Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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Micro-Processing of Glass Substrates Using a Laser

레이저를 이용한 유리기판의 미세가공(微細加工)

  • 이천 (인하대학교 전기공학과) ;
  • 풍전호일 (이화학연구소 레이저과학그룹)
  • Published : 1994.07.21
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Abstract

Laser ablation of glass substrates (8K-7 and synthetic quartz) using a transversely excited atmospheric (TEA) $CO_2$ laser has been inverstigated to obtain high speed etching. The ablation occurs by local heating of a substrate with a focused TEA-$CO_2$ laser beam. The dependence of ablation rate on pulse count and repetition-rate of laser has been discussed.

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