• Journal of the Korea Institute of Building Construction
• /
• v.22 no.2
• /
• pp.171-182
• /
• 2022

The regular assessment of a building is important to understand structural safety and latent risk in the early stages of building life cycle. However, methods of traditional assessment are subjective, atypical, labor-intensive, and time-consuming and as such the reliability of these results has been questioned. This study proposed a method to bring accurate results using a 3D laser scanner and integrate them in Building Information Modeling (BIM) to visualize defective condition. The specific process for this study was as follows: (1) semi-automated data acquisition using 3D laser scanner and python script, (2) scan-to-BIM process, (3) integrating and visualizing defective conditions data using dynamo. The method proposed in this study improved efficiency and productivity in a building assessment through omitting the additional process of measurement and documentation. The visualized 3D model allows building facility managers to make more effective decisions. Ultimately, this is expected to improve the efficiency of building maintenance works.

• Journal of the Korean Association of Geographic Information Studies
• /
• v.24 no.4
• /
• pp.127-135
• /
• 2021

The purpose of this research is to present about a series of processes for 3D model generation from scan data of two types of Korean styled architectures, namely, a pavilion and a house, which were acquired with the terrestrial LiDAR and evaluate a 3D surveying method to document digitally the traditional buildings, cultural properties, archeological sites, etc. Since most ancient buildings and cultural assets which require digital documentation by the terrestrial laser scanner usually need to acquire data from multi-directions. Therefore this paper suggested a process of acquiring and integrating data from mult-stations around the object. Also we presented a way for reconstructing automatically at once both the interior and exterior surfaces of buildings from laser scan data.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.10a
• /
• pp.1295-1298
• /
• 2004

Selective Laser Sintering(SLS) method is one of Rapid Prototyping(RP) technologies. It is used to fabricate desirable part to sinter powder and stack the fabricated layer. To develop this SLS machine, it needs effective scanning path and the development of scanning device. This paper shows how to make fast scanning path with respect to scan spacing, laser beam size and scanning direction from 2-dimensional sliced file generated in commercial CAD/CAM software. Also, we develop the scanning device and its control algorithm to precisely follow the generated scanning path. Scanning path affects precision and total machining time of the final fabricated part. Sintering occurs using infrared laser which has high thermal energy. As a result, shrinkage and curling of the fabricated part occurs according to thermal distribution. Therefore, fast scanning path generation is needed to eliminate the factors of quality deterioration. It highly affects machining efficiency and prevents shrinkage and curling by relatively lessening the thermal distribution of the surface of sintering layer. To generate this fast scanning path, adaptive path generation is needed with respect to the shape of each layer, and not simply x, y scanning, but the scanning of arbitrary direction must be enabled. This paper addresses path generation method to focus on fast scanning, and development of scanning system and control algorithm to precisely follow generated path.

• Journal of the Korean Society for Precision Engineering
• /
• v.29 no.4
• /
• pp.395-408
• /
• 2012

An experimental investigation with 2.8kW Nd:YAG laser system was carried out to study the effects of different laser process parameters on the microstructure and hardness of STD11. The optical lens with the elliptical profile are designed to obtain a wide surface hardening area with uniform hardness. The Laser beam is allowed to scan on the surface of the work piece varying the power (1600, 1800 and 1900kW) and traverse speed (200, 400, 600, 800 and 1000mm/min) at three different F-numbers of lens. After laser surface treatment three zones, In the microstructure have been observed : melted zone(decarburization), heat affected zone(martensite), and the substrate.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.24 no.1
• /
• pp.135-139
• /
• 2015

We present a fine patterning method of conductive lines on polyimide (PI) and glass substrates using silver (Ag) nanoparticles based on laser scanning. Controlled laser irradiation can realize selective sintering of conductive ink without damaging the substrate. Thus, this technique easily creates fine patterns on heat-sensitive substrates such as flexible plastics. The selective laser sintering of Ag nanoparticles was managed by optimizing the conditions for the laser scan velocity (1.0-20 mm/s) and power (10-150 mW) in order to achieve a small gap size, high electrical conductivity, and fine roughness. The fabricated electrodes had a minimum channel length of $5{\mu}m$ and conductivity of $4.2{\times}10^5S/cm$ (bulk Ag has a conductivity of $6.3{\times}10^5S/cm$) on the PI substrate. This method was used to successfully fabricate an organic field effect transistor with a poly(3-hexylthiophene) channel.

• Journal of the Korean Society for Precision Engineering
• /
• v.27 no.10
• /
• pp.14-22
• /
• 2010

The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.

• Journal of Institute of Control, Robotics and Systems
• /
• v.22 no.10
• /
• pp.811-816
• /
• 2016

In light of recently developed 3D printers for rapid prototyping, there is increasing attention on the 3D scanner as a 3D data acquisition system for an existing object. This paper presents a prototypical 3D scanner based on a striped laser light image. In order to solve the problem of shadowy areas, the proposed 3D scanner has two cameras with one laser light source. By using a horizontal rotation table and a rotational arm rotating about the latitudinal axis, the scanner is able to scan in all directions. To remove an additional optical filter for laser light pixel extraction of an image, we have adopted a differential image method with laser light modulation. Experimental results show that the scanner's 3D data acquisition performance exhibited less than 0.2 mm of measurement error. Therefore, this scanner has proven that it is possible to reconstruct an object's 3D surface from point cloud data using a 3D scanner, enabling reproduction of the object using a commercially available 3D printer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1997.11a
• /
• pp.473-476
• /
• 1997

Focused Ar ion laser beam can be utilized to fabricate microstructures on silicon substrate as well as other materials(e.g. such as ceramic). The laser using in this study is an argon ion laser with maximum power of 6 W, wavelength of 514 nm. This laser beam is focused by objectives with a high numerical aperture, a long working distance. We have achieved line width about 1 ${\mu}{\textrm}{m}$ with high scan speed. The resolution for Si machining is determined by the selectivity of the chemical reaction rather than the laser spot size. In this study, we have obtained the maximum etch rate of 434.7 ${\mu}{\textrm}{m}$/sec with high aspect ratio. The characteristics of etched groove was investigated by scanning electron microscope(SEM) and auger electron spectroscopy(AES). It is assumed that the technique using arson ion laser is applicab1e to fabricate microstructures.

• Korean Journal of Construction Engineering and Management
• /
• v.25 no.3
• /
• pp.68-82
• /
• 2024

The planning stage of laser scanning is crucial for acquiring high-quality 3D source data. It involves assessing the target space's environment and formulating an effective measurement strategy. However, existing practices often overlook on-site conditions, with decisions on scanner deployment and scanning locations relying heavily on the operators' experience. This approach has resulted in frequent modifications to scanning locations and diminished 3D data quality. Previous research has explored the selection of optimal scanner locations and conducted preliminary reviews through simulation, but these methods have significant drawbacks. They fail to consider scanner inaccuracies, do not support the use of multiple scanners, rely on less accurate 2D drawings, and require specialized knowledge in 3D modeling and programming. This study introduces an optimization technique for laser scanning planning using 3D simulation to address these issues. By evaluating the accuracy of scan data from various laser scanners and their positioning for scanning a retaining wall structure in a small-scale building, this method aids in refining the laser scanning plan. It enhances the decision-making process for end-users by ensuring data quality and reducing the need for plan adjustments during the planning phase.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2012.05a
• /
• pp.551-552
• /
• 2012