• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.1
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• pp.117-123
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• 1998

We investigated the effect of mechanical backside damage in Czochralski grown silicon wafer. The intensity of mechanical damage was evaluated by minority carrier recombination lifetime by laser excitation/microwave reflection photoconductivity decay method, photo-acoustic displacement method, X-ray section topography, and wet oxidation/preferential etching methods. The data indicate that the higher the mechanical damage intensity, the lower the minority carrier lifetime, and the photo-acoustic displacement values increased proportionally, and it was at Grade 1: Grade 2:Grade 3 = 1:19.6:41 that the normalized relative quantization ratio of excess photo-acoustic displacement in damaged wafer was calculated, which are normalized to the excess PAD from sample Grade 1.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.4
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• pp.581-586
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• 1998

We investigated the effect of mechanical back side damage in Czochralski grown silicon wafer. The intensity of mechanical damage was evaluated by minority carrier recombination lifetime by laser excitation/microwave reflection photoconductivity decay method, degree of X-ray diffuse scattering, X-ray section topography, and wet oxidation/preferential etching methods. The data indicate that the higher the mechanical damage intensity, the lower the minority carrier lifetime, and the magnitude of diffuse scattering and X-ray excess intensity increased proportionally, and it was at Grade 1:Grade 2:Grade 3=1:7:18.4 that the normalized relative quantization ratio of excess intensity in damaged wafer was calculated, which are normalized to the excess intensity from sample Grade 1.

• Korean Journal of Materials Research
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• v.5 no.4
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• pp.397-404
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• 1995

반도체 세정공정에서 염기성 세정액(SCI, Standard cleaning 1, $NH_{4}$OH + $H_{2}$O_{2}$ + $H_{2}$O)은 공정상 발생되는 여러 오염물 중 파티클의 제거를 위해 널리 사용되고 있는데, SCI 조성중 $NH_{4}$OH양에 따라 세정 중 실리콘의 식각속도를 증가시킨다. 이 연구에서는 SCI 세정이 CZ(Czochralski)와 에피 실리콘 기판 표면에 미치는 영향을 단순세정과 연속적인 산화-HF 식각-SCI 세정공정을 통해 관찰되었다. CZ와 에피 기판을 8$0^{\circ}C$의 1 : 2 : 10과 1 : 1 : 5 SCI 용액에서 60분까지 단순 세정을 했을 때 laser particle scanner와 KLA사의 웨이퍼 검색장치로 측정된 결함의 수는 세정시간에 따라 변화를 보이지 않았다. 그러나 CZ와 에피 기판을 10분간 SCI 세정후 90$0^{\circ}C$에서 산화 HF식각공정을 4번까지 반복하였을 때 에피 기판 표면의 결함수는 감소하는 반면에 CZ기판에서는 직선적으로 증가하였다. 반복적인 산화-HF 식각-XCI 세정공정을 통해 생성된 CZ기판 표면의 결함은 크기가 0.7$\mu$m 이하의 pit과 같은 형상을 보여주었다. 이들 결함은 열처리 중 CZ 기판내와 표면에 산화 석출물들이 형성, 반복적인 HF 식각-SCI 세정공정을 통해 다른 부위에 비해 식각이 빨리 일어나 표면에 생성되는 것으로 여기어 진다.

• Transactions of Materials Processing
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• v.20 no.1
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• pp.17-22
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• 2011

Recently, analyzing system is studying for applying to biomedical engineering field, actively. Micro fluidics control system has been manufactured using LIGA (Lithographie Galvanoformung und Abformung), Etching, Lithography and Laser etc. However, it is difficult that above-mentioned methods are applied to fabrication of precision mold master efficiently because of long processing time and rising cost of equipments. Therefore, in this study, micro EDM and micro WEDG system were developed to analyze machining characteristics with tool wear, surface roughness and process time. Then, optimal machining conditions could be obtained from the results of analysis. As the results, mold master of staggered herringbone mixer which has a high mixing efficiency, one of passive mixer of Lab-on-a-chip, could be fabricated from micro pattern(< 50um) using micro EDM successfully.

• Transactions of Materials Processing
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• v.13 no.3
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• pp.253-261
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• 2004

The machining technology for the brittle materials such as ceramics are applied to the fields of MEMS(micro electromechanical system) by the progress of new machining technologies such as Etching, Diamond machining, Micro drilling, EDM(Electro discharge machining), ECDM(Electro discharge machining), USM(Ultrasonic machining), LBM(Laser beam machining), EBM(Electron beam machining). Especially, the USM technology can be applied to the dieletric brittle materials such as silicon, borosilicate glass, silicon nitride, quartz and ceramics with high aspect ratio. The micro machining system with machining force controlled position servo is developed in this paper and the optimized ultrasonic machining algorithm is constructed by the force controlled position servo control. The load cell is adapted in the force measuring and the servo control algorithm, suit for the ultrasonic machining characteristics, is estabilished with using the PID auto-tunning functions at the PMAC system which is generally adapted in the field of robot industries. The precision force signal amplifier is constructed with high precision operational amplifier AD524. The vacuum adsorption chuck which is made of titanum and internal flow line is engraved, is used in the workpiece fixing. The mahining results by USM shows that there are some deviation between the force command and the actual machining force that the servo control algorithm should be applied in the machining procedures. Therefore, the constant force controlled position servo system is developed for the micro USM system and by the examination machining process in USM, the stable USM system is realized by tracking the average value of machining force.

