• 제목/요약/키워드: lead-frame

검색결과 333건 처리시간 0.026초

그린콘텐츠를 적용한 키즈 테마파크 공간연출에 관한 연구 (A Study on Space Representation of Kid Theme Park using Green Contents)

  • 류효진;문정민
    • 한국실내디자인학회논문집
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    • 제21권4호
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    • pp.106-113
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    • 2012
  • As environmental pollution and resource exhaustion have been considered as social issues, interest in green content industries which lead low-carbon green growth is increasing. In various areas, green content products and programs have been presented. Of them, kid theme parks are designed to recognize fun and advantages eco-friendly consumption with green contents has and lead children to recognize the problems of environmental pollution and the importance of environment. This study aims to analyse kid theme parks using green contents and characteristics of their space representation. The analysis frame was made through theoretical examination for bibliographical data and a direct interview in terms of factors of green contents. For the analysis frame, visitors were directly interviewed from June to July, 2012. Cases of introduction were analysed to identify realization and characteristics of green contents. As a result of the analysis, it was discovered that kid theme parks using green contents pursued green stories, but they did not consider environment seriously in terms of content materials and methods of realization. To develop successful kid theme parks using green contents, multi-dimensional research is needed in various aspects and various contents such as media should be introduced. The parks should provide fun space for children and propagate green ideas. Its success can lead in green entertainment. The study will be helpful for design of future kid theme parks.

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Effects of the isolation parameters on the seismic response of steel frames

  • Deringol, Ahmet H.;Bilgin, Huseyin
    • Earthquakes and Structures
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    • 제15권3호
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    • pp.319-334
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    • 2018
  • In this paper, an analytical study was carried out to propose an optimum base-isolated system for the design of steel structures equipped with lead rubber bearings (LRB). For this, 5 and 10-storey steel moment resisting frames (MRFs) were designed as Special Moment Frame (SMF). These two-dimensional and three-bay frames equipped with a set of isolation systems within a predefined range that minimizes the response of the base-isolated frames subjected to a series of earthquakes. In the design of LRB, two main parameters, namely, isolation period (T) and the ratio of strength to weight (Q/W) supported by isolators were considered as 2.25, 2.5, 2.75 and 3 s, 0.05, 0.10 and 0.15, respectively. The Force-deformation behavior of the isolators was modelled by the bi-linear behavior which could reflect the nonlinear characteristics of the lead-plug bearings. The base-isolated frames were modelled using a finite element program and those performances were evaluated in the light of the nonlinear time history analyses by six natural accelerograms compatible with seismic hazard levels of 2% probability of exceedance in 50 years. The performance of the isolated frames was assessed in terms of roof displacement, relative displacement, interstorey drift, absolute acceleration, base shear and hysteretic curve.

Sn-Pb 솔더 접합부의 초기 강도에 관한 연구 (A Study on Initial Strength of Sn-Pb Solder Joint)

  • 신영의;정승부
    • Journal of Welding and Joining
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    • 제14권3호
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    • pp.86-92
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    • 1996
  • This paper presents the investigations on the initial strength and its variation of Sn-Pb solder joint using different lead frames, such as are 42 alloy lead and Cu alloy lead. As the result of the lack of initial strength at solder joints, whose pitch is from 0.3 to 0.4mm, short circuit often occured at the solder joint by thermal shock or external impact. Therefore, in this paper investigations were performed on the initial strength and its variation of Sn-Pb solder joint as well as fractured mode with using different lead frames.

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면진된 실대형 일경간-이층 철골조 자유진동 실험 (Free Vibration Test for Base Isolated Real Size One Bay-Two Story Steel Frame)

  • 김대곤
    • 한국지진공학회:학술대회논문집
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    • 한국지진공학회 2000년도 춘계 학술발표회 논문집 Proceedings of EESK Conference-Spring
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    • pp.391-398
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    • 2000
  • To evaluate the seismic performance of a base isolated building accurate analytical model should be selected. The analytical results such as reduced accelerations member forces and relative displacements of the superstructure of the base isolated building are only meaningful when the analytical model is close enough to the real structure. Real size one bay-two story steel frame and two kinds of seismic isolators(laminated elastomeric bearing and lead-rubber bearing) are designed. manufactured and constructed in the laboratory. Free vibration tests using fuse bars were conducted to evaluate the change of dynamic characteristics(period and damping) before and after base isolation of the steel frame. The experimental results of free vibration tests were also used as a bench mark for adjusting the selected analytical modeling to real base isolated steel frame.

