• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.364-364
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• 2009

The solar cell is in the spotlight as a future green energy source. In the solar cells based on silicon wafer, the improvement of efficiency is one of crucial issues. One of techniques for high efficiency is texturing on the surface of solar cells. We studied the laser texturing on the surface of multi-crystalline silicon solar cells. The laser texturing followed by chemical etching is adequate for the multi-crystalline structure which have random crystallographic directions. We used the fiber laser for texturing and the SiNx as a masking layer for etching process. We investigated the shapes of holes for texturing in the various laser power conditions and analyzed the holes after removal of thermal damages caused by laser ablation through a 3D profiler.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.10a
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• pp.186-189
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• 2001

The main method in micro-etching process, used in manufacturing semiconductors, electronic components, circuits, is Photo Masking method that exposes and develops on the photo-sensitivity solutions or films. This method enables one to process highly precisely, $\pm$0.03 mm in end line location area. But this has limits in a high speed / wide width process, difficulties in endless masking, and the problem of high price. We have developed the direct masking method to make use of Gravure printing, widely used in grocery packing sheet printing. We made cylinder tools to influence the masking quality by laser stream process. We have confirmed that the end line location accuracy in the line width of the product is improved from 0.12 mm to $\pm$0.07 mm level, after etching process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.219-222
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• 2003

Self-Assembled Monolayers(SAMs) by alkanethiol adsorption to thin metal film are widely being investigated for applications as coating layer for anti-stiction or friction reduction and in fabrication of micro structure of molecular and bio molecular. Recently, there have been many researches on micro patterning using the advantages of very thin thickness and etching resistance in selective etching of thin metal film of Self- Assembled Monolayers. In this report, we present the micromachining thin metal film by Mask-Less laser patterning of alknanethiolate Self-Assembled Monolayers.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.217-221
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• 2004

[ $CO_2$ ]laser ablation rates for bulk 4H-SiC substrates and GaN/AIN/SiC templates in the range 229-870 ${\mu}m.min^{-1}$ were obtained for pulse energies of 7.5-30 mJ over diameters of 50·500 ${\mu}m$ with a Q-switched pulse width of ${\sim}30$ nsec and a pulse frequency of 8 Hz. The laser drilling produces much higher etch rates than conventional dry plasma etching (0.2 - 1.3 ${\mu}m/min$) making this an attractive maskless option for creating through-wafer via holes in SiC or GaN/AlN/SiC templates for power metal-semiconductor field effect transistor applications. The via entry can be tapered to facilitate subsequent metallization by control of the laser power and the total residual surface contamination can be minimized in a similar fashion and with a high gas throughput to avoid redeposition. The sidewall roughness is also comparable or better than conventional via holes created by plasma etching.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.2
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• pp.38-43
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• 2019

Electrochemical etching is a popular process to apply metal patterning in various industries. In this study, the electrochemical etching using a patterned copper layer was proposed to fabricate multilayered structures. The process consists of electrodeposition, laser patterning, and electrochemical etching, and a repetition of this process enables the production of multilayered structures. In the fabrication of a multilayered structure, an etch factor that reflects the etched depth and pattern size should be considered. Hence, the etch factor in the electrochemical etching process using the copper layer was calculated. After the repetition process of electrochemical etching using copper layers, the surface characteristics of the workpiece were analyzed by EDS analysis and surface profilometer. As a result, multilayered structures with various shapes were successfully fabricated via electrochemical etching using copper layers.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.160-163
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• 2002

Micro via hole Fabrication is studied by means of minimizing method to circuit size as many electric products developed to portable and minimize. Most of currently micro via hole fabrication using laser is that fabricate insulator layer using CO2 Laser after Cu layer by etching, or fabricate insulator layer using IR after trepanning Cu by UV. In this paper, it was performed that a metal layer and insulator layer were worked upon only one UV laser, and increase to processing speed by experiment.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.151-152
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• 2013

• Korean Journal of Optics and Photonics
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• v.17 no.5
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• pp.437-446
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• 2006

A fabrication method fur high-aspect-ratio microchannels in stainless steel using laser-assisted thermochemical wet etching is reported in this paper. The fabrication of deep microchannels with an aspect ratio over ten is realized by applying a multiple etching process with an optimization of process conditions. The cross-sectional profile of the microchannels can be adjusted between rectangular and triangular shapes by properly controlling laser power and etchant concentration. Excellent dimensional uniformity is achieved among the channels with little heat-affected area. Microchannels with a width ranging from 15 to $50{\mu}m$ can be fabricated with an aspect ratio of ten and a pitch of 150 m or smaller. The effects of process variables such as laser power, scan speed, and etchant concentration on the fabrication results, including etch width, depth, and cross-sectional profile are closely examined.

• Journal of the korean academy of Pediatric Dentistry
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• v.30 no.1
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• pp.41-46
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• 2003

In order to evaluate the sufficient etching time for successful bonding and also minimizing unnecessary mineral loss, the enamel surface roughness analysis was performed using confocal laser scanning microscopy. Sixty extracted sound human molar teeth were imbedded in the center of acrylic cylinder using self-curing clear resin exposing buccal surface, and then polished with series of SiC paper(220, 500, 800, 1000, 2000, 4000 grit). Each specimen was randomly assigned to six groups(N=10). 37% phosphoric acid was applied to the polished tooth surface for 10, 20, 30, 40, 50, 60 seconds respectively and washed with copious water. After the surface roughness analysis, five roughness parameters(Sa, Sq, Sz, Sdr, Ra) were statistically analysed by ANOVA and Duncan post hoc test. We found that the all five parameters had higher roughness value in 30 seconds etching time, especially parameter Sz showed the lowest value in 10 seconds etching time and the highest value in 30 seconds etching time compared with the other etching times(p<0.05).

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1425-1427
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• 1994

Laser ablation of glass substrates (8K-7 and synthetic quartz) using a transversely excited atmospheric (TEA) $CO_2$ laser has been inverstigated to obtain high speed etching. The ablation occurs by local heating of a substrate with a focused TEA-$CO_2$ laser beam. The dependence of ablation rate on pulse count and repetition-rate of laser has been discussed.