• Information Display
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• v.5 no.1
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• pp.25-30
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• 2004

Poly-Si TFT(Thin Film Transistor) technology are reviewed and discussed. Poly-Si TFTs fabricated on glass using low-temperature process were studied extensively for the application to LCD (Liquid Crystal Display) as well as to OLED(Organic Light Emitting Diode) Display. Currently, one of the application targets of the poly-Si TFT is emphasized on the highly functional SOG(System on Glass). Improvement of device characteristics such as an enhancement of carrier mobility has been studied intensively by enlarging the grain size. Reduction of the voltage and shrinkage of the device size are the trend of AM FPD(Active Matrix Flat Panel Display) as well as of Si LSI, which will arise a peculiar issue of uniformity for the device performance. Some approaches such as nucleation control of the grain seed or lateral grain growth have been tried, so far.

• Applied Microscopy
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• v.47 no.3
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• pp.203-207
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• 2017

A homogeneous $KNbO_3$ (KN) phase was formed by sintering at $1,040^{\circ}C$ for 1 hour, without formation of the $K_2O$-deficient secondary phase even though suffering the minor loss of $K_2O$. KN liquid phase was formed during sintering and abnormal grain growth occurred in this specimen. The detailed microstructural observations on KN during sintering were carried out using high resolution transmission electron microscopy. The ledged structures were found at the KN grain boundary and the abnormal grain growth was performed by the lateral migration of these ledges in the presence of the liquid phase. The liquid pockets were found in the KN grains. They have various external shapes mainly due to the kinetic factors. They have atomically flat interfaces with some ledges with one atomic height. The slight deficient $K_2O$ by evaporation might somewhat reduce the melting point of KN from the reported at $1,058^{\circ}C$. The liquid pockets play an important role in supplying the liquid phase during the abnormal grain growth in the sintering process of KN ceramics.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.315-318
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• 2004

We developed a vapor induced crystallization (VIC) process for the first time to obtain high quality polycrystalline Si films by sublimating the mixture of $AlCl_3$ and $NiCl_2$. The VIC process enhanced the crystallization of amorphous silicon thin films. The LPCVD amorphous silicon thin films were completely crystallized after 5 hours at 480 $^{\circ}C$. It is known that needle-like grains with very small width grow in the Ni-metal induced lateral crystallization. In our new method, the width of grains is larger because the grain can also grow perpendicular to the needle growth direction. Also the interface between the merging grain boundaries was coherent. As the results, a polycrystalline film with superior microstructure has been obtained.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.679-682
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• 2003

We report the suitable SLS (sequential lateral solidification) as a function of laser intensity. Precursor film is changed from 50nm to 100nm and is deposited on glass substrate by PECVD. We can find the suitable SLS length by changing the mask size. In this paper, we present the well-defined grain growth conditions as a function of laser intensity.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.6
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• pp.229-235
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• 2002

This paper presents the fabrication of polycrystalline thin film transistor(TFT) using sequential lateral solidification(SLS) of amorphous silicon. The fabricated SLS TFT showed high Performance suitable for active matrix liquid crystal display(AMLCD). The SLS process involves (1) a complete melting of selected area via irradiation through a patterned mask, and (2) a precisely controlled pulse translation of the sample with respect to the mask over a distance shorter than the super lateral growth(SLG) distance so that lateral growth extended over a number of iterative steps. The SLS experiment was performed with 550$\AA$ a-Si using 308nm XeCl laser having $2\mu\textrm{m}$ width. Irradiated laser energy density is 310mJ/$\textrm{cm}^2$ and pulse duration time was 25ns. The translation distance was 0.6$\mu$m/pulse, 0.8$\mu$m/pulse respectively. As a result, a directly solidified grain was obtained. Thin film transistors (TFTs) were fabricated on the poly-Si film made by SLS process. The characteristics of fabricated SLS p -type poly-Si TFT device with 2$\mu\textrm{m}$ channel width and 2$\mu\textrm{m}$ channel length showed the mobility of 115.5$\textrm{cm}^2$/V.s, the threshold voltage of -1.78V, subthreshold slope of 0.29V/dec, $I_{off}$ current of 7$\times$10$^{-l4}$A at $V_{DS}$ =-0.1V and $I_{on}$ / $I_{off}$ ratio of 2.4$\times$10$^{7}$ at $V_{DS}$ =-0.1V. As a result, SLS TFT showed superior characteristics to conventional poly-Si TFTs with identical geometry.y.y.y.