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An Efficient Anti-collision Algorithm for the EPCglobal Class-1 Generation-2 System under the Dynamic Environment

  • Chen, Yihong;Feng, Quanyuan
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • 제8권11호
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    • pp.3997-4015
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    • 2014
  • Radio frequency identification (RFID) is an emerging wireless communication technology which allows objects to be identified automatically. The tag anti-collision is a significant issue for fast identifying tags due to the shared wireless channel between tags and the reader during communication. The EPCglobal Class-1 Generation-2 which uses Q algorithm for the anti-collision is widely used in many applications such as consumer electronic device and supply chain. However, the increasing application of EPCglobal Class-1 Generation-2 which requires the dynamic environment makes the efficiency decrease critically. Furthermore, its frame length (size) determination and frame termination lead to the suboptimal efficiency. A new anti-collision algorithm is proposed to deal with the two problems for large-scale RFID systems. The algorithm has higher performance than the Q algorithm in the dynamic environment. Some simulations are given to illustrate the performance.

Improved performance of multi tone masks by advanced compensation methods

  • Ekberg, Peter;Sydow, Axel Von
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.520-523
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    • 2009
  • The drive towards lowering costs and increasing frame rates results in new panel designs and thereby new photomasks designs. One common way to reduce cost is to reduce the number of production steps. For this multi tone photomasks (MTM) are needed. MTMs contain more information and increases photomask placement requirements. Increasing frame rates lead to shrinking geometries. The combination of HTM and shrinking geometries drastically increases the requirements imposed on the pattern generators used to print the photomasks. New methods are therefore needed to enable future photomask manufacturing. This paper introduces three advanced image quality enhancing methods.

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합성 PC부재의 Steel-joint Connection Method 개발 기초연구 (A basic study of steel-joint connection method of composite precast concrete members)

  • 김근호;이동훈;김선국
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2013년도 춘계 학술논문 발표대회
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    • pp.10-11
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    • 2013
  • Green Frame is a column-beam system formed by composite precast concrete column and beam connected with steel buried in both members. During the installation of Green columns, the columns of Green Frame, covering 3 floors per each piece and beams, the eccentricity can be observed due to the construction error and the weight of beam itself. Such eccentricity may have a little influence on a single frame, yet, it can develop critical issues to the installation of subsequent beams or beams on the upper floors in the context of a building as a whole that has multiple frames. These issues lead to delay in frame installation, decrease of productivity and increase of cost, etc. Therefore, this study presents a steel-joint connection method in order to solve the issues. The steel-joint connection method exists on slope plane and reinforcing plate in steel frame buried in composite PC members. Through this method, the issues can be resolved without requiring additional equipment or manpower.

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납삽입 적층고무 및 마찰진자형 면진장치 적용 구조물의 지진응답 해석 (Seismic response analysis of the structures with lead rubber and friction pendulum isolation bearings)

  • 허영철
    • 한국지진공학회:학술대회논문집
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    • 한국지진공학회 2000년도 추계 학술발표회 논문집 Proceedings of EESK Conference-Fall 2000
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    • pp.415-423
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    • 2000
  • In this study, a computer program was developed for the seismic response analysis of the structures with base isolation bearings. On a 6-story steel frame structure isolated by lead rubber bearings and friction pendulum bearings, seismic response analyses using the developed program and commercial program and experiments were carried out. The results were compared one another and discussed.

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무연 솔더가 적용된 자동차 전장부품 접합부의 열적.기계적 신뢰성 평가 (Thermo-Mechanical Reliability of Lead-Free Surface Mount Assemblies for Auto-Mobile Application)

  • 하상수;김종웅;채종혁;문원철;홍태환;유충식;문정훈;정승부
    • Journal of Welding and Joining
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    • 제24권6호
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    • pp.21-27
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    • 2006
  • This study was focused on the evaluation of the thermo-mechanical board-level reliability of Pb-bearing and Pb-free surface mount assemblies. The composition of Pb-bearing solder was a typical Sn-37Pb and that of Pb-free solder used in this study was a representative Sn-3.0Ag-0.5Cu in mass %. Thermal shock test was chosen for the reliability evaluation of the solder joints. Typical $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed between both solders and Cu lead frame at the as-reflowed state, while a layer of $Cu_3Sn$ was additionally formed between the $Cu_6Sn_5$ and Cu lead frame during the thermal shock testing. Thickness of the IMC layers increased with increasing thermal shock cycles, and this is very similar result with that of isothermal aging study of solder joints. Shear test of the multi layer ceramic capacitor(MLCC) joints was also performed to investigate the degradation of mechanical bonding strength of solder joints during the thermal shock testing. Failure mode of the joints after shear testing revealed that the degradation was mainly due to the excessive growth of the IMC layers during the thermal shock testing.