• 대한원격탐사학회:학술대회논문집
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• 대한원격탐사학회 2003년도 Proceedings of ACRS 2003 ISRS
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• pp.1242-1242
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• 2003

• 한국기계가공학회지
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• 제20권2호
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• pp.51-57
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• 2021

The quality of the ceramic sintered coating on a metal surface through laser surface treatment is affected by the laser irradiation pattern. Depending on the laser irradiation pattern, the amount of residual stress and heat applied or accumulated on the surface increases or decreases, affecting the thickness attained in the ceramic sintering area. When the heat energy accumulated in the sintering area is high, the ceramic and the metal alloy melt and sufficiently mix to form a homogeneous and thick bonding interface. In this study, the thermal energy accumulation in the region sintered with zirconia was controlled using four types of laser processing patterns. The thickness of the diffusion region is analyzed by laser-induced breakdown spectroscopy of Mg-ZrO2 generated by laser sintering zirconia powder on the magnesium alloy surface. On the basis of the analysis of the Mg and Zr present in the sintered region through LIBS, the effect of the irradiation pattern on the sintering quality is confirmed by comparing and analyzing the heat and mass transfer tendency of the diffusion layer and the degree of diffusion according to the irradiation pattern. The derived diffusion coefficients differed by up to 9.8 times for each laser scanning pattern.

• 한국정밀공학회지
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• 제32권11호
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• pp.989-995
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• 2015

In the literature, various stochastic anomaly detection methods, such as limit checking and PCA-based approaches, have been applied to weld defect detection. However, it is still a challenge to identify meaningful defect patterns from very limited sensor signals of laser welding, characterized by intermittent, discontinuous, very short, and non-stationary random signals. In order to effectively analyze the physical characteristics of laser weld signals: plasma intensity, weld pool temperature, and back reflection, we first transform the raw data of laser weld signals into the form of event logs. This is done by multidimensional discretization and event-codification, after which the event logs are decoded to extract weld defect patterns by $Na{\ddot{i}}ve$ Bayes classifier. The performance of the proposed method is examined in comparison with the commercial solution of PRECITEC's LWM$^{TM}$ and the most recent PCA-based detection method. The results show higher performance of the proposed method in terms of sensitivity (1.00) and specificity (0.98).

• 반도체디스플레이기술학회지
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• 제18권2호
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• pp.58-62
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• 2019

Diffractive Optical Elements(DOEs) diffracts incident light using the diffraction phenomenon of light to generate a desired diffraction image. In recent years, the use of diffraction optics, which can replace existing refractive optical elements with flat plates, has been increased by implementing various optical functions that could not be implemented in refractive optical devices and by becoming miniaturized and compacted optical elements. Direct laser lithography is typically used to effectively fabrication such a diffractive optical element in a large area with a low process cost. In this study, the process conditions for fabricating patterns of diffractive optical elements in various shapes were found using direct laser lithographic system, and optical performance evaluation was performed through fabrication.

• 한국생산제조학회지
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• 제25권1호
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• pp.36-41
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• 2016

A method is proposed for the improvement of deposition reproducibility in the selective electrodeposition process using laser masking and DC voltage. Selective electrodeposition using laser masking and DC voltage can achieve a deposited layer with micro patterns. However, selective electrodeposition using laser masking and DC voltage have a critical problem: the lack of reproducibility in selective deposition. The reproducibility of selective electrodeposition can be improved by a new process that consists of laser masking, two-step electro-deposition, laser scribing, and ultrasonic cleaning. The experiments in this study show that the reproducibility of selective deposition can be successfully improved by the combination of two-step electrodeposition and laser scribing.

• 한국레이저가공학회지
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• 제3권2호
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• pp.25-33
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• 2000

One of perspective direction of microfabrication is direct laser writing technology that allows to create metal, semiconductive and dielectric micropatterns on substrate surface. In this work, a two step method, the combination of seed forming process, in which metallic Al seed was selectively generated on AlN ceramic substrate by direct writing technique using a pulsed Nd : YAG laser and subsequent electroless Ni plating on the activated Al seed, was presented. The effects of laser parameters such as pulse energy, scanning speed and pulse frequency on shape of Alseed and conductor line after electroless Ni plating were investigated. The nature of the laser activated surface is analyzed from XPS data. The line width of this metallic Al and Ni is analyzed using SEM. As a results, Al seed line with 24㎛ width and 100㎛ isolated line space is obtained. Finally, laser direct writing can be applied in the field between thin and thick film technique in electronic industry.

