• 융복합기술연구소 논문집
• /
• 제3권2호
• /
• pp.39-43
• /
• 2013

Titanium has been used to satisfy various applications such as bio engineering, aerospace, electronics, automobile. Recently, micro fabrication technologies of metals such as titanium have been required to satisfy many conditions in various fields. To satisfy these demands, micro electrochemical process using laser marking can be an alternative method because it is one of the precision machining and efficient process. Micro electrochemical process using laser marking needs to accomplish form of the oxidized recast layer on metal surface by laser marking. The laser beam marking conditions such as average power, pulse repetition rate and marking speed should be properly selected to form oxidized recast layer. So, the characteristics of titanium surface according to laser marking conditions was investigated through SEM(scanning electron microscope), EDS(energy dispersive spectrometer) and surface roughness analysis.

• Journal of Welding and Joining
• /
• 제12권2호
• /
• pp.20-27
• /
• 1994

The laser marking system is widely used in many industrial manufacturing companies as an effective process, because it is versitile, clean, and fast to run. Minimal heat deformation and zero tool wear can be obtained using fast and non-contact process of laser marking. As an introductory level, the basic knowledges about laser marking system layout and its components are presented with diagrams. The effects, requirements, and application example of laser marking process are also described in this paper.

• 마이크로전자및패키징학회지
• /
• 제29권2호
• /
• pp.65-71
• /
• 2022

Mobile PKG Trend는 소형화와 더불어 고용량 제품 요구로 인해 Mold Top Margin 감소가 불가피한 상황이다. 하지만 기존 Laser Marking 공법은 Depth가 깊어 Narrow Top Margin 제품에 적용할 때 중첩 가공에 의한 PKG 강도 저하가 예상되며, Chip Damage와 같은 품질 불량으로 신뢰성이 저하되는 문제점이 있다. 따라서 본 연구에서는 Laser Source 특징 비교를 통해 Narrow Top Margin 제품에 대응할 수 있는 Low Depth Laser Marking 기술을 확보하였으며, PKG 개발 제품에 해당 기술을 적용하여 평가한 결과 Marking Depth 67% 감소와 PKG 강도 12%가 향상됨을 검증하였다. 또한 PKG Mechanical 분석을 통해 발생 가능한 Laser Damage 품질 검증을 진행하였고, Chip Damage(Crack/Chipping) 불량은 발견되지 않았다. 이를 통해 양산 적용 품질 안정성을 확보하였다.

• 한국기계가공학회지
• /
• 제9권5호
• /
• pp.70-75
• /
• 2010

In this paper, laser marking systems dedicated to cylinderical parts was developed. We first develop the marking device which consists of Nd-Yag laser, galvano scanner and additional rotational axis, then develop algorithm for supporting the digital image with bmp data format. Additional rotational axis is so attached as to rotate the cylinderical parts for marking its whole surface. The image is separated into line by line and the separated line image is sent to galvano scanner while rotating the additional axis simultaneously. CxImage library, famous open source code, is employed for the image processing. The developed method was tested with various images and shows that it reduces marking time significantly without reducing marking quality.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 1986년도 한국자동제어학술회의논문집; 한국과학기술대학, 충남; 17-18 Oct. 1986
• /
• pp.145-148
• /
• 1986

To perform the marking on metal with high speed and non-contact using the laser beam of high energy, laser marking system is designed and fabricated applying the galvanometer scanner capable of high speed-precise beam positioning controlled by microprocessor. Laser is a Q-switched Nd:YAG producing multi-mode, wavelength, 1060nm. Optical system is composed of beam expander, scanning mirror and flat field lens. Consequently, the laser marking is satisfactorily achieved regardless of kinds of metal.

• 대한임베디드공학회논문지
• /
• 제11권5호
• /
• pp.313-323
• /
• 2016

With the development of autonomous vehicle, there has been active research on advanced driver assistance system for road marking detection using vision sensor and 3D Laser scanner. However, vision sensor has the weak points that detection is difficult in situations involving severe illumination variance, such as at night, inside a tunnel or in a shaded area; and that processing time is long because of a large amount of data from both vision sensor and 3D Laser scanner. Accordingly, this paper proposes a road marking detection and classification method using single 2D Laser scanner. This method road marking detection and classification based on accumulation distance data and intensity data acquired through 2D Laser scanner. Experiments using a real autonomous vehicle in a real environment showed that calculation time decreased in comparison with 3D Laser scanner-based method, thus demonstrating the possibility of road marking type classification using single 2D Laser scanner.

• 한국정밀공학회지
• /
• 제22권7호
• /
• pp.27-37
• /
• 2005

Direct writing technology on the silicon wafer surface is used to reduce the size of the chip as the miniature trend in electronic circuit. In order to improve the productivity and efficiency, the real time quality estimation is very important in each semiconductor process. In laser marking, marking quality is determined by readability which is dependant on the contrast of surface, the line width, and the melting depth. Many researchers have tried to find theoretical and numerical estimation models fur groove geometry. However, these models are limited to be applied to the real system. In this study, the estimation system for the line width during the laser marking was proposed by process monitoring method. The light intensity emitted by plasma which is produced when irradiating the laser to the silicon wafer was measured using the optical sensor. Because the laser marking is too fast to measure with external sensor, we build up the coaxial monitoring system. Analysis for the correlation between the acquired signals and the line width according to the change of laser power was carried out. Also, we developed the models enabling the estimation of line width of the laser marking through the statistical regression models and may see that their estimating performances were excellent.

• International Journal of Quality Innovation
• /
• 제8권1호
• /
• pp.137-153
• /
• 2007

Failure mode and effects analysis (FMEA) is a preventive technique in reliability management field. The successful implementation of FMEA technique can avoid or reduce the probability of system failure and achieve good product quality. The FMEA technique had applied in vest scopes which include aerospace, automatic, electronic, mechanic and service industry. The marking process is one of the back ends testing process that is the final process in semiconductor process. The marking process failure can cause bad final product quality and return although is not a primary process. So, how to improve the quality of marking process is one of important production job for semiconductor testing factory. This research firstly implements FMEA technique in laser marking process improvement on semiconductor testing factory and finds out which subsystem has priority failure risk. Secondly, a CCD position solution for priority failure risk subsystem is provided and evaluated. According analysis result, FMEA and CCD position implementation solution for laser marking process improvement can increase yield rate and reduce production cost. Implementation method of this research can provide semiconductor testing factory for reference in laser marking process improvement.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2002년도 추계학술대회 논문집
• /
• pp.147-150
• /
• 2002

A light guide panel is an element of the LCD backlight module that is often used for the display of compact electronic devices. In this study, a laser marking system is proposed to fabricate light guide panel, which can be replaced of other manufacturing methods such as silk printing, stamping, and v-cutting methods. The objectives of this research are the establishment of laser marking system, evaluation of laser marking parameters, understanding marking process, application to PMMA, reliability test and quality inspection. A 50W $CO_2$ laser (CW) was used to perform different experiments in which, the influence of some processing parameters (average power, scanning speed) on the geometry and quality of groove pattern was studied. The width of the etched grooves increases with increasing a laser power and decreasing a scan speed. In order to analyze surface characteristics and optical properties (luminance, uniformity), SEM photography and BM7 (luminance measuring system) were used. As a result, the optimal conditions of the process parameters were determined.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2009년도 추계학술대회 논문집
• /
• pp.25-26
• /
• 2009