• 한국초전도학회:학술대회논문집
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• v.9
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• pp.91-94
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• 1999

A new type of high-T$_c$ superconducting Josephson junctions has been prepared by Ar ion beam etching and electron beam lithography. YBa$_2Cu_3O_{7-x}$ (YBCO) films deposited on (001) SrTiO$_3$ single crystal substrate by pulsed laser deposition were patterned by Ar ion milling with photolithography. The narrow slit with a electroresist mask, about 1000 ${\AA}$ wide, was constructed over a 3 ${\sim}$ 5 ${\mu}$m bridge of a 1200-${\AA}$-thick YBCO film by electron beam lithography. The slit was then etched by the Ar ion beam to form a damaged 600-${\AA}$-thick YBCO. Thus prepared structure forms an S-N-S (YBCO - damaged YBCO - YBCO) type Josephson junctions. Those junctions exhibit RSI-like I-V characteristics at 77 K. The properties of the Josephson junctions such as I$_c$ R$_N$, and J$_c$ were characterized.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1999.06a
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• pp.115-127
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• 1999

The charged clusters or particles, which contain hundreds to thousands of atoms or even more, are suggested to form in the gas phase in the thin film processes such as CVD, thermal evaporation, laser ablation, and flame deposition. All of these processes are also used in the gas phase synthesis of the nanoparticles. Ion-induced or photo-induced nucleation is the main mechanism for the formation of these nanoclusters or nanoparticles inthe gas phase. Charged clusters can make a dense film because of its self-organizing characteristics while neutral ones make a porous skeletal structure because of its Brownian coagulation. The charged cluster model can successfully explain the unusual phenomenon of simultaneous deposition and etching taking place in diamond and silicon CVD processes. It also provides a new interpretation on the selective deposition on a conducting material in the CVDd process. The epitaxial sticking of the charged clusters on the growing surface is gettign difficult as the cluster size increases, resulting in the nanostructure such as cauliflowr or granular structures.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.5
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• pp.15-21
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• 2015

The glass used for Mobile Camera Window is required to have high strength. Cell type manufacturing by means of CNC is widely used for camera window. Individual loading and unloading is needed for each process, such as painting and PVD, in cell type manufacturing. The purpose of this study is to search the enhanced manufacturing process with sheet type throughout bulk unit production in painting and PVD. This study includes sheet type manufacturing processes such as laser cutting, wet etching, 2nd tempering, printing, and AF/AR coating.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.5
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• pp.16-22
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• 2013

A two-dimensional photonic crystal structure was investigated using a roll-to-roll nanoreplication and physical vapor deposition processes for the inexpensive enhanced fluorescence substrate which is not sensitive to the polarization directions of excitation light source. An 8 inch silicon master having nano dot array with a diameter of 200 nm, a height of 100 nm and a pitch of 400 nm was prepared by KrF laser scanning lithography and reactive ion etching processes. A flexible polymer mold was fabricated by flat type UV replication process and a deposition of 10 nm nickel layer as an anti-adhesion layer. A roll mold was prepared by warping the flexible polymer mold on an aluminum roll base and a roll-to-roll UV replication process was carried out using the roll mold. After the deposition of ~ 100 nm $TiO_2$ layer on the replicated nano dot array, a 2 dimensional photonic crystal structure was realized with a resonance wavelength of 635 nm for both p- and s-polarized light sources.

• Transactions of Materials Processing
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• v.17 no.5
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• pp.322-327
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• 2008

LGP is a key component of LCD back light unit because it determines brightness and sharpness of the display image. Usually, it has optical patterns fabricated on the bottom surface. These optical patterns convert point or line sources placed in the side of LGP to plane source at the top surface by changing the propagating direction of the incident light. In the present paper the LiGA-reflow method was applied to fabricate the LGP mold. Furthermore, the optical simulation considering the replication ratio of pattern height was applied to the pattern design. The optical simulation through systematic correction scheme was adopted to find the optimum distribution of pattern density. Finally, the stamper fabricated by this method was installed in the mold and LGP was produced by injection molding. As a result of luminance measurement for the final product, the average luminance and luminance uniformity was measured 3,180 nit and 84%, respectively. Consequently, the mold fabrication method using the LiGA-reflow and optical simulation(CAE) can save the expense and time compared with the existing fabrication methods(laser ablation and chemical etching).