• Title/Summary/Keyword: layer method

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A two-layer watermarking method using inherent image structure (영상의 내재 구조를 이용한 2-계층 워터마킹 기법)

  • 고윤호;김성대;최재각
    • Journal of the Institute of Electronics Engineers of Korea SP
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    • v.41 no.3
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    • pp.59-72
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    • 2004
  • In this paper, we classify various attacks that may damage the embedded watermark signal into waveform attack and synchronization attack. And for the specialized defense against the two kinds of attacks we propose a new watermarking scheme named as two layer watermarking method. It consists of a synchronization layer to prepare for the geometrical attack such as rotation and shift and a marking layer 0 embed the watermark signal actually. Namely, the synchronization layer only determines the target region where the watermark signal will be embedded or extracted. And the marking layer spreads the watermark signal over the image as the conventional watermarking methods do. Using the layered structure, the proposed method overcomes the problem that the conventional watermarking methods that do not use the original image at the verification side are most vulnerable to geometrical attacks.

Epitaxial Growth of BSCCO Films by IBS Method (IBS법에 의한 BSCCO 박막의 에피택셜 성장)

  • 양승호;박용필
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2002.05a
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    • pp.627-630
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    • 2002
  • Bi$_2$Sr$_2$CuOx(Bi-2201) thin films were fabricated by atomic layer-by-layer deposition using an ion bean sputtering method. 10 wt% and 90 wt% ozone mired with oxygen were used with ultraviolet light irradiation to assist oxidation. XRD and RHEED investigations revealed that a buffer layer is formed at the early stage of deposition (less than 10 unit cell), and then c-axis oriented Bi-2201 grows on top of it.

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A Method to Determine Optimum Viscoelastic Layer Thickness of Sandwich Plate for Maximum Modal Damping (샌드위치 평판의 모드 감쇠 최대화를 위한 점탄성층 두께 결정법)

  • Nam, Dae-Ho;Shin, Yun-Ho;Kim, Kwang-Joon
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.16 no.7 s.112
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    • pp.690-696
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    • 2006
  • Thickness of damping layer in sandwich plate needs to be optimized in order to make modal loss factor of the sandwich plate maximum. Since previous studies were interested in noise reductions over high frequency range, the modal properties were derived based on simply supported boundaries. This conventional formula is approximately applicable to other boundary conditions over high frequency range only. The purpose of this study is to propose a method to determine optimum damping layer thickness of sandwich plate for maximum modal damping in low frequency range when the boundary condition is not a simple support. The conventional RKU equation based on simply supported boundary is modified to reflect other boundary conditions and the modified RKU equation is subsequently applied to determine the optimum damping layer thickness for arbitrary conditions. In order to reflect frequency-dependent characteristics of elastic modulus of the damping layer, an iteration method is proposed in determining the modal properties. Test results on sandwich plates for optimum damping layer thickness are compared with predictions by the proposed method and conventional method.

Development of Polymeric Layer for Enhancing The Adhesion of Nano-devices Fabricated by The Nanotransfer Molding Method

  • Lee, Gi-Seok;Seong, Myeong-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.634-634
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    • 2013
  • Transfer molding methods have a problem that weak adhesion between nanostructures and substrates. It is important to make various nano scale applications, also the stability of nanostructure on substrate is related with device performance. We studied an effect of poly 4-vinylphenol (PVP) as the polymeric adhesion layer between organic nanowires and a Si substrate when the nanowires are transferred by liquid-bridge-mediated nanotransfer molding method (LB-nTM). Their structural stability was examined by optical microscopy, scanning electron microscopy as multiple transfer molding and washing process. Field-effect transistors were fabricated with organic semiconductor nanowires on a polymeric adhesion layer and their electrical properties showed no significant difference as the one without the adhesion layer. As a result, adhesion layer can be used in the washing process and making multi-layer nano-scale patterns.

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Experiment and simulation analysis on full scale double-layer concrete shell

  • Thanh Quang Khai Lam;Thi My Dung Do
    • Computers and Concrete
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    • v.31 no.1
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    • pp.9-21
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    • 2023
  • The published studies usually used analytical method, numerical methods or experimental method to determine the stress-strain state and displacement of the single-layer or multi-layer curved shell types, but with a small scale model. However, a full scale multi-layer doubly curved concrete shell roof model should be researched. This paper presents the results of the experiment and simulation analysis involving stress-strain state, sliding between layers, the formation and development of the full scale double-layer doubly curved concrete shell roof when this shell begins to crack. The results of the this study have constructed the load-sliding strain relationship; strain diagram; stress diagram in the shell layers; the Nx, Ny membrane force diagram and deflection of shell. Thisresults by experimental method on a full scale model of concrete have clarified the working of multi-layer doubly curved concrete shell roof. The experimental and simulation results are compared with each other and compared with the Sap2000 software.

Analysis of Bi-Superconducting Thin Films Fabricated by Using the Layer by Layer Deposition and Evaporation Deposition Method

  • Yang, Seung-Ho;Cheon, Min-Woo;Lee, Ho-Shik;Park, Yong-Pil
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2007.06a
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    • pp.517-520
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    • 2007
  • The BSCCO thin film fabricated by using the layer by layer deposition method was compared with the BSCCO thin film fabricated by using the evaporation method. Reevaporation in the form of Bi atoms or $Bi_2O_3$molecules easily bring out the deficiency of Bi atoms in thin film due to the long sputtering time of the layer by layer deposition. On the other hand, the respective atom numbers corresponding to BSCCO phase is concurrently supplied on the film surface in the evaporation deposition process and leads to BSCCO phase formation. Also, it is cofirmed that by optimizing the deposition condition, each single phase of the Bi2201 phase and the Bi2212 phase can be fabricated, the sticking coefficient of Bi element is clearly related to the changing of substrate temperature and the formation of the Bi2212 phase.

