• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.63-68
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• 2014

For a nanoscale Cu/low-k wafer, inter-layer dielectric (ILD) and metal layers peelings, cracks, chipping, and delamination are the most common dicing defects by traditional diamond blade saw process. Sidewall void in sawing street is one of the key factors to bring about cracks and chipping. The aim of this research is to evaluate laser grooving & mechanical sawing parameters to eliminate sidewall void and avoid top-side chipping as well as peeling. An ultra-fast pico-second (ps) laser is applied to groove/singulate the 28-nanometer node wafer with Cu/low-k dielectric. A series of comprehensive parametric study on the recipes of input laser power, repetition rate, grooving speed, defocus amount and street index has been conducted to improve the quality of dicing process. The effects of the laser kerf geometry, grooving edge quality and defects are evaluated by using scanning electron microscopy (SEM) and focused ion beam (FIB). Experimental results have shown that the laser grooving technique is capable to improve the quality and yield issues on Cu/low-k wafer dicing process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.185-186
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.375-376
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• 2008

• Journal of Welding and Joining
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• v.23 no.2
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• pp.81-89
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• 2005

A numerical model for multiple reflection effects of a polarized beam on laser grooving has been developed. The surface of the treated material is assumed to reflect laser irradiation in a fully specular fashion. Combining electromagnetic wave theory with Fresnel's relation, the reflective behavior of a groove surface can be obtained as well as the change of the polarization status in the reflected wave field. The material surface is divided into a number of rectangular patches using a bicubic surface representation method. The net radiative flux far these patch elements is obtained by standard ray tracing methods. The changing state of polarization of the electric field after reflection was included in the ray tracing method. The resulting radiative flux is combined with a set of three-dimensional conduction equations governing conduction losses into the medium, and the resulting groove shape and depth are found through iterative procedures. It is observed that reflections of a polarized beam play an important role not only in increasing the material removal rate but also in forming different final groove shapes. Comparison with available experimental results for silicon nitride shows good agreement for the qualitative trends of the dependence of groove shapes on the electric field vector orientation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1179-1180
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• 2005

3D micro scaled shapes are fabricated with the method of direct writing and superposing grooving in ambient air using femto-second laser pulses and copper, aiming at establishing an industrially useful femto-second laser processing machine to be able to fabricate three dimensional micro-scale structures, especially micro scaled molds, and processing techniques. For the several advantages, there is no thermally influenced region around the area irradiated by the laser beam and surfaces irradiated laser beam are smooth and substances ablated to form are no attached on the surface of works and so on, the femto-second laser technology is anticipated for advanced micro/nano precision technology.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.366-370
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• 1997

This paper descibes a micro groove machining process on the polyurethane biopolymer by KrF excimer laser. To investigate the etch charcteristics of polyurethane biopolymer quantitatively,laser system for ablation was installed with high precison moter and then polymer ablation experiment, in which paramteters were fluence,pulse repetition rate,numbers of pulses and assist gas, was carred out. In this experiment, we found out that the value of critical energy density for ablation is 30mJ/cmsup2/ and the etching rate is more dependent on the pulse number and fluence than any other pamameter. Finally, we machined micro grooves for fiexibility as width 300.mu.m depth 100.mu.m and port for micro-devices mounting as length 100.mu.m width 300.mu.m depth .mu.m on the outer wallof polyurethane biopolymer tube which is used as medical device.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.292-292
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• 2000

Since high-power CO$_2$ Laser can be make a high densed energy to Local processing area, manufacturing processes using the laser can be processed for very Localized areas at a very fast rate with minimal or no distortion. Accordingly, the laser has been widely used in the fields of thermal manufacturing processes such as welding, fusion cutting, grooving, and heat treatment of metals. In particular, interest in the laser heat treatment process has grown tremendously in the past few years. In this process, maintaining the uniform hardening depth is important problem to obtain good quality products and to reduce heat induced distortion and residual stress. For achieving this objective, we introduced a new design technique of a fuzzy logic controller that greatly simplified the design procedure by defining several simplified design parameters. In the design procedure, the major design parameters of the controller are characterized by identifying several common aspects. From a series of simulation results, we found that the proposed design technique can be effectively used to design of a fuzzy logic controller for the LASER surface hardening process.

• Tribology and Lubricants
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• v.35 no.5
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• pp.294-299
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• 2019

Most previous studies on water repellent surfaces using lasers rely on the use of pico- or femtosecond lasers. However, in industrial application, these methods have the disadvantages of high cost and low efficiency. In this study, we implement a hydrophobic surface using a high-power general-purpose diode laser. We have fabricated the microsurface using laser groove processing technology, and we present the correlation of wettability characteristics with space and width. The metal material is stainless steel (SUS 304), and the groove height during laser processing is set to $30{\mu}m$ to evaluate the wettability based on the gap and width of various grooves. Results show that the contact angle of the groove-shaped surface is increased by $40^{\circ}$ or more as compared with the surface without patterning, and the contact angle in the parallel direction is greater than that in the perpendicular direction. Results from contact angle hysteresis measurement experiments show that the groove width has a greater influence on the contact angle history than does the gap between grooves. In addition, the coating reveals that the contact angle can be increased using a chemical method and that the laser grooving process can further improve the wetting properties of the surface.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.3
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• pp.56-61
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• 2010

Recently, UV pulse laser is widely used in micro machining of the research, development and industry field of IT, NT and BT products because the laser short wavelength provides not only micro drilling, micro cutting and micro grooving which has a very fine line width, but also high absorption coefficient which allows a lot of type of materials to be machined more easily. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, the commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computitional simulation of the UV laser micro machining behavior for thin copper material in this paper. A finite element model considering high strain rate effect is especially suggested to investigate the micro phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. From these computational results, some of dynamic deformation behaviors such as dent deformation shapes, strains and stresses distributions were observed and compared with previous experimental works. These will help us to understand micro interaction between UV laser beam and material.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.62-67
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• 2012

Recently UV laser is widely used to process micro parts using various materials such as polymers, metals and ceramics because it has a very high intensity at the focused spot area. It is generally known that there are still some difficulties for alumina($Al_2O_3$) ceramics to directly make micro patterns like holes and lines on the surface of working material using 355nm UV laser because the alumina has a very low absorption coefficient at that wavelength. But nowadays new alumna with nano-porous holes is developed and applied to advanced micro functional parts of IT, BT and BT industries. In this paper, we are going to show the mechanism of photo-thermal ablation for nano-porous ceramics. Inside hole there is a lot of multiple reflections along the depth of hole. Experimentally we can find the micro hole drilling and micro grooving on the surface of nano-porous alumina.