• Title/Summary/Keyword: line laser

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Effect of a Single Applied Overload on Fatigue Crack Growth Behavior in Laser-welded Sheet Metal

  • Kwak Dai-Soon;Kim Seog-Hwan;Oh Taek-Yul
    • International Journal of Precision Engineering and Manufacturing
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    • v.7 no.3
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    • pp.30-34
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    • 2006
  • We investigated fatigue crack growth behavior in laser-welded sheet metal caused by a single applied overload The fatigue specimens were made using butt jointed cold rolled sheet metal that was welded with a $CO_2$ laser, The effects of the specimen thickness and overload ratio were determined from fatigue crack propagation tests, These tests were performed in such a way that the fatigue loading was aligned parallel to the weld line while the crack propagated perpendicular to the weld line, Overload ratios of 1.0, 1.5, and 2. 0 were applied near the tip of the fatigue crack at points located 6, 4, and 2 mm from the weld line. The specimens were either 0.9 or 2.0 mm thick. The size of the plastic zone at the crack tip due to the single applied overload was also determined using finite element analysis.

Process Monitoring in Laser Beam Cutting by Photo Diode (레이저 절단에서 광소자를 이용한 가공공정 모니터링)

  • 김봉채;장욱진;김재도
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1994.10a
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    • pp.354-359
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    • 1994
  • On-line process control equipment for CO $_{2}$ laser cutting is unavailable for industrial application. The major part of the industrial cutting machines are regulated off-line by highly educated engineers. The quality inspection of the sample is visual and referred to different quality scales. Due to lack of automation potential laser users hesitate to implement the cutting method. The first step toward an automation of the process is development of a process monitoring system and the research is concentrated on the area of on-line quality detection during CO $_{2}$ laser cutting. The method bases on the detection of the emitted light from the cut front by photo diode. the signal from photo diode has been undertaken from Fourier analysis and statistical analysis. As a result, it is possible to estimate striation pattern according to beam travel speed.

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Dispersion Characteristics of Nonspherical Fume Micro-Particles in Laser Line Machining in Terms of Particle Sphericity (입자 구형도에 따른 레이저 선가공의 비구형 흄 마이크로 입자 산포 특성 연구)

  • Kim, Kyoungjin;Park, Joong-Youn
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.2
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    • pp.1-6
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    • 2022
  • This computational investigation of micro-sized particle dispersion concerns the fume particle contamination over target surface in high-precision laser line machining process of semiconductor and display device materials. Employing the random sampling based on probabilistic fume particle generation distributions, the effects of sphericity for nonspherical fume particles are analyzed for the fume particle dispersion and contamination near the laser machining line. The drag coefficient correlation for nonspherical particles in a low Reynolds number regime is selected and utilized for particle trajectory simulations after drag model validation. When compared to the corresponding results by the assumption of spherical fume particles, the sphericity of nonspherical fume particles show much less dispersion and contamination characteristics and it also significantly affects the particle removal rate in a suction air flow patterns.

Construction of Laser Lithography System using Method of Monitoring the Focal Point (초점 모니터 방법을 이용한 레이져 Lithography 장치의 제작과 응용)

  • 이도형
    • Proceedings of the Optical Society of Korea Conference
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    • 1990.02a
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    • pp.222-226
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    • 1990
  • This paper represents the construction of laser beam writing system, laser lithography, using new method that guarantees convenience and accuracy in laser focusing. The X, Y translation stage using DC motors was controlled by the computer. Minimum line width of 1.6${\mu}{\textrm}{m}$ was obtained by the laser lithography system.

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The fabrication of micro- size conductor lines on alumina patterned by laser ablation (레이저 직접 묘화법에 의한 알루미나 기판위의 미세 전도성 패턴 제작)

  • 김혜원;이제훈;신동식;강성군
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1889-1892
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    • 2003
  • The fabrication of micro-size patterning on alumina substrate is generated by laser direct writing, which has high precision and selectivity of various laser beam energies. The depth and width of patterns is affected by laser parameter such as laser power, scan rate. Through the chemical and mechanical polishing Pd seeds was effectively got rid of alumina substrate for selectivity electroless Ni plating. Thermal treatment is good method for changing electrical property of conductor line, because the treatment can control of the grain size.

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Generation of Laser Scan Path Considering Resin Solidification Phenomenon in Micro-stereolithography Technology (마이크로 광 조형기술에서 수지경화현상을 고려한 레이저 주사경로 생성)

  • 조윤형;조동우
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.10a
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    • pp.1037-1040
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    • 2002
  • In micro-stereolithography technology, fabrication conditions that include laser power, laser scan speed, laser scan pitch, and material property of photopolymer such as penetration depth and critical exposure are considered as major process variables. But the existing scan path generation methods based only on CAD model have not taken them into account, which has resulted in cross-section dimension of low accuracy. Thus, to enhance cross-section dimensional accuracy, the physical resin solidification n phenomena should be reflected in laser scan path generation and stage operating code. In this paper, multi-line experiments based on single line solidification model are performed. And the method for improving cross-section dimensional accuracy is presented, which is to apply the database based on experimental results to laser scan path generation.

