• Ceramist
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• v.8 no.1
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• pp.14-18
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• 2005

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.11a
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• pp.42-42
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• 2002

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.4
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• pp.525-530
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• 2006

Recently companies which do not use the heavy metals such as lead, chrome, mercury to the electronic goods and alternate the materials environment-friendly are increasing. In advanced country, lead-free solder without lead is developed and soldering process almost disappeared. The lead-free solder is environment-friendly but is expensive and lack of tack and durability than lead, the improvement is necessary. To solve this problem, the welding process that uses TIG welding and the welding technology between different kind metals for lead-in wire of room lamp and base department was developed. To do this, previous room lamp manufacturing process was analysed and which process can be alternate was proposed. And the test for selection of optimal value of TIG welding parameter was done. Finally the lamp aging test and earthquake resistant test was done to check the reliability of welded room lamp.

• Korean Journal of Materials Research
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• v.26 no.12
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• pp.721-725
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• 2016

This work focuses on the electrical conduction mechanism in a lead free ($Na_{0.5}K_{0.5}NbO_3$ ; NKN) ceramics system with $LiNbO_3$ content of approximately critical concentration $x{\geq}0.2$. Lead free $(1-x)(Na_{0.5}K_{0.5})NbO_3-x(LiNbO_3)$, $NKN-LN_x$ (x = 0.1, 0.2) ceramics were synthesized by solid-state reaction method. Crystal structures are confirmed by X-ray diffraction. The electric-mechanical bond coefficient $k_p$ decreases and the phase transition temperature $T_c$ increases with increasing x content, as determined by dielectric and piezoelectric measurements. The value of the real dielectric constants ${\varepsilon}^{\prime}$ and $k_BT{\varepsilon}^{\prime\prime}$ showed anomalies around $T_c$ ($462^{\circ}C$ in the NKN-LN0.1 and $500^{\circ}C$ in the NKN-LN0.2). For the ionic conduction of mobile ions, the activation energies are obtained as $E_I=1.76eV$ (NKN-LN0.1) and $E_I=1.55eV$ (NKN-LN0.2), above $T_c$, and $E_{II}=0.78$ (NKNL-N0.1) and $E_{II}=0.81$ (NKN-LN0.2) below $T_c$. It is believed that the conduction mechanisms of NKN-LNx ceramics are related to ionic hopping conduction, which may arise mainly due to the jumping of $Li^+$ ions.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.9
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• pp.555-560
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• 2014

In this paper, in order to develop outstanding Pb-free composition ceramics, the $Fe_2O_3$-doped ($Na_{0.525}K_{0.443}Li_{0.037}$)($Nb_{0.883}Sb_{0.08}Ta_{0.037}$)$O_3$ + 0.3 wt% $Bi_2O_3$ + x wt% $Fe_2O_3$ (x= 0~1.0 wt%)(abbreviated as NKL-NST) lead-free piezoelectric ceramics have been synthesized using the ordinary solid state reaction method. The effect of $Fe_2O_3$-doping on their microstructure and electrical properties were investigated. XRD diffraction pattern studies confirm that $Fe_2O_3$ completely diffused into the NKL-NST lattice to form a new stable soild solution with $Fe^{3+}$ entering the $Nb^{5+}$, $Sb^{5+}$ and $Ta^{5+}$ of B-site. And, phase structure of all the ceramics exhibited pure perovskite phase and no secondary phase was found in the ceramics. The ceramics doped with 0.6 wt% $Fe_2O_3$ have the optimum values of piezoelectric constant($d_{33}$), planar piezoelectric coupling coefficient($k_p$) and mechanical quality factor($Q_m$) : $d_{33}$ = 233 [pC/N], $k_p$= 0.44, $Q_m$= 95. These results indicate that the ($Na_{0.525}K_{0.443}Li_{0.037}$)($Nb_{0.883}Sb_{0.08}Ta_{0.037}$)$O_3$ +0.3 wt% $Bi_2O_3$ + 0.6 wt% $Fe_2O_3$ ceramic is a promising candidate for lead-free piezoelectric ceramics.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.25-31
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• 2010

In this study, we investigated the morphology and thermal stability of interfacial phases in joint between lead free solder(Sn-3.0Ag-0.5Cu) and electroless Ni-W-P under bump metallizations(UBM) with different tungsten contents as a function of thermal aging. Content of phosphorus of each deposits was fixed at 8 wt.%, and content of tungsten was variated each 0, 3, 6 and 9 wt.%. Specimens were prepared by reflowing at $255^{\circ}C$, aging range was $200^{\circ}C$ and up to 2 weeks. After reflow process, in the electroless Ni(W)-P/solder joint, the interfacial intermetallic compound(IMC) was showed both $(Cu,Ni)_6Sn_5$ and $(Ni,Cu)_3Sn_4$. UBM and generated IMC at the interface of lead free solder was proportionally increased with aging time. The thickness of IMC was increased because the generation rate of $Ni(W)_3P$ decreased with increasing contents of W.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.147-163
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• 2003