• 한국레이저가공학회지
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• 제10권2호
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• pp.5-15
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• 2007

A new printing process for LCD color filter is proposed in this work by using the localized laser heating, which is called laser-induced spray printing (LISP) process. The LISP is a non-contact process, which injects the ink from the donor substrate to the glass substrate by the bubble pressure induced by laser heating. The temperature distribution of the donor substrate is calculated numerically to explain the ink ejection phenomena. The composition of the ink was includes the red pigment, n-butanol, xylene, BCA and epoxy. Experiments were conducted by using the fiber laser system, and the color filter patterns were deposited successfully under the proper laser heating conditions.

• Journal of the Optical Society of Korea
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• 제4권1호
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• pp.7-10
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• 2000

The soft x-ray(10nm-100nm) interferometer is a modified Mach-Zehnder type interferometer and it consists of two beam-splitters and four totally reflecting mirrors. The beam-splitters used here are 50% transmission and 50% reflection grating type. The diffraction patterns of beam splitters(1st B.S.) were investigated with a He-Ne laser. The diffraction patterns produced by the soft x-ray interferometer (2nd B.S.) were also investigated in intensities positions. The diffraction patterns of 20 degree grazing incidence on the beam splitters(1st B.S.) show a circular array of spots. Both the reflected and the transmitted beams show the same patterns but symmetric circles on the screen. The maximum intensity appears roughly when n is in the zeroth and odd orders and the suppressed peak(missing order) appears when n is in even orders. Intensities of 3 center fringes(n = 0, $\pm$1) are stronger than others. These results confirm the reduced grating equation and make agree with the intensity distribution function. It was found that the final patterns produced by the soft x-ray interferometer (2nd B.S.) consisted of fine fringes which were caused by two of three diffraction beams that were arrived at the second beam-splitter.

• 대한기계학회논문집A
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• 제36권10호
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• pp.1213-1219
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• 2012

원격 $CO_2$ 레이저는 렌즈와 거울을 사용하여 신속하게 레이저 빔을 편향시키므로 복잡한 패턴을 그리기 쉽다. 기존 점용접 시편과 원격 $CO_2$ 레이저 여러 가지 용접선 패턴 시편을 준비하여 정적인장시험과 동적피로시험을 수행하였다. 피로수명(피로파단까지 하중반복횟수)에 대한 피로강도(최대피로하중) 데이터를 얻었다. 수명 이백만 회일 때 피로강도는 대체로 정적 인장강도의 10%이었다. 그리고, 피로하중 수준에 따라 피로파괴형태가 달라지는 것을 발견하였다. 구조해석 결과 응력이 높은 부위와 피로균열 발생부위가 일치하는 것으로 확인되었다. 수명 이백만 회일 때 모든 용접선 패턴에 대하여 최대응력이 서로 비슷하여지는 것을 확인하였다.

• Design & Manufacturing
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• 제15권4호
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• pp.65-71
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• 2021

In the early days of laser invention, it was simply used as a measuring tool, but as lasers became more common, they became an indispensable processing tool in the industry. Short-wavelength lasers are used to make patterns on wafers used in semiconductors depending on the wavelength, such as CO2 laser, YAG laser, green laser, and UV laser. At first, the hole of the PCB board mainly used for electronic parts was not thin and the hole size was large, so a mechanical drill was used. However, in order to realize product miniaturization and high integration, small hole processing lasers have become essential, and pattern exposure for small hole sizes has become essential. This paper intends to analyze the characteristics through patterns by exposing the PCB substrate through DMD and polygon scanner, which are different optical systems. Since the optical systems are different, the size of the patterns was made the same, and exposure was performed under the optimal conditions for each system. Pattern characteristics were analyzed through a 3D profiler. As a result of the analysis, there was no significant difference in line width between the two systems. However, it was confirmed that dmd had better pattern precision and polygon scanner had better productivity.