• Journal of the Korean Solar Energy Society
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• v.21 no.1
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• pp.1-10
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• 2001

Polycrystalline silicon(poly-Si) films are deposited on low temperature glass substrate by Hot-CVD(HWCVD). The structural properties of the poly-Si films are strongly dependent on the temperature$(T_w)$. The films deposited at high $T_w$ of $2000^{\circ}C$ have superior crystalline proper average lateral grain sizes are larger than $1{\mu}m$ and there are no vertical grain boundaries. The sur of the high $T_w$ samples are naturally textured like pyramid shape. These large grain size and text surface are believed to give high current density when applied to solar cells. However, the poly films are structurally porous and contains high defect density, by which high concentration of C and O resulted within the films by air-penetration after removed from chamber.

• Journal of the Korean Ceramic Society
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• v.42 no.9 s.280
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• pp.599-601
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• 2005

The coarsening process of two different $BaTiO_3$ single crystal seeds, one with a (111) double twin and the other without it, was investigated. Due to the presence of Twin Plane Reentrant Edge (TPRE), the coarsening rate of the twinned seed crystal was significantly higher than that without a twin. For the coarsening by the 2-dimensional nucleation and lateral growth, the energy barrier for nucleation at the TPRE was analyzed to be about a half compared with that at the terrace planes.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.59.1-59.1
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• 2010

Aluminum-induced crystallization (AIC) of amorphous silicon (a-Si) is studied with the structure of a glass/Al/$SiO_2$/a-Si, in which the $SiO_2$ layer has micron-sized laser holes in the stack. An oxide layer between aluminum and a-Si thin films plays a significant role in the metal-induced crystallization (MIC) process determining the properties such as grain size and preferential orientation. In our case, the crystallization of a-Si is carried out only through the key hole because the $SiO_2$ layer is substantially thick enough to prevent a-Si from contacting aluminum. The crystal growth is successfully realized toward the only vertical direction, resulting a crystalline silicon grain with a size of $3{\sim}4{\mu}m$ under the hole. Lateral growth seems to be not occurred. For the AIC experiment, the glass/Al/$SiO_2$/a-Si stacks were prepared where an Al layer was deposited on glass substrate by DC sputter, $SiO_2$ and a-Si films by PECVD method, respectively. Prior to the a-Si deposition, a $30{\times}30$ micron-sized hole array with a diameter of $1{\sim}2{\mu}m$ was fabricated utilizing the femtosecond laser pulses to induce the AIC process through the key holes and the prepared workpieces were annealed in a thermal chamber for 2 hours. After heat treatment, the surface morphology, grain size, and crystal orientation of the polycrystalline silicon (pc-Si) film were evaluated by scanning electron microscope, transmission electron microscope, and energy dispersive spectrometer. In conclusion, we observed that the vertical crystal growth was occurred in the case of the crystallization of a-Si with aluminum by the MIC process in a small area. The pc-Si grain grew under the key hole up to a size of $3{\sim}4{\mu}m$ with the workpiece.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1108-1111
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• 2005

We propose an improved laser crystallization method based on a directional lateral growth technique. To assess the feasibility of this technique, we have developed an experimental prototype using a 351 nm XeF excimer laser and special optics to produce a long and extremely sharp, narrow beam without need for a photo type mask pattern. Using this system, we have demonstrated very uniform directional laterally grown poly-Si films without any grain boundary protrusions. We believe this method can meet the high performance and uniformity requirements needed for future TFTs in System On Panel (SOP) and OLED applications, as well as providing high process throughput for mass production.

• Journal of Crop Science and Biotechnology
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• v.10 no.2
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• pp.57-63
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• 2007

Due to the strong influence of nitrogen(N) on plant productivity, a vast amount of N fertilizers is used to maximize crop yield. Over-use of N fertilizers leads to severe pollution of the environment, especially the aquatic ecosystem, as well as reducing farmer's income. Growing of N-efficient cultivars is an important prerequisite for integrated nutrient management strategies in both low- and high-input agriculture. Taking maize as a sample crop, this paper reviews the response of plants to low N stress, the physiological processes which may control N-use efficiency in low-N input conditions, and the genetic and molecular biological aspects of N-use efficiency. Since the harvest index(HI) of modern cultivars is quite high, further improvement of these cultivars to adapt to low N soils should aim to increase their capacity to accumulate N at low N levels. To achieve this goal, establishment and maintenance of a large root system during the growth period may be essential. To reduce the cost of N and carbon for root growth, a strong response of lateral root growth to nitrate-rich patches may be desired. Furthermore, a large proportion of N accumulated in roots at early growth stages should be remobilized for grain growth in the late filling stage to increase N-utilization efficiency. Some QTLs and genes related to maize yield as well as root traits have been identified. However, their significance in improving maize NUE at low N inputs in the field need to be elucidated.