European Union bans the usage of Pb in electronics from July 1 st, 2006. The Near-eutectic Sn-Ag-Cu alloys are the leading candidate Pb-free solders (for SMT card assembly). .The microstructure of Sn-Ag-Cu alloys is discussed in terms of solidification, composition and cooling rate. Methods of controlling Ag3Sn plates are discussed. .Thermo-mechanical fatigue behaviors of Sn-Ag-Cu solder joints are reviewed. Tin pest, whisker growth, electromigration of Pb-free solders are discussed.

• Journal of Applied Biological Chemistry
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• v.64 no.2
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• pp.159-164
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• 2021

Heavy metals exist in soils in various chemical forms including free metal ions and organo-metal complexes. The ratio of free metal ions has been known to be highly associated with the plant absorption of heavy metals. This study aims to understand the effect of free ions and organo-metal complexes on the absorption of lead (Pb) and cadmium (Cd) by plants. For this, lettuce grown in a hydroponic system for 28 days was consequently grown another 48 hours using Pb and Cd solutions. The ratios of free ion to organo-metal complexes in the solutions were adjusted at 100:0, 90:10, 70:30, 60:40 by four different organic acids (citric, oxalic, acetic, and humic acid). After that, the concentration of Pb and Cd in lettuce were analyzed. The Pb and Cd absorption by lettuce was more relied on the types of organic acids treated and the type of metals rather than the ratio of free metal ions. For example, citric acid increased the Pb absorption while it decreased the Cd absorption by lettuce. There was no significant relationship between free metal ion ratios and both Pb and Cd uptake by lettuce. It could be explained that citric acid, a relatively higher molecular weight organic acid, has higher ion binding capacity, so it forms organo-Pb complex easily due to the higher affinity of Pb on the binding site in comparison with Cd. Consequently, this complexation would assist Pb uptake by lettuce.

• Journal of Welding and Joining
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• v.18 no.3
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• pp.89-96
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• 2000

As solder becomes small and fine, the reliability and solderability of solder joint are the critical issue in present electronic packaging industry. Besides the use of lead(Pb) containing solders for the interconnections of microelectronic subsystem assembly and packaging has enviromental problem. In this study, using Sn/Pb and Sn/Ag eutectic solder paste, in order to obtain decrease of solder joint strength with increasing aging time, initial solder joint strength and aging strength after 1000 hour aging at $100^{\circ}C$ were measured by peel test. And in order to obtain the growth of intermetallic compound(IMC) layer thickness, IMC layer thickness was measured by scanning electron microscope(SEM). As a result, solder joint strength was decreased with increasing aging time. The mean IMC layer thickness was increased linearly with the square root of aging time. The diffusion coefficient(D) of IMC layer was found to $1.29{\times}10^{-13}{\;}cm^2/s$ at using Sn/Pb solder paste, 7.56{\times}10^{-14}{\textrm}{cm}^2/s$ at using Sn/Ag solder paste.

• Ocean Systems Engineering
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• v.10 no.3
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• pp.333-357
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• 2020

International Maritime Organisation (IMO) regulations insist on reduced emission of CO₂, noxious and other environmentally dangerous gases from ship, which are usually let out while burning fossil fuel for running its propulsive machinery. Contrallability of ship during sailing has a direct implication on its course keeping and changing ability, and tries to have an optimised routing. Bad coursekeeping ability of a ship may lead to frequent use of rudder and resulting changes in the ship's drift angle. Consequently, it increases vessels resistance and also may lead to longer path for its journey due to zigzag movements. These adverse effects on the ship journey obviously lead to the increase in fuel consumption and higher emission. Hence, IMO has made it mandatory to evaluate the manoeuvring qualities of a ship at the designed stage itself. In this paper a numerical horizontal planar motion mechanism is simulated in CFD environment and from the force history, the hydrodynamic derivatives appearing in the manoeuvring equation of motion of a ship are estimated. These derivatives along with propeller thrust and rudder effects are used to simulate different standard manoeuvres of the vessel and check its parameters against the IMO requirements. The present study also simulates these manoeuvres by using numerical free running model for the same ship. The results obtained from both these studies are presented and discussed here.