• Title/Summary/Keyword: light edge

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Detection of Traffic Light using Color after Morphological Preprocessing (형태학적 전처리 후 색상을 이용한 교통 신호의 검출)

  • Kim, Chang-dae;Choi, Seo-hyuk;Kang, Ji-hun;Ryu, Sung-pil;Kim, Dong-woo;Ahn, Jae-hyeong
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2015.05a
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    • pp.367-370
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    • 2015
  • This paper proposes an improve method of the detection performance of traffic lights for autonomous driving cars. Earlier detection methods used to adopt color thresholding, template matching and based learning maching methods, but its have some problems such as recognition rate decreasing, slow processing time. The proposed method uses both detection mask and morphological preprocessing. Firstly, input color images are converted to YCbCr image in order to strengthen its illumination, and horizontal edge components are extracted in the Y Channel. Secondly, the region of interest is detected according to morphological characteristics of the traffic lights. Finally, the traffic signal is detected based on color distributions. The proposed method showed that the detection rate and processing time improved rather than the conventional algorithm about some surrounding environments.

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Laser Thermal Processing System for Creation of Low Temperature Polycrystalline Silicon using High Power DPSS Laser and Excimer Laser

  • Kim, Doh-Hoon;Kim, Dae-Jin
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.647-650
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    • 2006
  • Low temperature polycrystalline silicon (LTPS) technology using a high power laser have been widely applied to thin film transistors (TFTs) for liquid crystal, organic light emitting diode (OLED) display, driver circuit for system on glass (SOG) and static random access memory (SRAM). Recently, the semiconductor industry is continuing its quest to create even more powerful CPU and memory chips. This requires increasing of individual device speed through the continual reduction of the minimum size of device features and increasing of device density on the chip. Moreover, the flat panel display industry also need to be brighter, with richer more vivid color, wider viewing angle, have faster video capability and be more durable at lower cost. Kornic Systems Co., Ltd. developed the $KORONA^{TM}$ LTP/GLTP series - an innovative production tool for fabricating flat panel displays and semiconductor devices - to meet these growing market demands and advance the volume production capabilities of flat panel displays and semiconductor industry. The $KORONA^{TM}\;LTP/GLTP$ series using DPSS laser and XeCl excimer laser is designed for the new generation of the wafer & FPD glass annealing processing equipment combining advanced low temperature poly-silicon (LTPS) crystallization technology and object-oriented software architecture with a semistandard graphical user interface (GUI). These leading edge systems show the superior annealing ability to the conventional other method. The $KORONA^{TM}\;LTP/GLTP$ series provides technical and economical benefits of advanced annealing solution to semiconductor and FPD production performance with an exceptional level of productivity. High throughput, low cost of ownership and optimized system efficiency brings the highest yield and lowest cost per wafer/glass on the annealing market.

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Leadframe SiP with Conformal Shield

  • Kim, ByongJin;Sim, KiDong;Hong, SeoungJoon;Moon, DaeHo;Son, YongHo;Kang, DaeByoung;Khim, JinYoung;Yoon, JuHoon
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.4
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    • pp.31-34
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    • 2016
  • System In Package (SiP) is getting popular and momentum for the recent wearable, IoT and connectivity application apart from mobile phone. This is driven by market demands of cost competitive, lighter and smaller/thinner and higher performance. As one of many semiconducting assembly products, Leadframe product has been widely used for low cost solution, light/ small and thin form factor. But It has not been applied for SiP although Leadframe product has many advantages in cost, size and reliability performance. SiP is mostly based on laminate substrate and technically difficult on Leadframe substrate because of a limitation in SMT performance. In this paper, Leadframe based SiP product has been evaluated about key technical challenges in SMT performance and electrical shield technology. Mostly Leadframe is considered not available to apply EMI shield because of tie-bar around package edge. In order to overcome two major challenges, connection bars were deployed properly for SMT pad to pad and additional back-side etching was implemented after molding process to achieve electrical isolation from outer shield coating. This product was confirmed assembly workability as well as reliability.

