• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.204-205
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• 2005

[ $(Na_{0.5},\;K_{0.5})NbO_3$ ] ceramics were studied as lead free Piezoelectric materials. The addition of CdO were enhanced the sinterability of the NKN ceramics. The $(Na_{0.5},\;K_{0.47}Cd_{0.02})NbO_3$ ceramics show that electromachanical coupling factor($k_p$) is 0.34and mechanical quality factor($O_m$) is 120.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2011.04a
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• pp.627-632
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• 2011

This study was carried out vibration attenuation of vibration absorber attached to the cantilever beam structure. Modern tank guns are stabilized to allow fire on the move while traversing uneven terrain. However, as the length of the barrel is extended, to meet required muzzle exit velocities, the terrain induced vibrations lead to increased muzzle pointing errors. Thus, reducing these vibrations should lead to increased accuracy. The vibration absorber includes a compliant energy storage device, such as a spring, and a mass secured to the energy storage device. In this study, it accomplished a research in about gun barrel vibration attenuation using tuned mass damper. The barrel was hung from a bungee cord for free - free condition. It accomplished a vibration experiment for verified attenuation efficiency.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.17-21
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• 2013

Sn whiskers are one of the serious causes of the failure of electronics. Sn whiskers grow spontaneously from Sn-based, lead-free finished surfaces, even at room temperature. A primary factor of these Sn whiskers growth is compressive stress, which enhances the diffusion of Sn or other elements. The sources of compressive stress are the growth of non-uniform large intermetallic compounds along the interface between the Sn grain boundary and Cu substrate. Recent studies revealed the methods for reducing Sn whisker growth. This paper gives an overview about recent researches for mitigation methods of Sn whisker growth during nearly room temperature storage.

• Journal of Welding and Joining
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• v.19 no.4
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• pp.406-412
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• 2001

This study is focussed on the numerical prediction of the thermal fatigue life of a ${\mu}BGA$(Micro Ball Grid Array) solder joint. Numerical method is used to perform three-dimensional finite element analysis for Sn-37mass%Pb. Sn-3.5mass%Ag solder alloys during the given thermal cycling. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. In this study, a practical correlation for the prediction of the thermal fatigue life is suggested by using the dimensionless variable $\gamma$. As a result. it could be found that Sn-3.5mass%Ag has longer fatigue life than Sn-37mass%Pb in low cycle fatigue. In addition. the result with ${\gamm}ashow$a good agreement with the FEA results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.03a
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• pp.12-12
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• 2010

The piezoelecric properties of $(K_{0.5}Na_{0.5})(Nb_{0.96}Sb_{0.04})O_3$+$1.2mol%K_4CuNb_8O_{23}$+$xmol%La_2O_3$ lead-free piezoelecric ceramics were investigated as a function x. These ceramics were fabricated by conventional ceramics processing. Piezoelectric constant ($d_{33}$) and piezoelectric charge coefficient ($g_{33}$) of x=0.2 mol% composition exhibited good properties of 160.3pC/N and 37.4($10^{-3}Vm/N$), respectively.

• Journal of the Korean Society of Safety
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• v.25 no.6
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• pp.14-21
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• 2010

A miniature single solder ball joint is designed to mimic the actual solder joints used in the micro-electric industries. Shear tests were conducted to evaluate the mechanical behavior of miniature single solder joints at intermediate strain rates from $0.019\;s^{-1}$ to $2.16\;s^{-1}$ at room temperature. The shear fracture strength of the present solder ball joints generally increased with increasing shear strain rate, ranging from 32 to 51MPa. This behavior is affected by the sensitivity of bulk solder strength to strain rate. Shear fracture mode changed from brittle to partial ductile (failure inside the bulk solder) with an increase of shear speed. The unloading shear fracture toughness is generally consistent with the measure of the amount of bulk solder on the fractured surface.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• Journal of the Optical Society of Korea
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• v.16 no.4
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• pp.336-342
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• 2012

A low-cost optimal double-prism method is proposed by using the developed MATLAB program to correct chromatic aberration. We present an efficient approach to choose a couple of low-cost glasses to obtain a low aberration double prism. The doublet prisms were made of two lead-free glasses. The relative partial dispersion of the two lead-free glasses is identical and their Abbe numbers are different greatly. The proposed design aims to minimize chromatic aberration, such as in apochromats, for paraxial ray tracing. Finally, an optimization design for real ray tracing can be evaluated by the chromatic aberration curve with a minimal area.

• Prospectives of Industrial Chemistry
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• v.22 no.3
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• pp.11-30
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• 2019

나노스케일 구조를 갖는 납 기반 할로겐화 페로브스카이트는 조절 가능한 방출 파장과 결함 내성(defect-tolerance)을 가지며, 높은 광 발광 양자 수율과 물질의 실온 합성 가능성으로 인해 최근 많은 관심을 받았다. 이러한 특성은 디스플레이에 적용되었을 때, 넒은 색 영역을 표현할 수 있다. 그러나 납의 독성이 페로브스카이트 디스플레이의 상용화를 방해한다. 따라서 최근에 비납계 할로겐화 페로브스카이트 나노결정에 대한 연구가 진행되었다. 본 글에서 우리는 비납계 페로브스카이트 나노결정의 설계 및 광 물리적 특성 및 발광 소자로의 응용에 대한 우리의 견해에 대하여 서술하며, 할로겐화 페로브스카이트 나노결정의 특징, 납을 대체할 수 있는 후보 원소에 대한 논의, 콜로이드성 비납계 페로브스카이트 나노결정을 합성하는 방법, 이들의 광학 특성을 제어하고 향상시키는 방법, 발광소자에서 비납계 페로브스카이트 나노결정을 사용한 최근의 연구 동향 및 이 분야에 대한 전망을 서술한다.

• Journal of Welding and Joining
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• v.16 no.4
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• pp.117-124
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• 1998

During the reflow process in SMT, the molten solder has been observed to move upward and solidify along the gullwing lead, which is called the wicking phenomenon. In this paper, possible causes of the wicking are investigated, and its effects on the solder joint profile are quantitatively estimated by introducing the wicking constant. The free energy reduction by intermetallic formation between the copper and tin seems to be the major source of wicking action. The joint profiles of the gullwing lead are calculated using the previous finite element formulation incorporated with the wicking constant. The calculated results show reasonably good agreements with the experimental data when the wicking effects are considered.