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A Layer-by-Layer Learning Algorithm using Correlation Coefficient for Multilayer Perceptrons (상관 계수를 이용한 다층퍼셉트론의 계층별 학습)

  • Kwak, Young-Tae
    • Journal of the Korea Society of Computer and Information
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    • v.16 no.8
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    • pp.39-47
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    • 2011
  • Ergezinger's method, one of the layer-by-layer algorithms used for multilyer perceptrons, consists of an output node and can make premature saturations in the output's weight because of using linear least squared method in the output layer. These saturations are obstacles to learning time and covergence. Therefore, this paper expands Ergezinger's method to be able to use an output vector instead of an output node and introduces a learning rate to improve learning time and convergence. The learning rate is a variable rate that reflects the correlation coefficient between new weight and previous weight while updating hidden's weight. To compare the proposed method with Ergezinger's method, we tested iris recognition and nonlinear approximation. It was found that the proposed method showed better results than Ergezinger's method in learning convergence. In the CPU time considering correlation coefficient computation, the proposed method saved about 35% time than the previous method.

EFFECT OF TWO OPAQUING TECHNIQUES ON METAL-CERAMIC BOND STRENGTH (Opaque 도재의 도포 방법이 치과용 합금과 도재간의 결합 강도에 미치는 영향)

  • Jang, Il-Seong;Lee, Sun-Hyung
    • The Journal of Korean Academy of Prosthodontics
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    • v.34 no.3
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    • pp.475-488
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    • 1996
  • The opaque porcelain layer of porcelain-fused-to-metal(PFM) restoration is critical for the success of PFM restoration because it is the first layer placed over the treated alloy. But, the methods of opaquing technique have not been confirmed. Usually, the one layer method and two layer method have been used for the application of opaque porcelain. In the past, alloys with porcelain veneers which have been used successfully have contained various precious metals. Recent increase in the cost of precious metals stimulates considerable interest in nonprecious alloys. Although nickel-chromium alloys and nickel-chromium-beryllium alloys have been widely used, the use of cobalt-chromium alloys would be gradually increased with elimination of any potential risk of nickel-related allergic responses and/or beryllium-related toxic responses. This investigation examined one- and two-layer opaque porcelain applications to determine the effect on the bond strength of titanium added cobalt-chromium metal ceramic alloy. Bond strength of Ceramco II porcelain to titanium added cobalt-chromium alloy(2Dentitan) and gold-platinum-palladium alloy(Degudent H) were evaluated by direct shear bond strength test with Instron universal testing machine. The results were as follows; 1. When the mean shear bond strength of each experimental group were compared in $0.25cm^2$ unit area, the titanium added cobalt-chromium alloy/two layer method exhibited the greatest strength(79.7kg), followed by titanium added cobalt-chromium alloy/one layer method(76.2kg), gold-platinum-palladium alloy/two layer method(71.4kg), gold-platinum-palladium alloy/one layer method(64.2kg). 2. No significant differences in bond strength were recorded between the two opaquing techniques for gold-platinum-palladium alloy and titanium added cobalt-chromium alloy. 3. No significant differences in bond strength were recorded between the gold-platinum-palladium alloy and the titanium added cobalt-chromium alloy.

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Characteristics of Bi-superconducting Thin Films Prepared by Co- and Layer-by-Layer Deposition

  • Yang, Sung-Ho;Park, Yong-Pil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.10a
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    • pp.40-44
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    • 2000
  • $Bi_2Sr_2Ca_nCu_{n+1}O_y$($n{\geq}0$; BSCCO)thin film is fabricated via two different processes using an ion beam sputtering method i.e. co-deposition and layer-by-layer deposition. A single phase of Bi2212 can be fabricated via the co-deposition process. While it cannot be obtained by the layer-by-layer process. Ultra-low growth rate in our ion beam sputtering system brings out the difference in Bi element adsorption between the two processes and results in only 30% adsorption against total incident Bi amount by layer-by-layer deposition, in contrast to enough Bi adsorption by co-deposition.

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Comparison between Bi-superconducting Thin Films Fabricated by Co-Deposition and Layer-by-Layer Deposition

  • Yang, Sung-Ho;Park, Yong-Pil
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.9
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    • pp.796-800
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    • 2000
  • Bi$_2$Sr$_2$Ca$_{n}$Cu$_{n+1}$ O$_{y}$(n$\geq$0; BSCCO) thin film is fabricated via two different processes using an ion beam sputtering method i.e. co-deposition and layer-by-layer deposition. A single phase of Bi2212 can be fabricated via the co-deposition process. While it cannot be obtained by the layer-by-layer process. Ultra-low growth rate in our ion beam sputtering system brings out the difference in Bi element adsorption between the two processes and results in only 30% adsorption against total incident Bi amount by layer-by-layer deposition, in contrast to enough Bi adsorption by co-deposition.on.n.

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