Improved Dark Channel Prior Dehazing Algorithm by using Compensation of Haze Rate Miscalculated Area (안개량 오추정 영역 보정을 이용한 개선된 Dark Channel Prior 안개 제거 알고리즘)

  • Kim, Jong-Hyun;Cha, Hyung-Tai
    • Journal of Broadcast Engineering
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    • v.21 no.5
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    • pp.770-781
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    • 2016
  • As a result of reducing color information and edge information, object distinction in haze image occurs with difficulty. One of the famous defogging algorithm is haze removal by using 'Dark Channel Prior(DCP)', which is used to predict for transmission rate using color information of an image and eliminates haze from the image. But, In case that haze rate is estimated under color information, there is a miscalculated issue which is posed by haze rate and transmission in area with high brightness such as a white object or a light source. In this paper, We deal with a miscalculated issue by correcting from around haze rate, after application of color normalization used by main white part of image haze. Moreover, We calculation improved transmission based on the result of improved haze rate estimation. And then haze image quality is developed through refining transmission.

A STUDY ON THE FRACTURE TOUGHNESS OF DENTAL COMPOSITE RESINS (치과용 복합레진의 파괴인성에 관한 실험적 연구)

  • Park, Jin-Hoon;Min, Byung-Soon;Choi, Ho-Young;Park, Sang-Jin
    • Restorative Dentistry and Endodontics
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    • v.15 no.2
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    • pp.17-33
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    • 1990
  • The purpose of this study was to evaluate the fracture toughness of dental composite resins and to investigate the filler factor affecting the fracture behaviour on which the degree of fracture toughness depends. Six kinds of commercially available composite resin;, including two of each macrofilled, microfilled, and hybrid type were used for this study, The plane strain fracture toughness ($K_{10}$) was determined by three-point bending test using the single edge notch specimen according to the ASTM-E399. The specimens were fabricated with visible light curing or self curing of each composite resin previously inserted into a metal mold, and three-point bending test was conducted with cross-head speed of 0.1mm/min following a day's storage of the specimens in $37^{\circ}C$ distilled water. The filler volume fractions were determined by the standard ashing test according to the ISO-4049. Acoustic Emission(AE), a nondestructive testing method detecting the elastic wave released from the localized sources In material under a certain stress, was detected during three-point bending test and its analyzed data was compared with, canning electron fractographs of each specimen. The results were as follows : 1. The filler content of composite resin material was found to be highest in the hybrid type followed by the macrofilled type, and the microfilled type. 2. It was found that the value of plane strain fracture toughness of composite resin material was in the range from 0.69 MPa$\sqrt{m}$ to 1 46 MPa$\sqrt{m}$ and highest In the macrofilled type followed by the hybrid type, and the microfilled type. 3. The consequence of Acoustic Emission analysis revealed that the plane strain fracture toughness increased according as the count of Acoustic Emission events increased. 4. The higher the plane strain fracture toughness became, the higher degree of surface roughness and irregularity the fractographs demonstrated.

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A Study on the Design of Door Module PNL Using CAE and Inverse Compensation for Warpage (휨방지를 위한 CAE와 역보정을 이용한 Door Module PNL설계에 관한 연구)

  • Kim, Doo-Tae;Han, Seong-Ryeol
    • Design & Manufacturing
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    • v.12 no.2
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    • pp.27-33
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    • 2018
  • Korea's automobile industry, which has grown rapidly to become the world's fifth-largest automobile producer, To cope with environmental pollution and energy problems in order to prevail competitive edge in global market We are investing a lot of research personnel and costs. Among them, for realizing alternative light weight It is a part of the automobile module system that has achieved the technological development before the breakthrough in the injection molding process in the press process. Door module PNL was the subject of research. The door module PNL is expected to cause warpage before the mold production due to the thin and flat product characteristics and fiber orientation characteristic of the material. In this paper, CAE analysis and reverse correction tool Design. CAE analysis to obtain the results of weld line position, bending position and deformation value Through the correction tool, think3, the original product was modified before the mold production to improve the completeness of the parts. In fiber orientation, the position and size of the cooling channel in the mold, the position and size of the gate, Temperature, pressure, time, and work environment. Compared with the result of CAE analysis, the product that was reverse-corrected by Think3 was manufactured, and injection molding was performed. Injection molding products were tested 24 hours later. 3.5 mm to 7.0 mm, and under the fixed condition, the deviation was from 1.1 mm to 1.5 mm. Unlike the CAE analysis, the deviation of the actual injection pressure and the cooling temperature, the fiber orientation of the material, In order to solve this problem, it is necessary to compare the injection conditions with the database, I knew I had to catch the standard.

