 실험을 수행하였다. 실험결과 유사한 화학구조를 갖지만 인장강도가 10 % 낮고, 형상비가 8.3 % 높은 폴리에틸렌 섬유를 사용한 경우 복합재료의 인장변형성능과 인성이 각각 11.7 %와 12.4 % 높고 균열폭은 9.1 % 작은 성능을 나타내었다. 또한 동일한 폴리에틸렌 섬유를 사용한 경우 물-결합재비가 증가하여 복합재료의 강도가 낮지만 인장변형성능과 균열패턴이 향상될 수 있는 것으로 나타났다.

종횡비 가 낮은 직각밀폐용기내 의 Prandtl 수 가 큰 유체 의 자연대류 에 관한 실험적 연구 (High prandtl number natural convection in a low-aspect ratio rectangular enclosure)

  • 이진호;황규석;현명택
    • 대한기계학회논문집
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    • 제9권6호
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    • pp.750-756
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    • 1985
  • 본 연구에서는 종횡비 0.1이고 상.하 수평경계면이 단열된 직각밀폐용기내에 서 Pr수가 1보다 큰 물(Pr=6.97, 20.deg. C) 및 실리콘 오일(Pr=1086.42, 20.deg. C)의 양단의 온도차에 의한 자연대류에서 아직 충분히 연구되지 않은 코어형상에 주안점을 두고 실 험적으로 관찰, 조사하였으며 그 결과를 Lee의 이론적인 예측과도 비교, 검토해 보았 다.

Experimental studies of headed stud shear connectors in UHPC Steel composite slabs

  • Gao, Xiao-Long;Wang, Jun-Yan;Yan, Jia-Bao
    • Structural Engineering and Mechanics
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    • 제74권5호
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    • pp.657-670
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    • 2020
  • Due to the high compressive and tensile strength of ultra-high performance concrete (UHPC), UHPC used in steel concrete composite structures provided thinner concrete layer compared to ordinary concrete. This leaded to the headed stud shear connectors embedded in UHPC had a low aspect ratio. In order to systematic investigate the effect of headed stud with low aspect ratio on the structural behaviors of steel UHPC composite structure s this paper firstly carried out a test program consisted of twelve push out specimens. The effects of stud height, aspect ratio and reinforcement bars in UHPC on the structural behaviors of headed studs were investigated. The push out test results shows that the increasing of stud height did not obviously influence the structural behaviors of headed studs and the aspect ratio of 2.16 was proved enough to take full advantage of the headed stud strength. Based on the test results, the equation considering the contribution of weld collar was modified to predict the shear strength of headed stud embedded in UHPC. The modified equation could accurately predict the shear strength of headed stud by comparing with the experimental results. On the basis of push out test results, bending tests consisted of three steel UHPC composite slabs were conducted to investigate the effect of shear connection degree on the structural behaviors of composite slabs. The bending test results revealed that the shear connection degree had a significantly influence on the failure modes and ultimate resistance of composite slabs and composite slab with connection degree of 96% in s hear span exhibited a ductile failure accompanied by the tensile yield of steel plate and crushing of UHPC. Finally, analytical model based on the failure mode of composite slabs was proposed to predict the ultimate resistance of steel UHPC composite slabs with different shear connection degrees at the interface.

사출 금형의 능동형 온도제어에 따른 사출특성에 관한 연구 (A Study on Injection Characteristic using Active Temperature Control of Injection mold)

  • 조창연;신홍규;홍남표;서영호;김병희
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2007년도 추계학술대회 논문집
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    • pp.302-305
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    • 2007
  • In recent years, many researches on new storage media with high capacity and information are developing. For manufacture of optical storage with high capacity, the injection molding process is generally used. In order to increase the filling ratio of the injection molding structure, the injection molding process required for high injection pressure, packing pressure and temperature control of the mold. However, conventional injection molding process is difficult to increase the filling ratio using injection master with the range of several nanometers and high aspect ratio. In order to improve and increase filling ratio of nano-structure with high aspect ratio, the active temperature control of injection mold was used. Experimental conditions were used injection pressure, time and temperature. Consequently, by using the peltier device into injection mold, we carried out the efficient and active temperature control of mold at low cost.