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Laser Controllable Thermo-cleaving of LCD Glasses (레이저를 이용한 LCO 유리 절단)

  • Lee Seak-Joon;C. Kondratenko B.
    • Proceedings of the Korean Society of Laser Processing Conference
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    • 2004.10a
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    • pp.50-61
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    • 2004
  • Nowadays Laser Controllable Thermo-cleaving is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor. The concept of this method is shown in Picture 1. Laser beam heats glass up to strain point not to melting point and cooling system chills glass to make maximum thermal stress in glass and then the thermal stress generates micro thermal crack in other words blind crack. Laser Controllable Thermo-cleaving controls the thermal stress to optimize the blind crack up to level of mass-production line.

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Effect of Hot-Stamping on Mechanical Properties and Microstructures of CO2 Laser Welded Boron Steel coated with Al-Si layer (Al-Si 용융 도금된 보론강 CO2 레이저 용접부의 미세조직과 기계적 성질에 미치는 핫스탬핑 처리의 영향)

  • Oh, Myeonghwan;Kong, Jongpan;Shin, Hyeonjeong;Kwon, Minsuck;Jung, Byunghun;Kang, Chungyun
    • Laser Solutions
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    • v.16 no.3
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    • pp.1-10
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    • 2013
  • In this study, Al-Si coated boron steel(1.2 mm) were laser welded by $CO_2$ laser and hot-stamping was applied to the laser joints. Tensile properties and microstructures of the joints were investigated before and after hot-stamping. Tensile and yield strengths of the as welded specimen similar with base metal and fracture occurred base metal of boron steel. Although, in case of heat treated specimen, fracture occurred fusion zone that Al segregated zone near the bond line. These could be explained by the existence of ferrite, in the Al segregated zone near the bond line and base metal of boron steel. Before hot-stamping, hardness of base metal is lower than fusion zone and heat affected zone in spite of exist Al segregation zone($Fe_3$(Al,Si)). So fracture occurred base metal. Although, after hot-stamping, microstructure of base metal and welds zone transformed to martensite and bainite except in Al segregation zone near the bond line that $Fe_3$(Al,Si) transformed to a-ferrite. So fracture occurred Al segregation zone near the bond line.

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Laser Micro-machining technology for Fabrication of the Micro Thin-Film Inductors (초소형 박막 인덕터 제작을 위한 레이저 미세가공 기술 개발)

  • Ahn, Seong-Joon;Ahn, Seung-Joon;Kim, Dae-Wook;Kim, Ho-Seob;Kim, Cheol-Gi
    • Journal of the Korean Magnetics Society
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    • v.13 no.3
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    • pp.115-120
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    • 2003
  • We have developed laser micro-machining technology for fabrication of the micro thin-film inductors. After the thin layers of FM/M/FM films were coated to the silicon substrate by using the conventional sputtering method, the new laser machining was applied to the patterning process that used to be carried out by the semiconductor lithography procedure. A CW Nd:YAG laser operating in TEM$\sub$00/ mode was actively Q-switched to obtain the very short pulse of 200 ns. The laser micro-machining process with pulse energy and repetition rate have been optimized as 5 mJ/pulse and 5 kHz, respectively, to obtain the line resolution as fine as 20 $\mu\textrm{m}$.

The Scanning Laser Source Technique for Detection of Surface-Breaking and Subsurface Defect

  • Sohn, Young-Hoon;Krishnaswamy, Sridhar
    • Journal of the Korean Society for Nondestructive Testing
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    • v.27 no.3
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    • pp.246-254
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    • 2007
  • The scanning laser source (SLS) technique is a promising new laser ultrasonic tool for the detection of small surface-breaking defects. The SLS approach is based on monitoring the changes in laser-generated ultrasound as a laser source is scanned over a defect. Changes in amplitude and frequency content are observed for ultrasound generated by the laser over uniform and defective areas. The SLS technique uses a point or a short line-focused high-power laser beam which is swept across the test specimen surface and passes over surface-breaking or subsurface flaws. The ultrasonic signal that arrives at the Rayleigh wave speed is monitored as the SLS is scanned. It is found that the amplitude and frequency of the measured ultrasonic signal have specific variations when the laser source approaches, passes over and moves behind the defect. In this paper, the setup for SLS experiments with full B-scan capability is described and SLS signatures from small surface-breaking and subsurface flaws are discussed using a point or short line focused laser source.