Investigation of Ice Impacts on Aluminum Skin Structure (알루미늄 표피 구조의 Ice 충돌 특성에 관한 연구)

  • Park, Gyu Cheol;Myeong, No Sin
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.31 no.5
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    • pp.110-116
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    • 2003
  • With the growth of aircraft performance and needs for light aircraft, the problems associated with hail impacts on aircraft during flights and grounding become and important issue. These hail encounters can cause severe damages to aircraft and result in major concerns in safety and cost. Since nearly all external components of the commercial and military aircraft-in particular, the nose section and the leading edge of the wing and tail-are subject to damages, much effort has been put into understanding of this problem. However, most of the previous studies have focused on the composite components and few results have been reported for the metallic components. In this paper, we study the ice impacts on the aluminum component with the finite element analysis method utilizing commercial non-linear dynamics solver LS-DYNA. The results are compared with the experimental data and a simple measure of the ice impact effects is proposed.

A study on optical properties of InP for implementation of fiber-optic temperature sensor (광섬유 온도센서를 위한 InP의 광학적 특성 연구)

  • Kim, Young-Soo;Shin, Keon-Hak;Chon, Byong-Sil
    • Journal of Sensor Science and Technology
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    • v.3 no.3
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    • pp.36-44
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    • 1994
  • A fiber-optic temperature sensor utilizing InP as a sensing medium was implemented and tested to determine the dependance of the optical characteristics of InP on physical parameters for the use as design parameters in this type of sensors. The optical absorption coefficient of InP has been determined through the experimental measurement of the fundamental optical absorption characteristics at various temperature points. The transmission characteristics of light source at three temperature points($249^{\circ}K$, $298^{\circ}K$, $369^{\circ}K$) are computed from the optical absorption coefficient for a fixed length of InP. A series of measurement concluded that optical absorption edge moves to longer wavelength region at a speed of 0.42 nm / $^{\circ}K$ as the specimen gets hotter, and that increasing the thickness of the InP sensing layer shifts power density curve to lower temperature region.

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A Study on the Features of Digilog in Contemporary Fashion (현대 패션에 나타난 디지로그의 특징)

  • Lew, Chahyang;Suh, Seunghee
    • Journal of Fashion Business
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    • v.21 no.5
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    • pp.61-77
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    • 2017
  • Fashion companies are increasingly becoming aware of the importance of Digilog as a response strategy to an emotional stimulus, in order to win the hearts of consumers, because the Digilog provides a new type of emotional value. The features of Digilog found in modern fashion are characterized as follows: first, the "Fashion Image of Hybrid Nature" expresses nature in a new light or reinterprets existing expressions of nature, by using cutting-edge technology based on the psychological desire to return to, adapt with, and harmonize with nature. Second, the "Fashion Image of Nostalgia," which exhibits past forms of regressive fashion, is a fashion code that can be understood as a social trend. It has a digital exterior, with retro materials and old perfumes that reflect psychological comfort, as its expressive medium. Third, the "Lifestyle through the Technique of Interaction" is the sharing of information through consumer participation and delivery, or its interaction. Fourth, the "Fashion Design through the Technique of Customizing" allows consumers to actively participate in the design process. It reflects the consumer's desire to personally design fashion products. Fifth, the "Emotion Sharing through the Technique of Storytelling," which focuses on intangible values, is based on the sentiment of communication between the consumer and the brand, thereby satisfying the inner values as well as the aesthetic demands of consumers. This study confirmed that digital fashion, which uses digital technology based on analog sentiments, has opened up a new environment for fashion culture and has also widened the boundaries of fashion.

Characterization of ITO Films Prepared by Metal Organic Decomposition (유기금속분해 법에 의한 ITO 박막의 제조 및 특성)

  • Go, Seong-Min;Lee, Byeong-Su
    • Korean Journal of Materials Research
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    • v.5 no.8
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    • pp.1045-1049
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    • 1995
  • Thin films of Indium tin oxie (ITO) were prepared by the process of metal organic decomposition. Light transmittance and electrical transport properties of the films were studied with varying the firing temperature and SnO$_2$content. XRD study showed that tin substituted indium in the In$_2$O$_3$lattice. The resistivity had the minimum value of 2.5 ${\times}$ 10$\^$-3/$\Omega$-cm when the content of SnO$_2$was 9wt.%. This value was higher by a factor of 10 than the previously reported results. This difference was attributed to the low mobilities presumably caused by the fine grain size. The transmittance of ITO films in the visible range was over 90%, and the optical energy gap calculated from the absorption edge was in the range of 4.51 and 4.96eV.

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