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단일 첨가제를 이용한 고종횡비 TSV의 코발트 전해증착에 관한 연구 (A Study on the Cobalt Electrodeposition of High Aspect Ratio Through-Silicon-Via (TSV) with Single Additive)

  • 김유정;이진현;박기문;유봉영
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2018년도 춘계학술대회 논문집
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    • pp.140-140
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    • 2018
  • The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

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Experimental and analytical study of squat walls with alternative detailing

  • Leonardo M. Massone;Cristhofer N. Letelier;Cristobal F. Soto;Felipe A. Yanez;Fabian R. Rojas
    • Computers and Concrete
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    • 제33권5호
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    • pp.497-507
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    • 2024
  • In squat reinforced concrete walls, the displacement capacity for lateral deformation is low and the ability to resist the axial load can quickly be lost, generating collapse. This work consists of testing two squat reinforced concrete walls. One of the specimens is built with conventional detailing of reinforced concrete walls, while the second specimen is built applying an alternative design, including stirrups along the diagonal of the wall to improve its ductility. This solution differs from the detailing of beams or coupling elements that suggest building elements equivalent to columns located diagonally in the element. The dimensions of both specimens correspond to a wall with a low aspect ratio (1:1), where the height and length of the specimen are 1.4 m, with a thickness of 120 mm. The alternative wall included stirrups placed diagonally covering approximately 25% of the diagonal strut of the wall with alternative detailing. The walls were tested under a constant axial load of 0.1f'cAg and a cyclic lateral displacement was applied in the upper part of the wall. The results indicate that the lateral strength is almost identical between both specimens. On the other hand, the lateral displacement capacity increased by 25% with the alternative detailing, but it was also able to maintain the 3 complete hysteretic cycles up to a drift of 2.5%, reaching longitudinal reinforcement fracture, while the base specimen only reached the first cycle of 2% with rapid degradation due to failure of the diagonal compression strut. The alternative design also allows 46% more energy dissipation than the conventional design. A model was used to capture the global response, correctly representing the observed behavior. A parametric study with the model, varying the reinforcement amount and aspect ratio, was performed, indicating that the effectiveness of the alternative detailing can double de drift capacity for the case with a low aspect ratio (1.1) and a large longitudinal steel amount (1% in the web, 5% in the boundary), which decreases with lower amounts of longitudinal reinforcement and with the increment of aspect ratio, indicating that the alternative detailing approach is reasonable for walls with an aspect ratio up to 2, especially if the amount of longitudinal reinforcement is high.

덕트 종횡비가 회전덕트 내 압력강하에 미치는 영향 (Effect of Duct Aspect Ratios on Pressure Drop in a Rotating Two-Pass Duct)

  • 김경민;이동현;조형희
    • 대한기계학회논문집B
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    • 제30권6호
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    • pp.505-513
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    • 2006
  • The pressure drop characteristics in a rotating two-pass duct with rib turbulators are investigated in the present study. Three ducts of different aspect ratios (W/H=0.5, 1.0 and 2.0) are employed with a fixed hydraulic diameter ($D_h$) of 26.7 mm. $90^{\circ}$-rib turbulators with $1.5mm{\times}1.5mm$ cross-section are attached on the leading and trailing surfaces. The pitch-to-rib height ratio (p/e) is 1.0. The distance between the tip of the divider and the outer wall of the duct is 1.0 W. The thickness of divider wall is 6.0 mm o. 0.225 $D_h$. The Reynolds number (Re) based on the hydraulic diameter is kept constant at 10,000 and the .elation number (Ro) is varied from 0.0 to 0.2. As duct aspect ratio increases, high friction factor ratios show in overall regions. The reason is that the rib height-to-duct height ratio (e/H) increases, but the divider wall thickness-to-duct width ($t_d/W$) decreases. The rotation of duct produces pressure drop discrepancy between the leading and trailing surfaces. However, the pressure drop discrepancy of the high duct aspect ratio (AR=2.0) is smaller than that of the low duct aspect ratio (AR=0.5) due to the decrement of duct hight (H).

Numerical Analysis of Flow and Pollutant Dispersion over 2-D Bell Shaped Hills

  • Jung, Young-Rae;Park, Keun;Park, Warn-Gyu;Park, Ok-Hyun
    • Journal of Mechanical Science and Technology
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    • 제17권7호
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    • pp.1054-1062
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    • 2003
  • The numerical simulations of flow and pollutant particle dispersion are described for two-dimensional bell shaped hills with various aspect ratios. The Reynolds-averaged incompressible Navier-Stokes equations with low Reynolds number $\kappa$-$\varepsilon$ turbulent model are used to simulate the flowfield. The gradient diffusion equation is used to solve the pollutant dispersion field. The code was validated by comparison of velocity, turbulent kinetic energy, Reynolds shear stress, speed-up ratio, and ground level concentration with experimental and numerical data. Good agreement has been achieved and it has been found that the pollutant dispersion pattern and ground level concentration have been strongly influenced by the hill shape and aspect ratio, as well as the location and height of the source.